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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | MIMXRT1064DVL6BR |
| Description | SoC; Terminal Form: BALL; No. of Terminals: 196; Package Code: LFBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH; |
| Datasheet | MIMXRT1064DVL6BR Datasheet |
| In Stock | 2,221 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 1.15 V |
| Other Names: |
935399271518 568-MIMXRT1064DVL6BRTR |
| Package Body Material: | PLASTIC/EPOXY |
| Peripheral IC Type: | SoC |
| Maximum Time At Peak Reflow Temperature (s): | 40 |
| Maximum Supply Voltage: | 1.26 V |
| Maximum Seated Height: | 1.43 mm |
| Surface Mount: | YES |
| Minimum Operating Temperature: | 0 Cel |
| No. of Terminals: | 196 |
| Package Equivalence Code: | BGA196,14X14,25 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Length: | 10 mm |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B196 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 95 Cel |
| Peak Reflow Temperature (C): | 260 |
| Package Code: | LFBGA |
| Width: | 10 mm |
| Terminal Pitch: | .65 mm |
| Moisture Sensitivity Level (MSL): | 3 |









