Freescale Semiconductor - MCIMX6S5EVM10AB

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MCIMX6S5EVM10AB by Freescale Semiconductor

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Manufacturer Freescale Semiconductor
Manufacturer's Part Number MCIMX6S5EVM10AB
Description SoC; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE; Qualification: Not Qualified;
Datasheet MCIMX6S5EVM10AB Datasheet
In Stock348
NAME DESCRIPTION
Minimum Supply Voltage: 1.35 V
Package Body Material: PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Seated Height: 1.5 mm
Sub-Category: Graphics Processors
Surface Mount: YES
Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)
No. of Terminals: 624
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: S-PBGA-B624
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 105 Cel
Package Code: LFBGA
Width: 21 mm
Moisture Sensitivity Level (MSL): 3
Peripheral IC Type: SoC
Maximum Supply Voltage: 1.5 V
JESD-609 Code: e1
Minimum Operating Temperature: -20 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA624,25X25,32
Length: 21 mm
Peak Reflow Temperature (C): 260
Terminal Pitch: .8 mm
Power Supplies (V): 1.05/1.5
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