SoC Other Function uPs,uCs & Peripheral ICs 1,214

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code
ESP32-WROOM-32E-N4	Espressif Systems (Shanghai)	SoC		NO LEAD	38	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V	MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	3.25 mm	18 mm	30	250	25.5 mm	CMOS	3.3 V	1.27 mm	R-XXMA-N38	3
NRF52832-QFAA-R	Nordic Semiconductor Asa	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.7 V	85 Cel	-40 Cel		QUAD	.9 mm	6 mm			6 mm	CMOS	3 V	.4 mm	S-XQCC-N48
ESP32-WROOM-32UE-N16	Espressif Systems (Shanghai)	SoC		NO LEAD	38	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V	MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	3.35 mm	18 mm	30	250	19.2 mm	CMOS	3.3 V	1.27 mm	R-XXMA-N38	3
ESP32-WROOM-32UE-N4	Espressif Systems (Shanghai)	SoC		NO LEAD	38	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V	MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	3.35 mm	18 mm	30	250	19.2 mm	CMOS	3.3 V	1.27 mm	R-XXMA-N38	3
NRF52832-QFAA-R7	Nordic Semiconductor Asa	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.7 V	85 Cel	-40 Cel		QUAD	.9 mm	6 mm			6 mm	CMOS	3 V	.4 mm	S-XQCC-N48
ESP32-WROOM-32E-N16	Espressif Systems (Shanghai)	SoC		NO LEAD	38	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V	MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	3.25 mm	18 mm	30	250	25.5 mm	CMOS	3.3 V	1.27 mm	R-XXMA-N38	3
ESP32-WROOM-32E-N8	Espressif Systems (Shanghai)	SoC		NO LEAD	38	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V	MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	3.25 mm	18 mm	30	250	25.5 mm	CMOS	3.3 V	1.27 mm	R-XXMA-N38	3
ESP32-S3-WROOM-1-N8R8	Espressif Systems (Shanghai)	SoC		NO LEAD	41	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V	MICROELECTRONIC ASSEMBLY		3 V	65 Cel	-40 Cel		UNSPECIFIED	3.25 mm	18 mm		250	25.5 mm	CMOS	3.3 V	1.27 mm	R-XXMA-N41	3
ESP32-C3-MINI-1-N4	Espressif Systems (Shanghai)	SoC		NO LEAD	53	QMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V	MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		QUAD	2.55 mm	13.2 mm			16.6 mm	CMOS	3.3 V		R-XQMA-N53	3
NRF52832-CIAA-R	Nordic Semiconductor Asa	SoC		BALL	56	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA56,7X8,16	1.7 V	85 Cel	-40 Cel		BOTTOM	.399 mm	2.956 mm			3.226 mm	CMOS	3 V	.4 mm	R-PBGA-B56
ESP32-S3-WROOM-1-N8	Espressif Systems (Shanghai)	SoC		NO LEAD	41	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V	MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	3.25 mm	18 mm			25.5 mm	CMOS	3.3 V	1.27 mm	R-XXMA-N41
NRF52832-QFAA-T	Nordic Semiconductor Asa	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.7 V	85 Cel	-40 Cel		QUAD	.9 mm	6 mm			6 mm	CMOS	3 V	.4 mm	S-XQCC-N48
NRF52832-CIAA-R7	Nordic Semiconductor Asa	SoC		BALL	56	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA56,7X8,16	1.7 V	85 Cel	-40 Cel		BOTTOM	.399 mm	2.956 mm			3.226 mm	CMOS	3 V	.4 mm	R-PBGA-B56
ESP32-WROOM-32UE-N8	Espressif Systems (Shanghai)	SoC		NO LEAD	38	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V	MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	3.35 mm	18 mm	30	250	19.2 mm	CMOS	3.3 V	1.27 mm	R-XXMA-N38	3
