AM68A92ATGGHAALZR by Texas Instruments | Peripheral ICs

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Manufacturer	Texas Instruments
Manufacturer's Part Number	AM68A92ATGGHAALZR
Description	SoC; Terminal Form: BALL; No. of Terminals: 770; Package Code: FBGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;
Datasheet	AM68A92ATGGHAALZR Datasheet
In Stock	3,800

NAME	DESCRIPTION
Minimum Supply Voltage:	.76 V
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	.8 V
Maximum Time At Peak Reflow Temperature (s):	30
Maximum Seated Height:	2.57 mm
Surface Mount:	YES
No. of Terminals:	770
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, FINE PITCH
Technology:	CMOS
JESD-30 Code:	S-PBGA-B770
Package Shape:	SQUARE
Terminal Form:	BALL
Maximum Operating Temperature:	105 Cel
Package Code:	FBGA
Width:	23 mm
Moisture Sensitivity Level (MSL):	3
Other Names:	296-AM68A92ATGGHAALZRTR 296-AM68A92ATGGHAALZRCT 296-AM68A92ATGGHAALZRDKR
Peripheral IC Type:	SoC
Maximum Supply Voltage:	.84 V
Minimum Operating Temperature:	-40 Cel
Package Equivalence Code:	BGA770,28X28,32
Length:	23 mm
Peak Reflow Temperature (C):	260
Terminal Pitch:	.8 mm

Pricing (USD)

Qty.	Unit Price	Ext. Price
3,800	$96.613	$367,129.400

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