Texas Instruments - TCI6630K2LXCMS2

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TCI6630K2LXCMS2 by Texas Instruments

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Manufacturer Texas Instruments
Manufacturer's Part Number TCI6630K2LXCMS2
Description MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;
Datasheet TCI6630K2LXCMS2 Datasheet
In Stock344
NAME DESCRIPTION
Minimum Supply Voltage: .902 V
Other Names: 296-TCI6630K2LXCMS2
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Nominal Supply Voltage: .95 V
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Supply Voltage: .997 V
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
JESD-609 Code: e1
No. of Terminals: 900
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: S-PBGA-B900
Package Shape: SQUARE
Terminal Form: BALL
Peak Reflow Temperature (C): 245
Package Code: BGA
Moisture Sensitivity Level (MSL): 4
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