SoC Other Function uPs,uCs & Peripheral ICs 1,214

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code
AM68A72AHGGHAALZR	Texas Instruments	SoC		BALL	770	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V			GRID ARRAY, FINE PITCH	BGA770,28X28,32	.76 V	105 Cel	-40 Cel		BOTTOM	2.57 mm	23 mm				23 mm	CMOS	.8 V		.8 mm	S-PBGA-B770
AM68A72ATGGHAALZR	Texas Instruments	SoC		BALL	770	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V			GRID ARRAY, FINE PITCH	BGA770,28X28,32	.76 V	105 Cel	-40 Cel		BOTTOM	2.57 mm	23 mm		30	260	23 mm	CMOS	.8 V		.8 mm	S-PBGA-B770	3
DA14695-00000HQ2	Renesas Electronics	SoC																													3
MCIMX6S5DVM10AD	NXP Semiconductors	SoC	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm		40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3			e1
5CSEMA4U23C6N	Intel	SoC
5CSEMA6F31C8N	Intel	SoC
C8051F062-GQ	Silicon Labs	SoC	INDUSTRIAL									3						TIN					40	260				Microcontrollers			3	Not Qualified		e3
DRA821U4TCBALMRQ1	Texas Instruments	SoC		BALL	433	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V	AEC-Q100		GRID ARRAY, FINE PITCH	BGA433,21X21,32	.76 V	125 Cel	-40 Cel		BOTTOM	2.57 mm	17.2 mm			250	17.2 mm	CMOS	.8 V		.8 mm	S-PBGA-B433	3		2000 rpm
MCIMX6X1EVK10AB	NXP Semiconductors	SoC	OTHER	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,25	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	14 mm		40	260	14 mm	CMOS			.65 mm	S-PBGA-B400	3			e1
5CSEBA2U19C7N	Intel	SoC
5CSEMA4U23A7N	Intel	SoC
5CSEMA4U23C7N	Intel	SoC
5CSEMA4U23C8N	Intel	SoC
5CSXFC6C6U23C8N	Intel	SoC
AM6254ATGGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM	.89 mm	13 mm				13 mm	CMOS	.75 V		.5 mm	S-PBGA-B425
EFR32BG24B210F1024IM48-BR	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	125 Cel	-40 Cel		QUAD	.9 mm	6 mm				6 mm	CMOS	3 V		.4 mm	S-XQCC-N48
453-00068C	Laird Technologies	SoC
5CSEBA2U19C6N	Intel	SoC
5CSEBA2U19C7SN	Intel	SoC
5CSEMA5F31C6N	Intel	SoC
5CSEMA6U23C6N	Intel	SoC
ATSAMHA1E14A-MBT-BVAO	Microchip Technology	SoC	INDUSTRIAL
M1A3P600L-1FGG484	Microchip Technology	SoC																TIN SILVER COPPER					30	250							3
M1A3PE3000L-1PQG208	Microchip Technology	SoC																MATTE TIN					30	245							3
MCIMX6S5DVM10ABR	NXP Semiconductors	SoC	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		1.05/1.5	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm		40	260	21 mm	CMOS		Graphics Processors	.8 mm	S-PBGA-B624	3	Not Qualified		e1
MCIMX6X4EVM10AB	NXP Semiconductors	SoC	OTHER	BALL	529	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.52 mm	19 mm		40	260	19 mm	CMOS			.8 mm	S-PBGA-B529	3			e1
MCIMX6Y2CVK08AB	NXP Semiconductors	SoC		BALL	272	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA272,17X17,20	1.325 V	105 Cel	-40 Cel		BOTTOM	1.23 mm	9 mm		40	260	9 mm	CMOS			.5 mm	S-PBGA-B272	3
SLG7NT4129V	Renesas Electronics	SoC
T31X	Lumissil Microsystems	SoC
10AS048H4F34E3SG	Intel	SoC		BALL	1152	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY	BGA1152,34X34,40	.87 V	100 Cel	0 Cel		BOTTOM	3.35 mm	35 mm				35 mm	TSMC	.9 V		1 mm	S-PBGA-B1152
10AS066H2F34I1HG	Intel	SoC		BALL	1152	BGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY	BGA1152,34X34,40		100 Cel	-40 Cel		BOTTOM	3.35 mm	35 mm				35 mm	TSMC			1 mm	S-PBGA-B1152
5CSEBA4U23I7SN	Intel	SoC
5CSEBA5U19A7N	Intel	SoC
5CSEBA5U23C7SN	Intel	SoC
5CSEMA6F31I7N	Intel	SoC
AM6232ATGGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM	.89 mm	13 mm				13 mm	CMOS	.75 V		.5 mm	S-PBGA-B425
AM6234ASGGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM	.89 mm	13 mm				13 mm	CMOS	.75 V		.5 mm	S-PBGA-B425
AM6251ASGGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM	.89 mm	13 mm				13 mm	CMOS	.75 V		.5 mm	S-PBGA-B425
ATWILC1000B-UU-T	Microchip Technology	SoC		BALL	55	VFBGA	SQUARE	PLASTIC/EPOXY	YES				GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA55,8X8,14		85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	.589 mm	3.24 mm				3.24 mm	CMOS	1.1 V		.35 mm	S-PBGA-B55
CY8C6244LQI-S4D92	Infineon Technologies	SoC		NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.7 V	85 Cel	-40 Cel		QUAD	1 mm	8 mm				8 mm	CMOS	1.8 V		.4 mm	S-XQCC-N68	3
DA14580-01UNA	Renesas Electronics	SoC																													1
DA14583-01F01AT1	Renesas Electronics	SoC
DA14586-00F02AT2	Renesas Electronics	SoC																													3
EFR32BG24A010F1024IM48-BR	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	125 Cel	-40 Cel		QUAD	.9 mm	6 mm				6 mm	CMOS	3 V		.4 mm	S-XQCC-N48
EFR32BG24A020F1024IM40-B	Silicon Labs	SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	1.71 V	125 Cel	-40 Cel		QUAD	.9 mm	5 mm				5 mm	CMOS	3 V		.4 mm	S-XQCC-N40
EFR32BG24A020F1024IM40-BR	Silicon Labs	SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	1.71 V	125 Cel	-40 Cel		QUAD	.9 mm	5 mm				5 mm	CMOS	3 V		.4 mm	S-XQCC-N40
EFR32BG24B110F1536IM48-B	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	125 Cel	-40 Cel		QUAD	.9 mm	6 mm				6 mm	CMOS	3 V		.4 mm	S-XQCC-N48
FSC-BT802	Shenzhen Feasycom	SoC		NO LEAD	36	QMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V			MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		QUAD		9.7 mm	BOX PACKAGE METHOD IS AVAILABLE WITH 2000PCS OF PACKAGE QUANTITY			11.5 mm	CMOS	3.3 V		1 mm	R-XQMA-N36

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.