
Image shown is a representation only.
Manufacturer | Analog Devices |
---|---|
Manufacturer's Part Number | ADSP-21583BBCZ-4A |
Description | MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 349; Package Code: LFBGA; Package Shape: SQUARE; |
Datasheet | ADSP-21583BBCZ-4A Datasheet |
In Stock | 625 |
NAME | DESCRIPTION |
---|---|
Minimum Supply Voltage: | 1.05 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 1.1 V |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Seated Height: | 1.5 mm |
Surface Mount: | YES |
Terminal Finish: | TIN SILVER COPPER |
No. of Terminals: | 349 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B349 |
Maximum Clock Frequency: | 500 MHz |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Package Code: | LFBGA |
Width: | 19 mm |
Moisture Sensitivity Level (MSL): | 3 |
Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
Maximum Supply Voltage: | 1.15 V |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | -40 Cel |
Package Equivalence Code: | BGA529,23X23,32 |
Length: | 19 mm |
Peak Reflow Temperature (C): | 260 |
Bus Compatibility: | SPI; UART |
Terminal Pitch: | .8 mm |
Temperature Grade: | INDUSTRIAL |