NXP Semiconductors - MCIMX6Q7CZK08AD

MCIMX6Q7CZK08AD by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MCIMX6Q7CZK08AD
Description SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 569; Package Code: LFBGA; Package Shape: SQUARE;
Datasheet MCIMX6Q7CZK08AD Datasheet
In Stock362
NAME DESCRIPTION
Minimum Supply Voltage: 1.275 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.4 V
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Seated Height: 1.25 mm
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 569
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: S-PBGA-B569
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 105 Cel
Package Code: LFBGA
Width: 12 mm
Moisture Sensitivity Level (MSL): 3
Peripheral IC Type: SoC
Maximum Supply Voltage: 1.5 V
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
Package Equivalence Code: BGA569,29X29,16
Length: 12 mm
Peak Reflow Temperature (C): 260
Terminal Pitch: .4 mm
Temperature Grade: INDUSTRIAL
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Pricing (USD)

Qty. Unit Price Ext. Price
362 $47.080 $17,042.960

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