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| Manufacturer | Freescale Semiconductor |
|---|---|
| Manufacturer's Part Number | MPC8548ECHXAQG |
| Description | SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 783; Package Code: BGA; Package Shape: SQUARE; |
| Datasheet | MPC8548ECHXAQG Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 1.045 V |
| Package Body Material: | CERAMIC, METAL-SEALED COFIRED |
| Nominal Supply Voltage: | 1.1 V |
| Maximum Time At Peak Reflow Temperature (s): | 40 |
| Maximum Seated Height: | 3.38 mm |
| Sub-Category: | Microprocessors |
| Surface Mount: | YES |
| Terminal Finish: | Tin/Lead/Silver (Sn/Pb/Ag) |
| No. of Terminals: | 783 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Technology: | CMOS |
| JESD-30 Code: | S-CBGA-B783 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 105 Cel |
| Package Code: | BGA |
| Width: | 29 mm |
| Moisture Sensitivity Level (MSL): | 1 |
| Peripheral IC Type: | SoC |
| Maximum Supply Voltage: | 1.155 V |
| JESD-609 Code: | e0 |
| Minimum Operating Temperature: | -40 Cel |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA783,28X28,40 |
| Length: | 29 mm |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | 1 mm |
| Temperature Grade: | INDUSTRIAL |
| Power Supplies (V): | 1.1,1.8/2.5,2.5/3.3 |
