SoC Other Function uPs,uCs & Peripheral ICs 1,214

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Sub-Category	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
MIMX9352CVUXMAA	NXP Semiconductors	SoC
D2-92683-QR-T	Renesas Electronics	SoC	OTHER	NO LEAD	72	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1.9 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	85 Cel	-10 Cel	MATTE TIN	QUAD	.9 mm	10 mm		30	260	10 mm	CMOS	1.8 V		.5 mm	S-PQCC-N72	3		e3
EFR32MG24B210F1536IM48-B	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	125 Cel	-40 Cel		QUAD	.9 mm	6 mm				6 mm	CMOS	3 V		.4 mm	S-XQCC-N48
MCIMX6Q6AVT10AE	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, FINE PITCH	BGA624,25X25,32	1.35 V	125 Cel	-40 Cel		BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3
MPFS250T-1FCVG484E	Microchip Technology	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	0 Cel		BOTTOM	2.92 mm	19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY			19 mm	CMOS	1 V		.8 mm	S-PBGA-B484
AM6231ATGGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM	.89 mm	13 mm				13 mm	CMOS	.75 V		.5 mm	S-PBGA-B425
EFR32MG24A010F1536IM48-B	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	125 Cel	-40 Cel		QUAD	.9 mm	6 mm				6 mm	CMOS	3 V		.4 mm	S-XQCC-N48
EFR32MG24B310F1536IM48-B	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	125 Cel	-40 Cel		QUAD	.9 mm	6 mm				6 mm	CMOS	3 V		.4 mm	S-XQCC-N48
M1A3P600L-1FGG484I	Microchip Technology	SoC															TIN SILVER COPPER					30	250							3
MCIMX6QP5EYM1AA	NXP Semiconductors	SoC	OTHER	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	EACH GPIO MODULE SUPPORTS 32 BITS OF I/O.	40	260	21 mm	CMOS	1.4 V		.8 mm	S-PBGA-B624	3		e1
MCIMX6Y2CVM05AA	NXP Semiconductors	SoC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.275 V	105 Cel	-40 Cel		BOTTOM	1.32 mm	14 mm		40	260	14 mm	CMOS			.8 mm	S-PBGA-B289
MIMX8MM4DVTLZAA	NXP Semiconductors	SoC	OTHER	BALL	486	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA486,27X27,20	.95 V	95 Cel	0 Cel	TIN SILVER	BOTTOM	1.25 mm	14 mm		40	260	14 mm	CMOS	1 V		.5 mm	S-PBGA-B486	3		e2
5CSEBA5U23I7N	Intel	SoC
EFR32MG24A010F1536IM40-B	Silicon Labs	SoC		NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	1.71 V	125 Cel	-40 Cel		QUAD	.9 mm	5 mm				5 mm	CMOS	3 V		.4 mm	S-XQCC-N40
MCIMX6Z0DVM09AB	NXP Semiconductors	SoC		BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.375 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.32 mm	14 mm		40	260	14 mm	CMOS			.8 mm	S-PBGA-B289	3		e1
5CSEBA6U23I7N	Intel	SoC
MCIMX6QP7CVT8AB	NXP Semiconductors	SoC		BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, HEAT SINK/SLUG	BGA624,25X25,32	1.275 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm	21 mm		40	260	21 mm	CMOS	1.4 V		.8 mm	S-PBGA-B624	3		e1
MV78460-B0-BJR4C160	Marvell Technology	SoC		BALL	732	FBGA	SQUARE	PLASTIC/EPOXY	YES	.95 V		GRID ARRAY, FINE PITCH	BGA732,48X48,18	.85 V	105 Cel	0 Cel		BOTTOM	2.01 mm	23 mm				23 mm	CMOS	.9 V		.65 mm	S-PBGA-B732
EFR32BG24B210F1024IM48-B	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	125 Cel	-40 Cel		QUAD	.9 mm	6 mm				6 mm	CMOS	3 V		.4 mm	S-XQCC-N48
453-00052R	Laird Technologies	SoC
CC2340R52E0RKPR	Texas Instruments	SoC		NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	1.71 V	125 Cel	-40 Cel		QUAD	1 mm	5 mm				5 mm	CMOS	1.8 V		.4 mm	S-PQCC-N40
EFR32MG24B120F1536IM48-B	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	125 Cel	-40 Cel		QUAD	.9 mm	6 mm				6 mm	CMOS	3 V		.4 mm	S-XQCC-N48
453-00068R	Laird Technologies	SoC
5CSXFC6C6U23I7N	Intel	SoC
