SoC Other Function uPs,uCs & Peripheral ICs 1,214

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Part	Manufacturer	Peripheral IC Type	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)
MIMX9351XVUXMAA	NXP Semiconductors	SoC
MIMX9312CVWXMAA	NXP Semiconductors	SoC
MIMX9331CVUXMAA	NXP Semiconductors	SoC
MIMX9311CVWXMAA	NXP Semiconductors	SoC
MIMX9351DVUXMAA	NXP Semiconductors	SoC
MIMX9322DVWXMAA	NXP Semiconductors	SoC
MIMX9322XVWXMAA	NXP Semiconductors	SoC
MIMX9321CVWXMAA	NXP Semiconductors	SoC
MIMX8SL1CVNFZAB	NXP Semiconductors	SoC
MIMX9321XVWXMAA	NXP Semiconductors	SoC
MIMX9332AVTXMAA	NXP Semiconductors	SoC
CY8C6245LQI-S3D02	Infineon Technologies	SoC	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.7 V	85 Cel	-40 Cel	PURE TIN	QUAD	1 mm	8 mm	8 mm	CMOS	1.8 V	.4 mm	S-XQCC-N68	3
CY8C6245LQI-S3D42	Infineon Technologies	SoC	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.7 V	85 Cel	-40 Cel	PURE TIN	QUAD	1 mm	8 mm	8 mm	CMOS	1.8 V	.4 mm	S-XQCC-N68	3
CY8C6245LQI-S3D62	Infineon Technologies	SoC	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.7 V	85 Cel	-40 Cel	PURE TIN	QUAD	1 mm	8 mm	8 mm	CMOS	1.8 V	.4 mm	S-XQCC-N68	3
CY8C6245LQI-S3D12	Infineon Technologies	SoC	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.7 V	85 Cel	-40 Cel	PURE TIN	QUAD	1 mm	8 mm	8 mm	CMOS	1.8 V	.4 mm	S-XQCC-N68	3
CY8C6245AZI-S3D42	Infineon Technologies	SoC	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.7 V	85 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	14 mm	14 mm	CMOS	1.8 V	.5 mm	S-PQFP-G100	3
CYW20737A1KML2G	Infineon Technologies	SoC														PURE TIN									3
CY8C6244AZI-S4D83	Infineon Technologies	SoC	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP80,.55SQ,20	1.7 V	85 Cel	-40 Cel		QUAD	1.6 mm	12 mm	12 mm	CMOS	1.8 V	.5 mm	S-PQFP-G80	3
CY8C6244LQI-S4D82	Infineon Technologies	SoC	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.7 V	85 Cel	-40 Cel		QUAD	1 mm	8 mm	8 mm	CMOS	1.8 V	.4 mm	S-XQCC-N68	3
CY8C6244LQI-S4D12	Infineon Technologies	SoC	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.7 V	85 Cel	-40 Cel		QUAD	1 mm	8 mm	8 mm	CMOS	1.8 V	.4 mm	S-XQCC-N68	3
CY8C6244LQI-S4D62	Infineon Technologies	SoC	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.7 V	85 Cel	-40 Cel		QUAD	1 mm	8 mm	8 mm	CMOS	1.8 V	.4 mm	S-XQCC-N68	3
CY8C6244AZQ-S4D93	Infineon Technologies	SoC	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP80,.55SQ,20	1.7 V	85 Cel	-40 Cel		QUAD	1.6 mm	12 mm	12 mm	CMOS	1.8 V	.5 mm	S-PQFP-G80	3
CYW20707UA1KFFB1G	Infineon Technologies	SoC	BALL	49	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.26 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA49,6X8,20	1.14 V	85 Cel	-30 Cel		BOTTOM	1 mm	4 mm	4.5 mm	CMOS	1.2 V	.5 mm	R-PBGA-B49
CYW20835PB1KML1G	Infineon Technologies	SoC
CYW20835PB1KML1GT	Infineon Technologies	SoC
CY8C6244AZI-S4D12	Infineon Technologies	SoC	GULL WING	64	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	HQFP64,.47SQ,20	1.7 V	85 Cel	-40 Cel		QUAD	1.6 mm	10 mm	10 mm	CMOS	1.8 V	.5 mm	S-PQFP-G64	3
CY8C6244AZQ-S4D92	Infineon Technologies	SoC	GULL WING	64	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	HQFP64,.47SQ,20	1.7 V	85 Cel	-40 Cel		QUAD	1.6 mm	10 mm	10 mm	CMOS	1.8 V	.5 mm	S-PQFP-G64	3
CY8C6244LQQ-S4D92	Infineon Technologies	SoC	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.7 V	85 Cel	-40 Cel		QUAD	1 mm	8 mm	8 mm	CMOS	1.8 V	.4 mm	S-XQCC-N68	3
CY8C6245LQI-S3D72	Infineon Technologies	SoC	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.7 V	85 Cel	-40 Cel	PURE TIN	QUAD	1 mm	8 mm	8 mm	CMOS	1.8 V	.4 mm	S-XQCC-N68	3
CY8C6245FNI-S3D41	Infineon Technologies	SoC	BALL	49	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA49,9X11,16	1.7 V	85 Cel	-40 Cel		BOTTOM	.467 mm	2.8819 mm	3.1024 mm	CMOS	1.8 V	.42 mm	R-PBGA-B49
CY8C6245AZI-S3D62	Infineon Technologies	SoC	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.7 V	85 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	14 mm	14 mm	CMOS	1.8 V	.5 mm	S-PQFP-G100	3
CY8C6245FNI-S3D71	Infineon Technologies	SoC	BALL	49	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA49,9X11,16	1.7 V	85 Cel	-40 Cel		BOTTOM	.467 mm	2.8819 mm	3.1024 mm	CMOS	1.8 V	.42 mm	R-PBGA-B49
