Qualcomm - SA8155P

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SA8155P by Qualcomm

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Manufacturer Qualcomm
Manufacturer's Part Number SA8155P
Description SoC; Terminal Form: BALL; No. of Terminals: 989; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
Datasheet SA8155P Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: SoC
Surface Mount: YES
Minimum Operating Temperature: -40 Cel
No. of Terminals: 989
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Screening Level: AEC-Q100
Technology: CMOS
JESD-30 Code: S-PBGA-B989
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 105 Cel
Package Code: BGA
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