MIMXRT1064CVJ5A	NXP Semiconductors	SoC	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,31	1.15 V	105 Cel	-40 Cel		BOTTOM	1.52 mm	12 mm		40	260	12 mm	CMOS			.8 mm	S-PBGA-B196	3
MCIMX6X3EVN10AB	NXP Semiconductors	SoC	COMMERCIAL EXTENDED	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.53 mm	17 mm		40	260	17 mm	CMOS			.8 mm	S-PBGA-B400	3		e1
10AS066N3F40E2LG	Intel	SoC		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY	BGA1517,39X39,40	.87 V	100 Cel	0 Cel		BOTTOM	3.35 mm	40 mm	ALSO OPERATES AT 0.95V NOMINAL SUPPLY			40 mm	TSMC	.9 V		1 mm	S-PBGA-B1517
AM6232ASGGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM	.89 mm	13 mm				13 mm	CMOS	.75 V		.5 mm	S-PBGA-B425
C8051F064-GQ	Silicon Labs	SoC	INDUSTRIAL								3						MATTE TIN						260				Microcontrollers			3	Not Qualified	e3
AM6231AGGGGHALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	95 Cel	0 Cel		BOTTOM	.89 mm	13 mm				13 mm	CMOS	.75 V		.5 mm	S-PBGA-B425
10AS032E4F29I3SG	Intel	SoC		BALL	780	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V		GRID ARRAY	BGA780,28X28,40	.87 V	100 Cel	-40 Cel		BOTTOM	3.35 mm	29 mm				29 mm	TSMC	.9 V		1 mm	S-PBGA-B780
5CSEMA5F31I7N	Intel	SoC
MPC8248CVRTIEA	NXP Semiconductors	SoC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	1.575 V	1.5,3.3	GRID ARRAY	BGA516,26X26,40	1.425 V	105 Cel	-40 Cel	TIN SILVER	BOTTOM	2.55 mm	27 mm		30	245	27 mm	CMOS	1.5 V	Other uPs/uCs/Peripheral ICs	1 mm	S-PBGA-B516	3	Not Qualified	e2
MPFS250TS-1FCVG484I	Microchip Technology	SoC		BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, FINE PITCH	BGA484,22X22,32	.97 V	100 Cel	-40 Cel		BOTTOM	2.92 mm	19 mm	ALSO OPERATES AT 1.05V NOMINAL SUPPLY			19 mm	CMOS	1 V		.8 mm	S-PBGA-B484
5CSEBA2U23A7N	Intel	SoC
5CSEBA5U19I7N	Intel	SoC
ATSAM4C8CB-AU	Microchip Technology	SoC	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.32 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.08 V	85 Cel	-40 Cel	MATTE TIN	QUAD	1.6 mm	14 mm		40	260	14 mm	CMOS	1.2 V		.5 mm	S-PQFP-G100	3		e3
ESP32-WROOM-32UE-H4	Espressif Systems (Shanghai)	SoC		NO LEAD	38	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V		MICROELECTRONIC ASSEMBLY		3 V	105 Cel	-40 Cel		UNSPECIFIED	3.35 mm	18 mm		30	250	19.2 mm	CMOS	3.3 V		1.27 mm	R-XXMA-N38	3
S32G234MABK0VUCR	NXP Semiconductors	SoC	INDUSTRIAL																			40	260							3
5CSEBA6U23C6N	Intel	SoC
5CSEBA6U23I7SN	Intel	SoC
MIMX8MQ5DVAJZAB	NXP Semiconductors	SoC																				40	260							3
MCIMX6S5DVM10ADR	NXP Semiconductors	SoC		BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm		40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3		e1
MCIMX6S5DVM10ACR	NXP Semiconductors	SoC		BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm		40	260	21 mm	CMOS			.8 mm	S-PBGA-B624	3		e1
AM6234ATCGHAALW	Texas Instruments	SoC		BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM	.89 mm	13 mm			250	13 mm	CMOS	.75 V		.5 mm	S-PBGA-B425	3
CY8C6244AZI-S4D92	Infineon Technologies	SoC		GULL WING	64	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	HQFP64,.47SQ,20	1.7 V	85 Cel	-40 Cel		QUAD	1.6 mm	10 mm				10 mm	CMOS	1.8 V		.5 mm	S-PQFP-G64	3
EFR32FG23A010F256GM48-C	Silicon Labs	SoC		NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	85 Cel	-40 Cel		QUAD	.9 mm	6 mm				6 mm	CMOS	3.3 V		.4 mm	S-XQCC-N48
P1015NSN5DFB	NXP Semiconductors	SoC		BALL	561	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, FINE PITCH	BGA561,27X27,32	.95 V	125 Cel	0 Cel		BOTTOM	1.79 mm	23 mm		40	260	23 mm	CMOS	1 V		.8 mm	S-PBGA-B561	3

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.