ESP32-S3-WROOM-1-N4	Espressif Systems (Shanghai)	SoC		NO LEAD	41	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V	MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	3.25 mm	18 mm			25.5 mm	CMOS	3.3 V	1.27 mm	R-XXMA-N41
ESP32-S3-WROOM-1-N8R2	Espressif Systems (Shanghai)	SoC		NO LEAD	41	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V	MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	3.25 mm	18 mm			25.5 mm	CMOS	3.3 V	1.27 mm	R-XXMA-N41
ESP32-S3-WROOM-1-N16	Espressif Systems (Shanghai)	SoC		NO LEAD	41	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V	MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	3.25 mm	18 mm			25.5 mm	CMOS	3.3 V	1.27 mm	R-XXMA-N41
ESP32-S3-WROOM-1-N16R8	Espressif Systems (Shanghai)	SoC		NO LEAD	41	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V	MICROELECTRONIC ASSEMBLY		3 V	65 Cel	-40 Cel		UNSPECIFIED	3.25 mm	18 mm			25.5 mm	CMOS	3.3 V	1.27 mm	R-XXMA-N41
ESP32-WROOM-32E-N8R2	Espressif Systems (Shanghai)	SoC		NO LEAD	38	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V	MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	3.25 mm	18 mm	30	250	25.5 mm	CMOS	3.3 V	1.27 mm	R-XXMA-N38	3
ESP32-S3-WROOM-1-N4R2	Espressif Systems (Shanghai)	SoC		NO LEAD	41	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V	MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	3.25 mm	18 mm			25.5 mm	CMOS	3.3 V	1.27 mm	R-XXMA-N41
NRF52832-QFAB-R	Nordic Semiconductor Asa	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.7 V	85 Cel	-40 Cel		QUAD	.9 mm	6 mm			6 mm	CMOS	3 V	.4 mm	S-XQCC-N48
ESP32-S3-WROOM-1-N16R2	Espressif Systems (Shanghai)	SoC		NO LEAD	41	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V	MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	3.25 mm	18 mm			25.5 mm	CMOS	3.3 V	1.27 mm	R-XXMA-N41
MIMXRT1062CVL5B	NXP Semiconductors	SoC		BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.15 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.43 mm	10 mm	40	260	10 mm	CMOS		.65 mm	S-PBGA-B196	3	e1
MIMXRT1062CVL5A	NXP Semiconductors	SoC	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.15 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.43 mm	10 mm	40	260	10 mm	CMOS		.65 mm	S-PBGA-B196	3	e1
ESP32-S3-WROOM-1-N4R8	Espressif Systems (Shanghai)	SoC		NO LEAD	41	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V	MICROELECTRONIC ASSEMBLY		3 V	65 Cel	-40 Cel		UNSPECIFIED	3.25 mm	18 mm			25.5 mm	CMOS	3.3 V	1.27 mm	R-XXMA-N41
MIMXRT1062CVJ5A	NXP Semiconductors	SoC	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.15 V	105 Cel	-40 Cel	TIN SILVER	BOTTOM	1.52 mm	12 mm	40	260	12 mm	CMOS		.8 mm	S-PBGA-B196	3	e2
ESP32-WROOM-32E-H4	Espressif Systems (Shanghai)	SoC		NO LEAD	38	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V	MICROELECTRONIC ASSEMBLY		3 V	105 Cel	-40 Cel		UNSPECIFIED	3.25 mm	18 mm	30	250	25.5 mm	CMOS	3.3 V	1.27 mm	R-XXMA-N38	3
MIMXRT1062CVJ5B	NXP Semiconductors	SoC		BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.15 V	105 Cel	-40 Cel	TIN SILVER	BOTTOM	1.52 mm	12 mm	40	260	12 mm	CMOS		.8 mm	S-PBGA-B196	3	e2
ESP32-C3-MINI-1U-N4	Espressif Systems (Shanghai)	SoC		NO LEAD	53	QMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V	MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		QUAD	2.55 mm	12.5 mm			13.2 mm	CMOS	3.3 V		R-XQMA-N53	3
453-00052C	Laird Technologies	SoC
