SoC Other Function uPs,uCs & Peripheral ICs 1,214

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
10AS057K2F40E1HG	Intel	SoC		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY	BGA1517,39X39,40		100 Cel	0 Cel		BOTTOM	3.5 mm	40 mm			40 mm	TSMC			1 mm	S-PBGA-B1517
10AS066H4F34E3SG	Intel	SoC		BALL	1152	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY	BGA1152,34X34,40	.87 V	100 Cel	0 Cel		BOTTOM	3.35 mm	35 mm			35 mm	TSMC	.9 V		1 mm	S-PBGA-B1152
5CSEBA2U19A7N	Intel	SoC
5CSEBA2U19C8N	Intel	SoC
5CSEBA4U23A7N	Intel	SoC
5CSEBA4U23C7N	Intel	SoC
5CSEBA4U23C8N	Intel	SoC
5CSEBA5U19I7SN	Intel	SoC
5CSEBA5U23A7N	Intel	SoC
5CSEMA5U23C6N	Intel	SoC
5CSEMA5U23I7N	Intel	SoC
5CSTFD5D5F31I7N	Intel	SoC
5CSXFC4C6U23C7N	Intel	SoC
5CSXFC5C6U23I7N	Intel	SoC
5CSXFC5D6F31C8N	Intel	SoC
5CSXFC5D6F31I7N	Intel	SoC
5CSXFC6D6F31A7N	Intel	SoC
88AP270MA2-BGO2C624	Marvell Technology	SoC		BALL			SQUARE	PLASTIC/EPOXY	YES	3.3 V		1.8/3.3			1.8 V	85 Cel	-25 Cel	TIN SILVER COPPER	BOTTOM						CMOS		Graphics Processors				Not Qualified	e8
88AP270MA2-BHE1E416	Marvell Technology	SoC	INDUSTRIAL	BALL			SQUARE	PLASTIC/EPOXY	YES	3.3 V		1.8/3.3			1.8 V			TIN SILVER COPPER	BOTTOM						CMOS		Graphics Processors				Not Qualified	e1
88AP310-B1-BGK2C806-TN02	Marvell Technology	SoC		BALL			SQUARE	PLASTIC/EPOXY	YES	3.3 V					1.8 V	85 Cel	-25 Cel		BOTTOM						CMOS
88AP320-C0-BGR2C624-TN20	Marvell Technology	SoC	INDUSTRIAL	BALL			SQUARE	PLASTIC/EPOXY	YES	3.3 V					1.8 V	85 Cel	-25 Cel		BOTTOM						CMOS
88AP320-C0-BGR2C624-TN21	Marvell Technology	SoC	INDUSTRIAL	BALL			SQUARE	PLASTIC/EPOXY	YES	3.3 V					1.8 V	85 Cel	-25 Cel	TIN SILVER COPPER	BOTTOM						CMOS							e1
88AP320-C0-BGR2C806-TN21	Marvell Technology	SoC	INDUSTRIAL	BALL			SQUARE	PLASTIC/EPOXY	YES	3.3 V					1.8 V	85 Cel	-25 Cel	TIN SILVER COPPER	BOTTOM						CMOS							e1
88AP320-C0-BGR2C806-TN31	Marvell Technology	SoC	INDUSTRIAL	BALL			SQUARE	PLASTIC/EPOXY	YES	3.3 V					1.8 V	85 Cel	-25 Cel		BOTTOM						CMOS
BGM13S22F512GN-V3	Silicon Labs	SoC
EFR32FG13P232F512GM48-D	Silicon Labs	SoC																MATTE TIN				40	260							2		e3
EFR32FG1P133F256GM48-C0	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.85 V	85 Cel	-40 Cel		QUAD	.9 mm	7 mm			7 mm	CMOS	3.3 V		.5 mm	S-XQCC-N48
EFR32MG24A010F1024IM48-BR	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	125 Cel	-40 Cel		QUAD	.9 mm	6 mm			6 mm	CMOS	3 V		.4 mm	S-XQCC-N48
EFR32MG24A420F1536IM40-B	Silicon Labs	SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	1.71 V	125 Cel	-40 Cel		QUAD	.9 mm	5 mm			5 mm	CMOS	3 V		.4 mm	S-XQCC-N40
EFR32MG24A420F1536IM48-B	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	125 Cel	-40 Cel		QUAD	.9 mm	6 mm			6 mm	CMOS	3 V		.4 mm	S-XQCC-N48
EFR32ZG23A010F512GM40-C	Silicon Labs	SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	1.71 V	85 Cel	-40 Cel		QUAD	.9 mm	5 mm			5 mm	CMOS	3.3 V		.4 mm	S-XQCC-N40
