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| Manufacturer | Intel |
|---|---|
| Manufacturer's Part Number | 10AS032E4F29I3SG |
| Description | SoC; Terminal Form: BALL; No. of Terminals: 780; Package Code: BGA; Package Shape: SQUARE; Length: 29 mm; |
| Datasheet | 10AS032E4F29I3SG Datasheet |
| In Stock | 3 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | .87 V |
| Package Body Material: | PLASTIC/EPOXY |
| Peripheral IC Type: | SoC |
| Nominal Supply Voltage: | .9 V |
| Maximum Supply Voltage: | .93 V |
| Maximum Seated Height: | 3.35 mm |
| Surface Mount: | YES |
| Minimum Operating Temperature: | -40 Cel |
| No. of Terminals: | 780 |
| Package Equivalence Code: | BGA780,28X28,40 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Length: | 29 mm |
| Technology: | TSMC |
| JESD-30 Code: | S-PBGA-B780 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 100 Cel |
| Package Code: | BGA |
| Width: | 29 mm |
| Terminal Pitch: | 1 mm |









