SoC Other Function uPs,uCs & Peripheral ICs 1,214

Reset All

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
MIMX8MQ5DVAJZAA	NXP Semiconductors	SoC																						260							3
MPC8247CVRTIEA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V		1.5,3.3	GRID ARRAY	BGA516,26X26,40	1.425 V	105 Cel	-40 Cel	TIN SILVER	BOTTOM	2.55 mm	27 mm		30	245	27 mm	CMOS	1.5 V	Other uPs/uCs/Peripheral ICs	1 mm	S-PBGA-B516	3	Not Qualified	e2
T1024NXN7PQA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V			GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm		30	250	23 mm	CMOS	1 V		.8 mm	S-PBGA-B780	3		e1
ATBTLC1000A-UU-T	Microchip Technology	SoC		BALL	31	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	4.3 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA31,9X7,14	1.8 V	85 Cel	-40 Cel		BOTTOM	.541 mm	2.142 mm				2.282 mm	CMOS	3.6 V		.35 mm	R-PBGA-B31
LS1043AXE7MQB	NXP Semiconductors	SoC		BALL	621		SQUARE	PLASTIC/EPOXY	YES							105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.92 mm	21 mm		30	250	21 mm	CMOS			.8 mm	S-PBGA-B621	3		e1
10AS016E4F29I3LG	Intel	SoC		BALL	780	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY	BGA780,28X28,40	.87 V	100 Cel	-40 Cel		BOTTOM	3.35 mm	29 mm				29 mm	TSMC	.9 V		1 mm	S-PBGA-B780
88AP270MA2-BHE1C520	Marvell Technology	SoC		BALL			SQUARE	PLASTIC/EPOXY	YES	3.3 V		1.8/3.3			1.8 V	85 Cel	-25 Cel	TIN SILVER COPPER	BOTTOM							CMOS		Graphics Processors				Not Qualified	e1
EFR32MG24B010F1024IM48-B	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	125 Cel	-40 Cel		QUAD	.9 mm	6 mm				6 mm	CMOS	3 V		.4 mm	S-XQCC-N48
88AP270MA2-BHE1C416	Marvell Technology	SoC		BALL			SQUARE	PLASTIC/EPOXY	YES	3.3 V		1.8/3.3			1.8 V	85 Cel	-25 Cel	TIN SILVER COPPER	BOTTOM							CMOS		Graphics Processors				Not Qualified	e1
MCIMX534AVP8C2	NXP Semiconductors	SoC	AUTOMOTIVE	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.15 V	AEC-Q100		GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.05 V	125 Cel	-40 Cel		BOTTOM	1.85 mm	19 mm				19 mm	CMOS	1.1 V		.8 mm	S-PBGA-B529
5CSEBA2U19C8SN	Intel	SoC
MCIMX6D6AVT10AE	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3		e1
SA8155P	Qualcomm	SoC		BALL	989	BGA	SQUARE	PLASTIC/EPOXY	YES		AEC-Q100		GRID ARRAY			105 Cel	-40 Cel		BOTTOM							CMOS				S-PBGA-B989
10AS016E4F27E3SG	Intel	SoC		BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY	BGA672,26X26,40	.87 V	100 Cel	0 Cel		BOTTOM	3.35 mm	27 mm				27 mm	TSMC	.9 V		1 mm	S-PBGA-B672
10AS016E3F27E2SG	Intel	SoC		BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY	BGA672,26X26,40	.87 V	100 Cel	0 Cel		BOTTOM	3.35 mm	27 mm	ALSO OPERATES AT 0.95V NOMINAL SUPPLY			27 mm	TSMC	.9 V		1 mm	S-PBGA-B672
CYB06447BZI-D54	Infineon Technologies	SoC																TIN SILVER COPPER													3		e1
MGM220PC22HNA2	Silicon Labs	SoC		NO LEAD	31	XMA	RECTANGULAR	UNSPECIFIED	YES	3.8 V			MICROELECTRONIC ASSEMBLY		1.8 V	105 Cel	-40 Cel		UNSPECIFIED	2.4 mm	12.9 mm	ALSO OPERATES WITH 2.2VMIN SUPPLY IN REGULATION MODE			15 mm	CMOS	3 V		1.2 mm	R-XXMA-N31	3
10AS027E2F27E2LG	Intel	SoC		BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY	BGA672,26X26,40	.87 V	100 Cel	0 Cel		BOTTOM	3.35 mm	27 mm	ALSO OPERATES AT 0.95V NOMINAL SUPPLY			27 mm	TSMC	.9 V		1 mm	S-PBGA-B672
10AS027E3F29E2LG	Intel	SoC		BALL	780	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY	BGA780,28X28,40	.87 V	100 Cel	0 Cel		BOTTOM	3.35 mm	29 mm	ALSO OPERATES AT 0.95V NOMINAL SUPPLY			29 mm	TSMC	.9 V		1 mm	S-PBGA-B780
5CSEBA6U19I7SN	Intel	SoC
5CSXFC6C6U23C6N	Intel	SoC
88AP270MA2-BHE1E312	Marvell Technology	SoC	INDUSTRIAL	BALL			SQUARE	PLASTIC/EPOXY	YES	3.3 V		1.8/3.3			1.8 V			TIN SILVER COPPER	BOTTOM							CMOS		Graphics Processors				Not Qualified	e1