MPC8548VUAUJ	Freescale Semiconductor	SoC		BALL	783	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1.155 V		1.1,1.8/2.5,2.5/3.3	GRID ARRAY	BGA783,28X28,40	1.045 V	105 Cel	-40 Cel	Tin/Silver (Sn/Ag)	BOTTOM	3.38 mm	29 mm	40	260	29 mm	CMOS	1.1 V	Microprocessors	1 mm	S-CBGA-B783	1	Not Qualified	e2
S6J32HELTNSC2D000	Infineon Technologies	SoC		GULL WING	216	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1.3 V	AEC-Q100; TS 16949		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP216,1.02SQ,16	1.1 V	105 Cel	-40 Cel		QUAD	1.7 mm	24 mm			24 mm	CMOS	1.2 V		.4 mm	S-PQFP-G216
ATSAM4C32CA-AU	Microchip Technology	SoC	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.32 V			FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.08 V	85 Cel	-40 Cel	MATTE TIN	QUAD	1.6 mm	14 mm	40	260	14 mm	CMOS	1.2 V		.5 mm	S-PQFP-G100	3		e3
ATWILC1000B-MU-Y	Microchip Technology	SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16		85 Cel	-40 Cel	MATTE TIN	QUAD	1 mm	5 mm			5 mm	CMOS	1.1 V		.4 mm	S-XQCC-N40
D2-92683-QR	Renesas Electronics	SoC	OTHER	NO LEAD	72	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.9 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	85 Cel	-10 Cel	MATTE TIN	QUAD	.9 mm	10 mm	30	260	10 mm	CMOS	1.8 V		.5 mm	S-PQCC-N72	3		e3
EFR32BG13P532F512GM48-DR	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.8 V	85 Cel	-40 Cel		QUAD	.9 mm	7 mm			7 mm	CMOS	3.3 V		.5 mm	S-XQCC-N48
EFR32BG13P632F512GM32-DR	Silicon Labs	SoC		NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.8 V	85 Cel	-40 Cel		QUAD	.9 mm	5 mm			5 mm	CMOS	3.3 V		.5 mm	S-XQCC-N32
EFR32FG13P231F512GM32-DR	Silicon Labs	SoC																				40	260							3
EFR32FG1P131F256GM48-C0	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.85 V	85 Cel	-40 Cel		QUAD	.9 mm	7 mm			7 mm	CMOS	3.3 V		.5 mm	S-XQCC-N48
EFR32FG1P131F256GM48-C0R	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.85 V	85 Cel	-40 Cel		QUAD	.9 mm	7 mm			7 mm	CMOS	3.3 V		.5 mm	S-XQCC-N48
EFR32FG1P133F256GM48-C0R	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.85 V	85 Cel	-40 Cel		QUAD	.9 mm	7 mm			7 mm	CMOS	3.3 V		.5 mm	S-XQCC-N48
EFR32FG1V131F256GM48-C0	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.85 V	85 Cel	-40 Cel		QUAD	.9 mm	7 mm			7 mm	CMOS	3.3 V		.5 mm	S-XQCC-N48
EFR32MG1B232F256GM32-C0R	Silicon Labs	SoC		NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.85 V	85 Cel	-40 Cel		QUAD	.9 mm	5 mm			5 mm	CMOS	3.3 V		.5 mm	S-XQCC-N32
EFR32MG1V132F256GM32-C0	Silicon Labs	SoC		NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.85 V	85 Cel	-40 Cel		QUAD	.9 mm	5 mm			5 mm	CMOS	3.3 V		.5 mm	S-XQCC-N32
EFR32MG1V132F256GM32-C0R	Silicon Labs	SoC		NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.85 V	85 Cel	-40 Cel		QUAD	.9 mm	5 mm			5 mm	CMOS	3.3 V		.5 mm	S-XQCC-N32
EFR32MG1V132F256GM48-C0	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.85 V	85 Cel	-40 Cel		QUAD	.9 mm	7 mm			7 mm	CMOS	3.3 V		.5 mm	S-XQCC-N48
M1A3PE3000L-FGG896	Microchip Technology	SoC																TIN SILVER COPPER				30	245							3

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.