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Manufacturer | Analog Devices |
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Manufacturer's Part Number | MAX78000EXG+ |
Description | SoC; Terminal Form: BALL; No. of Terminals: 81; Package Code: LFBGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.21 V; |
In Stock | 2,053 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | .9 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 1.1 V |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Seated Height: | 1.3 mm |
Surface Mount: | YES |
Terminal Finish: | TIN SILVER COPPER |
No. of Terminals: | 81 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B81 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 105 Cel |
Package Code: | LFBGA |
Width: | 8 mm |
Moisture Sensitivity Level (MSL): | 3 |
Peripheral IC Type: | SoC |
Maximum Supply Voltage: | 1.21 V |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | -40 Cel |
Package Equivalence Code: | BGA81,9X9,32 |
Length: | 8 mm |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | .8 mm |