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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | MCIMX6Q7CZK08AD |
| Description | SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 569; Package Code: LFBGA; Package Shape: SQUARE; |
| Datasheet | MCIMX6Q7CZK08AD Datasheet |
| In Stock | 362 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 1.275 V |
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 1.4 V |
| Maximum Time At Peak Reflow Temperature (s): | 40 |
| Maximum Seated Height: | 1.25 mm |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER COPPER |
| No. of Terminals: | 569 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B569 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 105 Cel |
| Package Code: | LFBGA |
| Width: | 12 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Peripheral IC Type: | SoC |
| Maximum Supply Voltage: | 1.5 V |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | -40 Cel |
| Package Equivalence Code: | BGA569,29X29,16 |
| Length: | 12 mm |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .4 mm |
| Temperature Grade: | INDUSTRIAL |
