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| Manufacturer | Intel |
|---|---|
| Manufacturer's Part Number | 10AS066H2F34I1HG |
| Description | SoC; Terminal Form: BALL; No. of Terminals: 1152; Package Code: BGA; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel; |
| Datasheet | 10AS066H2F34I1HG Datasheet |
| In Stock | 1,434 |
| NAME | DESCRIPTION |
|---|---|
| Other Names: | 965020 |
| Package Body Material: | PLASTIC/EPOXY |
| Peripheral IC Type: | SoC |
| Maximum Seated Height: | 3.35 mm |
| Surface Mount: | YES |
| Minimum Operating Temperature: | -40 Cel |
| No. of Terminals: | 1152 |
| Package Equivalence Code: | BGA1152,34X34,40 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Length: | 35 mm |
| Technology: | TSMC |
| JESD-30 Code: | S-PBGA-B1152 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 100 Cel |
| Package Code: | BGA |
| Width: | 35 mm |
| Terminal Pitch: | 1 mm |








