SoC Other Function uPs,uCs & Peripheral ICs 1,214

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
KW45B41Z82AFPBT	NXP Semiconductors	SoC
M1A3P1000L-1FG256I	Microchip Technology	SoC
MCIMX534AVV8CR2	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	AEC-Q100		GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.05 V	125 Cel	-40 Cel	TIN SILVER	BOTTOM	1.85 mm	19 mm		40	260	19 mm	CMOS	1.1 V		.8 mm	S-PBGA-B529	3		e2
MCIMX6D6AVT08AER	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS	1.4 V		.8 mm	S-PBGA-B624	3
MCIMX6D7CVT08AE	NXP Semiconductors	SoC	INDUSTRIAL	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	EACH GPIO MODULE SUPPORTS 32 BITS OF I/O	40	260	21 mm	CMOS	1.4 V		.8 mm	S-PBGA-B624	3		e1
MCIMX6X1CVO08AB	NXP Semiconductors	SoC	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.53 mm	17 mm		40	260	17 mm	CMOS			.8 mm	S-PBGA-B400	3		e1
MCIMX6X1EVO10AB	NXP Semiconductors	SoC	COMMERCIAL EXTENDED	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.53 mm	17 mm		40	260	17 mm	CMOS			.8 mm	S-PBGA-B400	3		e1
MCIMX6X3EVK10AB	NXP Semiconductors	SoC	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,25	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	14 mm		40	260	14 mm	CMOS			.65 mm	S-PBGA-B400	3		e1
MCIMX6Y1DVM05AA	NXP Semiconductors	SoC	OTHER	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.275 V	95 Cel	0 Cel		BOTTOM	1.32 mm	14 mm		40	260	14 mm	CMOS			.8 mm	S-PBGA-B289	3
MPC8548ECHXAQG	Freescale Semiconductor	SoC	INDUSTRIAL	BALL	783	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1.155 V		1.1,1.8/2.5,2.5/3.3	GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel	Tin/Lead/Silver (Sn/Pb/Ag)	BOTTOM	3.38 mm	29 mm		40	260	29 mm	CMOS	1.1 V	Microprocessors	1 mm	S-CBGA-B783	1	Not Qualified	e0
MPC8548ECHXAUJ	Freescale Semiconductor	SoC	INDUSTRIAL	BALL	783	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1.155 V		1.1,1.8/2.5,2.5/3.3	GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel	Tin/Lead/Silver (Sn/Pb/Ag)	BOTTOM	3.38 mm	29 mm		40	260	29 mm	CMOS	1.1 V	Microprocessors	1 mm	S-CBGA-B783	1	Not Qualified	e0
PIC32CX1012BZ25048-I/MYX	Microchip Technology	SoC
PIC32MZ1025W104132-I/NX	Microchip Technology	SoC	INDUSTRIAL
10AS016C4U19I3LG	Intel	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.87 V	100 Cel	-40 Cel		BOTTOM	3.25 mm	19 mm				19 mm	TSMC	.9 V		.8 mm	S-PBGA-B484
10AS032H3F35E2SG	Intel	SoC		BALL	1152	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY	BGA1152,34X34,40	.87 V	100 Cel	0 Cel		BOTTOM	3.35 mm	35 mm	ALSO OPERATES AT 0.95V NOMINAL SUPPLY			35 mm	TSMC	.9 V		1 mm	S-PBGA-B1152
5CSEBA2U23C6N	Intel	SoC
5CSEBA2U23C7SN	Intel	SoC
5CSEBA2U23C8SN	Intel	SoC
5CSEBA4U19C8SN	Intel	SoC
5CSEBA4U19I7N	Intel	SoC
5CSEBA5U19I7LN	Intel	SoC
5CSEBA5U23I7SN	Intel	SoC
5CSEMA6F31A7N	Intel	SoC
AM6234ATGGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM	.89 mm	13 mm				13 mm	CMOS	.75 V		.5 mm	S-PBGA-B425
