Freescale Semiconductor - MCIMX6Q5EYM12AC

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MCIMX6Q5EYM12AC by Freescale Semiconductor

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Manufacturer Freescale Semiconductor
Manufacturer's Part Number MCIMX6Q5EYM12AC
Description SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;
Datasheet MCIMX6Q5EYM12AC Datasheet
In Stock225
NAME DESCRIPTION
Other Names: 935319908557
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: SYSTEM ON CHIP
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Seated Height: 1.6 mm
Surface Mount: YES
Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)
JESD-609 Code: e1
Minimum Operating Temperature: -20 Cel
No. of Terminals: 624
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH
Length: 21 mm
Technology: CMOS
JESD-30 Code: S-PBGA-B624
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 105 Cel
Peak Reflow Temperature (C): 260
Package Code: LFBGA
Width: 21 mm
Terminal Pitch: .8 mm
Moisture Sensitivity Level (MSL): 3
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