CY8C6245AZI-S3D12	Infineon Technologies	SoC	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.7 V	85 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	14 mm	14 mm	CMOS	1.8 V	.5 mm	S-PQFP-G100	3
CY8C6245AZI-S3D02	Infineon Technologies	SoC	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.7 V	85 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	14 mm	14 mm	CMOS	1.8 V	.5 mm	S-PQFP-G100	3
CY8C6245FNI-S3D11	Infineon Technologies	SoC	BALL	49	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA49,9X11,16	1.7 V	85 Cel	-40 Cel		BOTTOM	.467 mm	2.8819 mm	3.1024 mm	CMOS	1.8 V	.42 mm	R-PBGA-B49
S6J32EELTMSC2000A	Infineon Technologies	SoC	GULL WING	216	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1.3 V	AEC-Q100; TS 16949	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP216,1.02SQ,16	1.1 V	105 Cel	-40 Cel		QUAD	1.7 mm	24 mm	24 mm	CMOS	1.2 V	.4 mm	S-PQFP-G216
S6J32FELSNSC20000	Infineon Technologies	SoC	GULL WING	216	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1.3 V	AEC-Q100; TS 16949	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP216,1.02SQ,16	1.1 V	105 Cel	-40 Cel		QUAD	1.7 mm	24 mm	24 mm	CMOS	1.2 V	.4 mm	S-PQFP-G216
S6J32FELTNSC20000	Infineon Technologies	SoC	GULL WING	216	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1.3 V	AEC-Q100; TS 16949	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP216,1.02SQ,16	1.1 V	105 Cel	-40 Cel		QUAD	1.7 mm	24 mm	24 mm	CMOS	1.2 V	.4 mm	S-PQFP-G216
S6J32EELSNSC20000	Infineon Technologies	SoC	GULL WING	216	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1.3 V	AEC-Q100; TS 16949	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP216,1.02SQ,16	1.1 V	105 Cel	-40 Cel		QUAD	1.7 mm	24 mm	24 mm	CMOS	1.2 V	.4 mm	S-PQFP-G216
S6J32EEKSNSE20000	Infineon Technologies	SoC	GULL WING	208	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1.3 V	AEC-Q100; TS 16949	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP208,1.2SQ,20	1.1 V	105 Cel	-40 Cel		QUAD	1.7 mm	28 mm	28 mm	CMOS	1.2 V	.5 mm	S-PQFP-G208
S6J32GEKSMSE2000A	Infineon Technologies	SoC	GULL WING	208	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1.3 V	AEC-Q100; TS 16949	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP208,1.2SQ,20	1.1 V	105 Cel	-40 Cel		QUAD	1.7 mm	28 mm	28 mm	CMOS	1.2 V	.5 mm	S-PQFP-G208
S6J32FEKSNSE20000	Infineon Technologies	SoC	GULL WING	208	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1.3 V	AEC-Q100; TS 16949	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP208,1.2SQ,20	1.1 V	105 Cel	-40 Cel		QUAD	1.7 mm	28 mm	28 mm	CMOS	1.2 V	.5 mm	S-PQFP-G208
S6J32GELSNSC20000	Infineon Technologies	SoC	GULL WING	216	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1.3 V	AEC-Q100; TS 16949	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP216,1.02SQ,16	1.1 V	105 Cel	-40 Cel		QUAD	1.7 mm	24 mm	24 mm	CMOS	1.2 V	.4 mm	S-PQFP-G216
S6J32JEKSNSE20000	Infineon Technologies	SoC	GULL WING	208	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1.3 V	AEC-Q100; TS 16949	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP208,1.2SQ,20	1.1 V	125 Cel	-40 Cel		QUAD	1.7 mm	28 mm	28 mm	CMOS	1.2 V	.5 mm	S-PQFP-G208
S6J32EELTPSC20000	Infineon Technologies	SoC	GULL WING	216	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1.3 V	AEC-Q100; TS 16949	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP216,1.02SQ,16	1.1 V	105 Cel	-40 Cel		QUAD	1.7 mm	24 mm	24 mm	CMOS	1.2 V	.4 mm	S-PQFP-G216
S6J32GELTPSC20000	Infineon Technologies	SoC	GULL WING	216	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1.3 V	AEC-Q100; TS 16949	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP216,1.02SQ,16	1.1 V	105 Cel	-40 Cel		QUAD	1.7 mm	24 mm	24 mm	CMOS	1.2 V	.4 mm	S-PQFP-G216
S6J32GELTNSC20000	Infineon Technologies	SoC	GULL WING	216	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1.3 V	AEC-Q100; TS 16949	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP216,1.02SQ,16	1.1 V	105 Cel	-40 Cel		QUAD	1.7 mm	24 mm	24 mm	CMOS	1.2 V	.4 mm	S-PQFP-G216
S6J32HELTNSC20000	Infineon Technologies	SoC	GULL WING	216	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1.3 V	AEC-Q100; TS 16949	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP216,1.02SQ,16	1.1 V	105 Cel	-40 Cel		QUAD	1.7 mm	24 mm	24 mm	CMOS	1.2 V	.4 mm	S-PQFP-G216

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.