SoC Other Function uPs,uCs & Peripheral ICs 1,214

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code
STA1085EOA3TR	STMicroelectronics	SoC																		NOT SPECIFIED	NOT SPECIFIED
STA1085ELA3S1	STMicroelectronics	SoC																		NOT SPECIFIED	NOT SPECIFIED
STA1085PUA3S1TR	STMicroelectronics	SoC
STA1085POA3TR	STMicroelectronics	SoC																		NOT SPECIFIED	NOT SPECIFIED
STA1085POA	STMicroelectronics	SoC																		NOT SPECIFIED	NOT SPECIFIED
STA1085EOA3	STMicroelectronics	SoC																		NOT SPECIFIED	NOT SPECIFIED
STA1085ELA	STMicroelectronics	SoC																		NOT SPECIFIED	NOT SPECIFIED
STA1085EOATR	STMicroelectronics	SoC																		NOT SPECIFIED	NOT SPECIFIED
STA1085ELA3TR	STMicroelectronics	SoC																		NOT SPECIFIED	NOT SPECIFIED
STA1085HOCTR	STMicroelectronics	SoC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel	-40 Cel		BOTTOM	1.7 mm	16 mm	NOT SPECIFIED	NOT SPECIFIED	16 mm	CMOS		.8 mm	S-PBGA-B361
STA1085EOA	STMicroelectronics	SoC																		NOT SPECIFIED	NOT SPECIFIED
ST4SIM-201S	STMicroelectronics	SoC
ST4SIM-201A	STMicroelectronics	SoC
T1024NSEC4PNA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	1 V	.8 mm	S-PBGA-B780
T1014NXEC4MNA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	1 V	.8 mm	S-PBGA-B780
T1024NXNC4KQA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	1 V	.8 mm	S-PBGA-B780
S32G233AABK0CUCT	NXP Semiconductors	SoC	INDUSTRIAL																	40	260						3
T1024NXEC4KNA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	1 V	.8 mm	S-PBGA-B780
T1014NXE7MQA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm	30	250	23 mm	CMOS	1 V	.8 mm	S-PBGA-B780	3	e1
S32G233AABK0CUCR	NXP Semiconductors	SoC	INDUSTRIAL																	40	260						3
S32G233ASAK0CUCR	NXP Semiconductors	SoC	INDUSTRIAL
T1014NXE7PNA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	1 V	.8 mm	S-PBGA-B780
T1024NSE7PQA	NXP Semiconductors	SoC	OTHER	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm	30	250	23 mm	CMOS	1 V	.8 mm	S-PBGA-B780	3	e1
T1024NXNC4KNA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	1 V	.8 mm	S-PBGA-B780
T1024NSNC4KNA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	1 V	.8 mm	S-PBGA-B780
T1014NSN7MNA	NXP Semiconductors	SoC	OTHER	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	1 V	.8 mm	S-PBGA-B780
T1024NSNC4KQA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	1 V	.8 mm	S-PBGA-B780
88MW322-A0-NXUC/AZ	NXP Semiconductors	SoC	COMMERCIAL																		260						3
S32G234MAAK0CUCT	NXP Semiconductors	SoC	INDUSTRIAL
T1024NSEC4KQA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	1 V	.8 mm	S-PBGA-B780
T1014NSE7KNA	NXP Semiconductors	SoC	OTHER	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm			23 mm	CMOS	1 V	.8 mm	S-PBGA-B780	3	e1
T1014NSN7PNA	NXP Semiconductors	SoC	OTHER	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	1 V	.8 mm	S-PBGA-B780
T1024NSN7PNA	NXP Semiconductors	SoC	OTHER	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	1 V	.8 mm	S-PBGA-B780
T1014NXN7PNA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	1 V	.8 mm	S-PBGA-B780
T1024NSNC4PQA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	1 V	.8 mm	S-PBGA-B780
T1014NXE7KQA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm	30	250	23 mm	CMOS	1 V	.8 mm	S-PBGA-B780	3	e1
S32G254AAAK0VUCR	NXP Semiconductors	SoC	INDUSTRIAL
T1014NXN7KQA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm	30	250	23 mm	CMOS	1 V	.8 mm	S-PBGA-B780	3	e1
S32G233ASBK0CUCT	NXP Semiconductors	SoC	INDUSTRIAL
S32G233ASAK0CUCT	NXP Semiconductors	SoC	INDUSTRIAL
T1024NSNC4MNA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	1 V	.8 mm	S-PBGA-B780
T1024NSEC4PQA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	1 V	.8 mm	S-PBGA-B780
S32G234MABK0CUCT	NXP Semiconductors	SoC	INDUSTRIAL
T1024NXN7KNA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	1 V	.8 mm	S-PBGA-B780
T1014NSEC4KQA	NXP Semiconductors	SoC		BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	1 V	.8 mm	S-PBGA-B780
S32G254ASAK0CUCR	NXP Semiconductors	SoC	INDUSTRIAL
T1024NSN7KQA	NXP Semiconductors	SoC	OTHER	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	23 mm	30	250	23 mm	CMOS	1 V	.8 mm	S-PBGA-B780	3	e1
T1014NSN7KNA	NXP Semiconductors	SoC	OTHER	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	0 Cel		BOTTOM	2.07 mm	23 mm			23 mm	CMOS	1 V	.8 mm	S-PBGA-B780

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.