SYSTEM ON CHIP Other Function uPs,uCs & Peripheral ICs 852

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Part	Manufacturer	Peripheral IC Type	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code
XC7Z045-L2FFG900I	Xilinx	SYSTEM ON CHIP	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	-40 Cel		BOTTOM	3.24 mm	27 mm	27 mm	CMOS	1 V	1 mm	S-PBGA-B900
XC7Z030-3FBG676E	Xilinx	SYSTEM ON CHIP	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	0 Cel		BOTTOM	2.54 mm	27 mm	27 mm	CMOS	1 V	1 mm	S-PBGA-B676
XC7Z100-2FFG1156E	Xilinx	SYSTEM ON CHIP	BALL	1156	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA1156,34X34,40	.95 V	100 Cel	0 Cel		BOTTOM	3.1 mm	35 mm	35 mm	CMOS	1 V	1 mm	S-PBGA-B1156
XC7Z045-2FFG676E	Xilinx	SYSTEM ON CHIP	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	0 Cel		BOTTOM	3.24 mm	27 mm	27 mm	CMOS	1 V	1 mm	S-PBGA-B676
XC7Z045-1FFG676C	Xilinx	SYSTEM ON CHIP	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA676,26X26,40	.95 V	85 Cel	0 Cel		BOTTOM	3.24 mm	27 mm	27 mm	CMOS	1 V	1 mm	S-PBGA-B676
XC7Z100-2FFG900E	Xilinx	SYSTEM ON CHIP	BALL	900	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA900,30X30,40	.95 V	100 Cel	0 Cel		BOTTOM	3.24 mm	27 mm	27 mm	CMOS	1 V	1 mm	S-PBGA-B900
XC7Z035-L2FFG676I	Xilinx	SYSTEM ON CHIP	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel		BOTTOM	3.24 mm	27 mm	27 mm	CMOS	1 V	1 mm	S-PBGA-B676
XC7Z045-L2FBG676I	Xilinx	SYSTEM ON CHIP	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	-40 Cel		BOTTOM	2.54 mm	27 mm	27 mm	CMOS	1 V	1 mm	S-PBGA-B676
XC7Z035-3FBG676E	Xilinx	SYSTEM ON CHIP	BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel	0 Cel		BOTTOM	2.54 mm	27 mm	27 mm	CMOS	1 V	1 mm	S-PBGA-B676
D2-45157-QR-T	Renesas Electronics	SYSTEM ON CHIP	NO LEAD	68	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.9 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.4SQ,20	1.7 V	85 Cel	-10 Cel	NICKEL PALLADIUM GOLD	QUAD	1 mm	10 mm	10 mm	CMOS	1.8 V	.5 mm	S-PQCC-N68	3	e4
D2-45157-QR	Renesas Electronics	SYSTEM ON CHIP	NO LEAD	68	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.9 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.4SQ,20	1.7 V	85 Cel	-10 Cel	NICKEL PALLADIUM GOLD	QUAD	1 mm	10 mm	10 mm	CMOS	1.8 V	.5 mm	S-PQCC-N68	3	e4
15310R-1000	Renesas Electronics	SYSTEM ON CHIP
SLG7NT4505VTR	Renesas Electronics	SYSTEM ON CHIP
SLG7NT4084V	Renesas Electronics	SYSTEM ON CHIP
SLG7NT4505V	Renesas Electronics	SYSTEM ON CHIP
SLG7NT4192V	Renesas Electronics	SYSTEM ON CHIP
SLG7NT4192VTR	Renesas Electronics	SYSTEM ON CHIP
SLG7NT4100VTR	Renesas Electronics	SYSTEM ON CHIP
SLG7NT4084VTR	Renesas Electronics	SYSTEM ON CHIP
SLG7NT4083VTR	Renesas Electronics	SYSTEM ON CHIP
SLG7NT4100V	Renesas Electronics	SYSTEM ON CHIP
DA14582-01KA2	Renesas Electronics	SYSTEM ON CHIP																						3
DA14582-01KA1	Renesas Electronics	SYSTEM ON CHIP																						3
SLG4B41337V	Renesas Electronics	SYSTEM ON CHIP
SLG7NT4964VTR	Renesas Electronics	SYSTEM ON CHIP
DA16600MOD-AAC	Renesas Electronics	SYSTEM ON CHIP
SLG7NT4774VTR	Renesas Electronics	SYSTEM ON CHIP
SLG7NT41021VTR	Renesas Electronics	SYSTEM ON CHIP
SLG7NT4805VTR	Renesas Electronics	SYSTEM ON CHIP
SLG4B41337VTR	Renesas Electronics	SYSTEM ON CHIP
DA16600MOD-AAE	Renesas Electronics	SYSTEM ON CHIP
SLG7NT4774V	Renesas Electronics	SYSTEM ON CHIP
SLG7NT4964V	Renesas Electronics	SYSTEM ON CHIP
SLG7NT4083V	Renesas Electronics	SYSTEM ON CHIP
SLG7NT41021V	Renesas Electronics	SYSTEM ON CHIP
SLG7NT4805V	Renesas Electronics	SYSTEM ON CHIP

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.