
Image shown is a representation only.
Manufacturer | Texas Instruments |
---|---|
Manufacturer's Part Number | AM68A92ATGGHAALZR |
Description | SoC; Terminal Form: BALL; No. of Terminals: 770; Package Code: FBGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3; |
Datasheet | AM68A92ATGGHAALZR Datasheet |
In Stock | 3,800 |
NAME | DESCRIPTION |
---|---|
Minimum Supply Voltage: | .76 V |
Package Body Material: | PLASTIC/EPOXY |
Peripheral IC Type: | SoC |
Nominal Supply Voltage: | .8 V |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Supply Voltage: | .84 V |
Maximum Seated Height: | 2.57 mm |
Surface Mount: | YES |
Minimum Operating Temperature: | -40 Cel |
No. of Terminals: | 770 |
Package Equivalence Code: | BGA770,28X28,32 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, FINE PITCH |
Length: | 23 mm |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B770 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 105 Cel |
Peak Reflow Temperature (C): | 260 |
Package Code: | FBGA |
Width: | 23 mm |
Terminal Pitch: | .8 mm |
Moisture Sensitivity Level (MSL): | 3 |