SoC Other Function uPs,uCs & Peripheral ICs 1,214

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Speed	JESD-609 Code
MCIMX6D6AVT10AER	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm	40	260	21 mm	CMOS	1.4 V	.8 mm	S-PBGA-B624	3		e1
MCIMX6D7CZK08AD	NXP Semiconductors	SoC	INDUSTRIAL	BALL	569	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA569,29X29,16	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.25 mm	12 mm	40	260	12 mm	CMOS	1.4 V	.4 mm	S-PBGA-B569	3		e1
MCIMX6Q4AVT10AE	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm	40	260	21 mm	CMOS		.8 mm	S-PBGA-B624	3
MCIMX6Q7CZK08AD	NXP Semiconductors	SoC	INDUSTRIAL	BALL	569	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA569,29X29,16	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.25 mm	12 mm	40	260	12 mm	CMOS	1.4 V	.4 mm	S-PBGA-B569	3		e1
MCIMX6S5EVM10AD	NXP Semiconductors	SoC	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	40	260	21 mm	CMOS		.8 mm	S-PBGA-B624	3		e1
T1014ME3PQA	Teledyne E2v (Uk)	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	125 Cel	-55 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	1 V	.8 mm	S-PBGA-B780
T1024NXE7PQA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm	30	250	23 mm	CMOS	1 V	.8 mm	S-PBGA-B780	3		e1
XDRA821UXXGALM	Texas Instruments	SoC	AUTOMOTIVE	BALL	433	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V		GRID ARRAY, FINE PITCH	BGA433,21X21,32	.76 V	125 Cel	-40 Cel		BOTTOM	2.57 mm	17.2 mm			17.2 mm	CMOS	.8 V	.8 mm	S-PBGA-B433		2000 rpm
DRA829VMTGBALFRQ1	Texas Instruments	SoC		BALL	827	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V	AEC-Q100	GRID ARRAY, FINE PITCH	BGA827,29X29,32	.76 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.8 mm	24 mm		250	24 mm	CMOS	.8 V	.8 mm	S-PBGA-B827	3	2000 rpm	e1
DRA821U4TCBALMQ1	Texas Instruments	SoC		BALL	433	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V	AEC-Q100	GRID ARRAY, FINE PITCH	BGA433,21X21,32	.76 V	125 Cel	-40 Cel		BOTTOM	2.57 mm	17.2 mm		250	17.2 mm	CMOS	.8 V	.8 mm	S-PBGA-B433	3	2000 rpm
XAM62A74AUMHAAMB	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.556 mm	18 mm			18 mm	CMOS	.75 V	.8 mm	S-PBGA-B484
AM69A98ATNGHAALYR	Texas Instruments	SoC		BALL	1414	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V		GRID ARRAY, FINE PITCH	BGA1414,38X38,32	.76 V	105 Cel	-40 Cel		BOTTOM	3.341 mm	31 mm			31 mm	CMOS	.8 V	.8 mm	S-PBGA-B1414
AM69A94ATMGHAALYR	Texas Instruments	SoC		BALL	1414	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V		GRID ARRAY, FINE PITCH	BGA1414,38X38,32	.76 V	105 Cel	-40 Cel		BOTTOM	3.341 mm	31 mm			31 mm	CMOS	.8 V	.8 mm	S-PBGA-B1414
XAM62A74AUMHIAMB	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	125 Cel	-40 Cel		BOTTOM	2.556 mm	18 mm			18 mm	CMOS	.75 V	.8 mm	S-PBGA-B484
XAM69A98ATNGHAALY	Texas Instruments	SoC		BALL	1414	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V		GRID ARRAY, FINE PITCH	BGA1414,38X38,32	.76 V	105 Cel	-40 Cel		BOTTOM	3.341 mm	31 mm			31 mm	CMOS	.8 V	.8 mm	S-PBGA-B1414
XAM62A34ASMHIAMB	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	125 Cel	-40 Cel		BOTTOM	2.556 mm	18 mm			18 mm	CMOS	.75 V	.8 mm	S-PBGA-B484
XAM62A34ASMHAAMB	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.556 mm	18 mm			18 mm	CMOS	.75 V	.8 mm	S-PBGA-B484
AM69A54ANMGHAALYR	Texas Instruments	SoC		BALL	1414	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V		GRID ARRAY, FINE PITCH	BGA1414,38X38,32	.76 V	105 Cel	-40 Cel		BOTTOM	3.341 mm	31 mm			31 mm	CMOS	.8 V	.8 mm	S-PBGA-B1414
AM69A34AHMGHAALYR	Texas Instruments	SoC		BALL	1414	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V		GRID ARRAY, FINE PITCH	BGA1414,38X38,32	.76 V	105 Cel	-40 Cel		BOTTOM	3.341 mm	31 mm			31 mm	CMOS	.8 V	.8 mm	S-PBGA-B1414
AM69A78ATMGHAALYR	Texas Instruments	SoC		BALL	1414	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V		GRID ARRAY, FINE PITCH	BGA1414,38X38,32	.76 V	105 Cel	-40 Cel		BOTTOM	3.341 mm	31 mm			31 mm	CMOS	.8 V	.8 mm	S-PBGA-B1414