AM6254ATCGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM	.89 mm	13 mm			250	13 mm	CMOS	.75 V		.5 mm	S-PBGA-B425	3
BGM13P32F512GE-V2	Silicon Labs	SoC
BGM13P32F512GE-V2R	Silicon Labs	SoC
C8051F061-GQ	Silicon Labs	SoC	INDUSTRIAL															MATTE TIN					40	260							3	Not Qualified	e3
CY8C6244AZI-S4D62	Infineon Technologies	SoC		GULL WING	64	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	HQFP64,.47SQ,20	1.7 V	85 Cel	-40 Cel		QUAD	1.6 mm	10 mm				10 mm	CMOS	1.8 V		.5 mm	S-PQFP-G64	3
CY8C6244AZI-S4D82	Infineon Technologies	SoC		GULL WING	64	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	HQFP64,.47SQ,20	1.7 V	85 Cel	-40 Cel		QUAD	1.6 mm	10 mm				10 mm	CMOS	1.8 V		.5 mm	S-PQFP-G64	3
DA14531-01000OG2	Renesas Electronics	SoC
EFR32MG24A021F1024IM40-BR	Silicon Labs	SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	1.71 V	125 Cel	-40 Cel		QUAD	.9 mm	5 mm				5 mm	CMOS	3 V		.4 mm	S-XQCC-N40
M1A3P1000L-1FGG256	Microchip Technology	SoC																TIN SILVER COPPER					30	250							3
M1A3P600L-1FG144I	Microchip Technology	SoC
M1A3P600L-FG484I	Microchip Technology	SoC
M1A3PE3000L-PQG208	Microchip Technology	SoC																MATTE TIN					30	245							3
MCIMX6D6AVT08AE	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3
MCIMX6U5DVM10ADR	NXP Semiconductors	SoC		BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm		40	260	21 mm	CMOS	1.4 V		.8 mm	S-PBGA-B624	3		e1
MCIMX6X2EVN10AB	NXP Semiconductors	SoC	COMMERCIAL EXTENDED	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.53 mm	17 mm		40	260	17 mm	CMOS			.8 mm	S-PBGA-B400	3		e1
MCIMX6X4AVM08AC	NXP Semiconductors	SoC		BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.275 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.52 mm	19 mm		40	260	19 mm	CMOS			.8 mm	S-PBGA-B529	3		e1
MCIMX6Y2CVM05AAR	NXP Semiconductors	SoC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.32 mm	14 mm		40	260	14 mm	CMOS			.8 mm	S-PBGA-B289	3		e1
MIMX8MN3DVPIZAA	NXP Semiconductors	SoC	OTHER	BALL	306	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1 V			GRID ARRAY, THIN PROFILE, FINE PITCH	BGA306,21X21,20	.9 V	95 Cel	0 Cel		BOTTOM	1.01 mm	11 mm		40	260	11 mm	CMOS	.95 V		.5 mm	S-PBGA-B306	3
MIMXRT106ACVL5B	NXP Semiconductors	SoC		BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.15 V	105 Cel	-40 Cel		BOTTOM	1.43 mm	10 mm		40	260	10 mm	CMOS			.65 mm	S-PBGA-B196	3
S32G233AABK0VUCR	NXP Semiconductors	SoC	INDUSTRIAL																				40	260							3
XTDA4VPXXXGAALY	Texas Instruments	SoC		BALL	1414	HFBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA1414,38X38,32	.76 V	70 Cel	0 Cel		BOTTOM	3.341 mm	31 mm				31 mm	CMOS	.8 V		.8 mm	S-PBGA-B1414
10AS057K4F40E3SG	Intel	SoC		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY	BGA1517,39X39,40	.87 V	100 Cel	0 Cel		BOTTOM	3.5 mm	40 mm				40 mm	TSMC	.9 V		1 mm	S-PBGA-B1517
5CSEBA5U19C6N	Intel	SoC
5CSEMA5F31C8N	Intel	SoC

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.