MIMXRT1176CVM8A	NXP Semiconductors	SoC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.1 V	105 Cel	-40 Cel		BOTTOM	1.52 mm	14 mm	40	260	14 mm	CMOS		.8 mm	S-PBGA-B289	3
453-00053C	Laird Technologies	SoC
ESP32-C3-MINI-1-H4	Espressif Systems (Shanghai)	SoC		NO LEAD	53	QMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V	MICROELECTRONIC ASSEMBLY		3 V	105 Cel	-40 Cel		QUAD	2.55 mm	13.2 mm			16.6 mm	CMOS	3.3 V		R-XQMA-N53	3
NRF52832-QFAB-T	Nordic Semiconductor Asa	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.7 V	85 Cel	-40 Cel		QUAD	.9 mm	6 mm			6 mm	CMOS	3 V	.4 mm	S-XQCC-N48
MIMX8MM6DVTLZAA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel	0 Cel	TIN SILVER	BOTTOM	1.25 mm	14 mm	40	260	14 mm	CMOS	1 V	.5 mm	S-PBGA-B486	3	e2
ESP32-S3-WROOM-1U-N4	Espressif Systems (Shanghai)	SoC		NO LEAD	41	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V	MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	3.35 mm	18 mm			19.2 mm	CMOS	3.3 V	1.27 mm	R-XXMA-N41
ESP32-C3-MINI-1U-H4	Espressif Systems (Shanghai)	SoC		NO LEAD	53	QMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V	MICROELECTRONIC ASSEMBLY		3 V	105 Cel	-40 Cel		QUAD	2.55 mm	12.5 mm			13.2 mm	CMOS	3.3 V		R-XQMA-N53	3
DA14531MOD-00F01002	Renesas Electronics	SoC																			250						3
ESP32-S3-WROOM-1U-N16R8	Espressif Systems (Shanghai)	SoC		NO LEAD	41	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V	MICROELECTRONIC ASSEMBLY		3 V	65 Cel	-40 Cel		UNSPECIFIED	3.35 mm	18 mm			19.2 mm	CMOS	3.3 V	1.27 mm	R-XXMA-N41
ESP32-S3-WROOM-1U-N4R8	Espressif Systems (Shanghai)	SoC		NO LEAD	41	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V	MICROELECTRONIC ASSEMBLY		3 V	65 Cel	-40 Cel		UNSPECIFIED	3.35 mm	18 mm			19.2 mm	CMOS	3.3 V	1.27 mm	R-XXMA-N41
ESP32-WROOM-32UE-N8R2	Espressif Systems (Shanghai)	SoC		NO LEAD	38	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V	MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	3.35 mm	18 mm	30	250	19.2 mm	CMOS	3.3 V	1.27 mm	R-XXMA-N38	3
XTDA4VHXXXGAALY	Texas Instruments	SoC		BALL	1414	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA1414,38X38,32	.76 V	70 Cel	0 Cel		BOTTOM	3.341 mm	31 mm			31 mm	CMOS	.8 V	.8 mm	S-PBGA-B1414
BGM13P32F512GA-V2R	Silicon Labs	SoC
NRF52805-CAAA-R7	Nordic Semiconductor Asa	SoC		BALL	28	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA28,6X7,16	1.7 V	85 Cel	-40 Cel		BOTTOM	.535 mm	2.464 mm			2.482 mm	CMOS	3 V	.4 mm	R-PBGA-B28
MIMX8MQ6DVAJZAB	NXP Semiconductors	SoC														TIN SILVER				40	260						3	e2
ESP32-S3-WROOM-1U-N8	Espressif Systems (Shanghai)	SoC		NO LEAD	41	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V	MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	3.35 mm	18 mm			19.2 mm	CMOS	3.3 V	1.27 mm	R-XXMA-N41
ESP32-S3-WROOM-1U-N16R2	Espressif Systems (Shanghai)	SoC		NO LEAD	41	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V	MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	3.35 mm	18 mm			19.2 mm	CMOS	3.3 V	1.27 mm	R-XXMA-N41
ESP32-S3-WROOM-1U-N8R2	Espressif Systems (Shanghai)	SoC		NO LEAD	41	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V	MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	3.35 mm	18 mm			19.2 mm	CMOS	3.3 V	1.27 mm	R-XXMA-N41

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.