SoC Other Function uPs,uCs & Peripheral ICs 1,214

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code
ESP32-S3-WROOM-1U-N8R8	Espressif Systems (Shanghai)	SoC		NO LEAD	41	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V	MICROELECTRONIC ASSEMBLY		3 V	65 Cel	-40 Cel		UNSPECIFIED	3.35 mm	18 mm				19.2 mm	CMOS	3.3 V	1.27 mm	R-XXMA-N41
NRF52832-QFAB-R7	Nordic Semiconductor Asa	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.7 V	85 Cel	-40 Cel		QUAD	.9 mm	6 mm				6 mm	CMOS	3 V	.4 mm	S-XQCC-N48
MIMXRT1064CVJ5B	NXP Semiconductors	SoC	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,31	1.15 V	105 Cel	-40 Cel		BOTTOM	1.52 mm	12 mm		40	260	12 mm	CMOS		.8 mm	S-PBGA-B196	3
MIMXRT1064CVL5B	NXP Semiconductors	SoC	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.15 V	105 Cel	-40 Cel		BOTTOM	1.43 mm	10 mm		40	260	10 mm	CMOS		.65 mm	S-PBGA-B196	3
ESP32-S3-WROOM-1U-N4R2	Espressif Systems (Shanghai)	SoC		NO LEAD	41	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V	MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	3.35 mm	18 mm				19.2 mm	CMOS	3.3 V	1.27 mm	R-XXMA-N41
MIMX8MM6DVTLZAAR	NXP Semiconductors	SoC		BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel	0 Cel	TIN SILVER	BOTTOM	1.25 mm	14 mm		40	260	14 mm	CMOS	1 V	.5 mm	S-PBGA-B486	3	e2
453-00053R	Laird Technologies	SoC
MIMXRT1021CAG4A	NXP Semiconductors	SoC	INDUSTRIAL													TIN					40	260						3	e3
MIMXRT1171CVM8A	NXP Semiconductors	SoC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.1 V	105 Cel	-40 Cel		BOTTOM	1.52 mm	14 mm		40	260	14 mm	CMOS		.8 mm	S-PBGA-B289	3
MCIMX6Y2CVM08AB	NXP Semiconductors	SoC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.325 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.32 mm	14 mm		40	260	14 mm	CMOS		.8 mm	S-PBGA-B289	3	e1
MIMX8MQ6DVAJZAA	NXP Semiconductors	SoC																				260						3
14255R-100	Renesas Electronics	SoC
MIMXRT1173CVM8A	NXP Semiconductors	SoC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.1 V	105 Cel	-40 Cel		BOTTOM	1.52 mm	14 mm		40	260	14 mm	CMOS		.8 mm	S-PBGA-B289	3
ESP32-S3-WROOM-1U-N16	Espressif Systems (Shanghai)	SoC		NO LEAD	41	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V	MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	3.35 mm	18 mm				19.2 mm	CMOS	3.3 V	1.27 mm	R-XXMA-N41
MCIMX6Q7CVT08AD	NXP Semiconductors	SoC	INDUSTRIAL	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	EACH GPIO MODULE SUPPORTS 32 BITS OF I/O	40	260	21 mm	CMOS	1.4 V	.8 mm	S-PBGA-B624	3	e1
NRF52805-CAAA-R	Nordic Semiconductor Asa	SoC		BALL	28	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA28,6X7,16	1.7 V	85 Cel	-40 Cel		BOTTOM	.535 mm	2.464 mm				2.482 mm	CMOS	3 V	.4 mm	R-PBGA-B28
MIMXRT117FCVM8A	NXP Semiconductors	SoC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.1 V	105 Cel	-40 Cel		BOTTOM	1.52 mm	14 mm				14 mm	CMOS		.8 mm	S-PBGA-B289
MIMXRT1064CVL5A	NXP Semiconductors	SoC	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.15 V	105 Cel	-40 Cel		BOTTOM	1.43 mm	10 mm		40	260	10 mm	CMOS		.65 mm	S-PBGA-B196	3
DA14531-00000FX2	Renesas Electronics	SoC																										1	e4
MIMX8MN6DVTJZAA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel	0 Cel	TIN SILVER	BOTTOM	1.25 mm	14 mm		40	260	14 mm	CMOS	1 V	.5 mm	S-PBGA-B486	3	e2
MIMX8MM5DVTLZAA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel	0 Cel	TIN SILVER	BOTTOM	1.25 mm	14 mm		40	260	14 mm	CMOS	1 V	.5 mm	S-PBGA-B486	3	e2
MIMXRT1021CAF4B	NXP Semiconductors	SoC																			40	260						3