10AS016C3U19E2LG	Intel	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY, FINE PITCH	BGA484,22X22,32	.87 V	100 Cel	0 Cel		BOTTOM	3.25 mm	19 mm	ALSO OPERATES AT 0.95V NOMINAL SUPPLY			19 mm	TSMC	.9 V		.8 mm	S-PBGA-B484
10AS016E4F29E3SG	Intel	SoC		BALL	780	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY	BGA780,28X28,40	.87 V	100 Cel	0 Cel		BOTTOM	3.35 mm	29 mm				29 mm	TSMC	.9 V		1 mm	S-PBGA-B780
10AS048E3F29E2LG	Intel	SoC		BALL	780	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY	BGA780,28X28,40	.87 V	100 Cel	0 Cel		BOTTOM	3.35 mm	29 mm	ALSO OPERATES AT 0.95V NOMINAL SUPPLY			29 mm	TSMC	.9 V		1 mm	S-PBGA-B780
5CSEBA2U23C8N	Intel	SoC
5CSEBA4U19A7N	Intel	SoC
5CSEBA4U23C8SN	Intel	SoC
5CSEBA6U23A7N	Intel	SoC
5CSXFC6C6U23C7N	Intel	SoC
88AP162-B0-BJD2C004	Marvell Technology	SoC		BALL			SQUARE	PLASTIC/EPOXY	YES	3.3 V					1.8 V	85 Cel	-25 Cel		BOTTOM							CMOS
88AP168-B0-BJD2C010	Marvell Technology	SoC		BALL			SQUARE	PLASTIC/EPOXY	YES	3.3 V					1.8 V				BOTTOM							CMOS
CY8C6245AZI-S3D72	Infineon Technologies	SoC		GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V			FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.7 V	85 Cel	-40 Cel	PURE TIN	QUAD	1.6 mm	14 mm				14 mm	CMOS	1.8 V		.5 mm	S-PQFP-G100	3
EFR32FG13P231F512GM48-D	Silicon Labs	SoC																MATTE TIN					40	260							2
EFR32FG13P233F512GM48-D	Silicon Labs	SoC																MATTE TIN					40	260							2
EFR32FG1P131F256GM32-C0R	Silicon Labs	SoC		NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.85 V	85 Cel	-40 Cel		QUAD	.9 mm	5 mm				5 mm	CMOS	3.3 V		.5 mm	S-XQCC-N32
EFR32FG23A010F512GM48-C	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	85 Cel	-40 Cel		QUAD	.9 mm	6 mm				6 mm	CMOS	3.3 V		.4 mm	S-XQCC-N48
EFR32MG1B132F256GM32-C0	Silicon Labs	SoC		NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.85 V	85 Cel	-40 Cel		QUAD	.9 mm	5 mm				5 mm	CMOS	3.3 V		.5 mm	S-XQCC-N32
EFR32MG1B132F256GM48-C0R	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	1.85 V	85 Cel	-40 Cel		QUAD	.9 mm	7 mm				7 mm	CMOS	3.3 V		.5 mm	S-XQCC-N48
EFR32MG24A010F1024IM48-B	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	125 Cel	-40 Cel		QUAD	.9 mm	6 mm				6 mm	CMOS	3 V		.4 mm	S-XQCC-N48
EFR32MG24A410F1536IM40-B	Silicon Labs	SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	1.71 V	125 Cel	-40 Cel		QUAD	.9 mm	5 mm				5 mm	CMOS	3 V		.4 mm	S-XQCC-N40
EFR32MG24B010F1536IM48-B	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	125 Cel	-40 Cel		QUAD	.9 mm	6 mm				6 mm	CMOS	3 V		.4 mm	S-XQCC-N48
EFR32MG24B020F1024IM48-B	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	125 Cel	-40 Cel		QUAD	.9 mm	6 mm				6 mm	CMOS	3 V		.4 mm	S-XQCC-N48
EFR32MG24B020F1536IM48-B	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	125 Cel	-40 Cel		QUAD	.9 mm	6 mm				6 mm	CMOS	3 V		.4 mm	S-XQCC-N48
MCIMX6DP7CVT8AB	NXP Semiconductors	SoC	INDUSTRIAL	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, HEAT SINK/SLUG	BGA624,25X25,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS	1.4 V		.8 mm	S-PBGA-B624	3		e1
10AS016E4F27E3LG	Intel	SoC		BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY	BGA672,26X26,40	.87 V	100 Cel	0 Cel		BOTTOM	3.35 mm	27 mm				27 mm	TSMC	.9 V		1 mm	S-PBGA-B672
10AS027H2F34E2LG	Intel	SoC		BALL	1152	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY	BGA1152,34X34,40	.87 V	100 Cel	0 Cel		BOTTOM	3.35 mm	35 mm	ALSO OPERATES AT 0.95V NOMINAL SUPPLY			35 mm	TSMC	.9 V		1 mm	S-PBGA-B1152
10AS032E4F29E3SG	Intel	SoC		BALL	780	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V			GRID ARRAY	BGA780,28X28,40	.87 V	100 Cel	0 Cel		BOTTOM	3.35 mm	29 mm				29 mm	TSMC	.9 V		1 mm	S-PBGA-B780

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.