OMAPL137CZKBD	Texas Instruments	SoC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY	BGA256,16X16,40		70 Cel	-40 Cel		BOTTOM	2.05 mm	17 mm			17 mm	CMOS		1 mm	S-PBGA-B256
OMAPL137BZKBA4	Texas Instruments	SoC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1.35 V		GRID ARRAY	BGA256,16X16,40	1.25 V	85 Cel	-40 Cel		BOTTOM	2.05 mm	17 mm			17 mm	CMOS	1.3 V	1 mm	S-PBGA-B256
AM6252ASGGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM	.89 mm	13 mm			13 mm	CMOS	.75 V	.5 mm	S-PBGA-B425
AM62A74AVMSIAMBQ1	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V	AEC-Q100	GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	125 Cel	-40 Cel		BOTTOM	2.556 mm	18 mm			18 mm	CMOS	.75 V	.8 mm	S-PBGA-B484
AM68A92ATGGHAALZR	Texas Instruments	SoC		BALL	770	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V		GRID ARRAY, FINE PITCH	BGA770,28X28,32	.76 V	105 Cel	-40 Cel		BOTTOM	2.57 mm	23 mm	30	260	23 mm	CMOS	.8 V	.8 mm	S-PBGA-B770	3
AM62A32AMLHAAMB	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.556 mm	18 mm			18 mm	CMOS	.75 V	.8 mm	S-PBGA-B484
AM62A74AUMSIAMBRQ1	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V	AEC-Q100	GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	125 Cel	-40 Cel		BOTTOM	2.556 mm	18 mm			18 mm	CMOS	.75 V	.8 mm	S-PBGA-B484
AM62A74AUMHAAMBR	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.556 mm	18 mm			18 mm	CMOS	.75 V	.8 mm	S-PBGA-B484
AM6252ATCGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM	.89 mm	13 mm	30	250	13 mm	CMOS	.75 V	.5 mm	S-PBGA-B425	3
AM62A32AMLSIAMBQ1	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V	AEC-Q100	GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	125 Cel	-40 Cel		BOTTOM	2.556 mm	18 mm			18 mm	CMOS	.75 V	.8 mm	S-PBGA-B484
AM62A74AUMHAAMB	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.556 mm	18 mm			18 mm	CMOS	.75 V	.8 mm	S-PBGA-B484
AM62A74AUMSIAMBQ1	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V	AEC-Q100	GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	125 Cel	-40 Cel		BOTTOM	2.556 mm	18 mm			18 mm	CMOS	.75 V	.8 mm	S-PBGA-B484
AM62A34ASMHAAMB	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.556 mm	18 mm			18 mm	CMOS	.75 V	.8 mm	S-PBGA-B484
AM62A34ASMSIAMBQ1	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V	AEC-Q100	GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	125 Cel	-40 Cel		BOTTOM	2.556 mm	18 mm			18 mm	CMOS	.75 V	.8 mm	S-PBGA-B484
AM62A31AMLHAAMB	Texas Instruments	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.556 mm	18 mm			18 mm	CMOS	.75 V	.8 mm	S-PBGA-B484
AM6251ATCGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM	.89 mm	13 mm		250	13 mm	CMOS	.75 V	.5 mm	S-PBGA-B425	3
AM6232ATCGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM	.89 mm	13 mm		250	13 mm	CMOS	.75 V	.5 mm	S-PBGA-B425	3
AM6231ATCGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM	.89 mm	13 mm		250	13 mm	CMOS	.75 V	.5 mm	S-PBGA-B425	3
MAX78000EXG+	Analog Devices	SoC		BALL	81	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.21 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA81,9X9,32	.9 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	8 mm	30	260	8 mm	CMOS	1.1 V	.8 mm	S-PBGA-B81	3		e1
STA1085HOATR	STMicroelectronics	SoC
STA1085EUA3	STMicroelectronics	SoC																			NOT SPECIFIED	NOT SPECIFIED
STA1085EUA3TR	STMicroelectronics	SoC																			NOT SPECIFIED	NOT SPECIFIED
STSAFE-VJ100-CCC	STMicroelectronics	SoC
STSAFS320WSBCS01	STMicroelectronics	SoC
STA1085POCTR	STMicroelectronics	SoC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel	-40 Cel		BOTTOM	1.7 mm	16 mm	NOT SPECIFIED	NOT SPECIFIED	16 mm	CMOS		.8 mm	S-PBGA-B361
STA1085ELA3	STMicroelectronics	SoC																			NOT SPECIFIED	NOT SPECIFIED
STA1085ELATR	STMicroelectronics	SoC																			NOT SPECIFIED	NOT SPECIFIED
STA1085POA3	STMicroelectronics	SoC																			NOT SPECIFIED	NOT SPECIFIED

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.