EFR32BG22C112F352GM32-C	Silicon Labs	SoC														MATTE TIN					40	260						2
MCIMX6Q7CVT08AE	NXP Semiconductors	SoC	INDUSTRIAL	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	EACH GPIO MODULE SUPPORTS 32 BITS OF I/O	40	260	21 mm	CMOS	1.4 V	.8 mm	S-PBGA-B624	3	e1
NRF52805-CAAA-B-R	Nordic Semiconductor Asa	SoC		BALL	28	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA28,6X7,16	1.7 V	85 Cel	-40 Cel		BOTTOM	.535 mm	2.464 mm				2.482 mm	CMOS	3 V	.4 mm	R-PBGA-B28
14450R-500	Renesas Electronics	SoC
MCIMX6Y2CVM05AB	NXP Semiconductors	SoC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.32 mm	14 mm		40	260	14 mm	CMOS		.8 mm	S-PBGA-B289	3	e1
BGM220PC22HNA2	Silicon Labs	SoC
MIMXRT1064DVL6BR	NXP Semiconductors	SoC		BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.15 V	95 Cel	0 Cel		BOTTOM	1.43 mm	10 mm		40	260	10 mm	CMOS		.65 mm	S-PBGA-B196	3
MIMXRT1021CAG4B	NXP Semiconductors	SoC																			40	260						3
MIMXRT1021CAF4A	NXP Semiconductors	SoC	INDUSTRIAL													TIN					40	260						3	e3
MIMXRT1061CVL5B	NXP Semiconductors	SoC		BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.15 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.43 mm	10 mm		40	260	10 mm	CMOS		.65 mm	S-PBGA-B196	3	e1
5CSTFD6D5F31I7N	Intel	SoC
DA14531-00000OG2	Renesas Electronics	SoC																										1
ESP32-PICO-V3-02	Espressif Systems (Shanghai)	SoC		NO LEAD	48	HQCCN	SQUARE		YES	3.6 V	CHIP CARRIER, HEAT SINK/SLUG	LCC48,.27SQ,20	3 V	85 Cel	-40 Cel		QUAD	1.21 mm	7 mm				7 mm	CMOS	3.3 V	.5 mm	S-XQCC-N48
NRF52805-CAAA-B-R7	Nordic Semiconductor Asa	SoC		BALL	28	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA28,6X7,16	1.7 V	85 Cel	-40 Cel		BOTTOM	.535 mm	2.464 mm				2.482 mm	CMOS	3 V	.4 mm	R-PBGA-B28
BGM220PC22WGA2	Silicon Labs	SoC
MIMXRT1175CVM8A	NXP Semiconductors	SoC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.1 V	105 Cel	-40 Cel		BOTTOM	1.52 mm	14 mm		40	260	14 mm	CMOS		.8 mm	S-PBGA-B289	3
OSD3358-1G-ISM	Octavo Systems	SoC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY	BGA256,16X16,50		85 Cel	-40 Cel		BOTTOM	2.58 mm	21 mm				21 mm	CMOS	1.1 V	1.27 mm	S-PBGA-B256
MIMXRT106FCVL5B	NXP Semiconductors	SoC		BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.15 V	105 Cel	-40 Cel		BOTTOM	1.43 mm	10 mm		40	260	10 mm	CMOS		.65 mm	S-PBGA-B196	3
MCIMX6S5DVM10AC	NXP Semiconductors	SoC	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm		40	260	21 mm	CMOS		.8 mm	S-PBGA-B624	3	e1
MIMX8MM1DVTLZAA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel	0 Cel	TIN SILVER	BOTTOM	1.25 mm	14 mm		40	260	14 mm	CMOS	1 V	.5 mm	S-PBGA-B486	3	e2
MIMX8MN5DVPIZAA	NXP Semiconductors	SoC	OTHER	BALL	306	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1 V	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA306,21X21,20	.9 V	95 Cel	0 Cel		BOTTOM	1.01 mm	11 mm		40	260	11 mm	CMOS	.95 V	.5 mm	S-PBGA-B306	3
MCIMX6S5DVM10AB	NXP Semiconductors	SoC	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm		40	260	21 mm	CMOS		.8 mm	S-PBGA-B624	3	e1
MIMX8MM1CVTKZAA	NXP Semiconductors	SoC		BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.9 V	105 Cel	-40 Cel	TIN SILVER	BOTTOM	1.25 mm	14 mm		40	260	14 mm	CMOS	.95 V	.5 mm	S-PBGA-B486	3	e2
BGM13S32F512GA-V3	Silicon Labs	SoC
NRF52833-QIAA-B-R	Nordic Semiconductor Asa	SoC		NO LEAD	73		SQUARE	UNSPECIFIED	YES	5.5 V			1.7 V	105 Cel	-40 Cel		QUAD			ALSO AVAILABLE WITH QFN-40 AND WLCSP-95 PACKAGE				CMOS			S-XQCC-N73
DA14531MOD-00F0100C	Renesas Electronics	SoC																				250						3

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.