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Manufacturer | NXP Semiconductors |
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Manufacturer's Part Number | MIMXRT1064DVL6BR |
Description | SoC; Terminal Form: BALL; No. of Terminals: 196; Package Code: LFBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH; |
Datasheet | MIMXRT1064DVL6BR Datasheet |
In Stock | 2,221 |
NAME | DESCRIPTION |
---|---|
Minimum Supply Voltage: | 1.15 V |
Package Body Material: | PLASTIC/EPOXY |
Peripheral IC Type: | SoC |
Maximum Time At Peak Reflow Temperature (s): | 40 |
Maximum Supply Voltage: | 1.26 V |
Maximum Seated Height: | 1.43 mm |
Surface Mount: | YES |
Minimum Operating Temperature: | 0 Cel |
No. of Terminals: | 196 |
Package Equivalence Code: | BGA196,14X14,25 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
Length: | 10 mm |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B196 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 95 Cel |
Peak Reflow Temperature (C): | 260 |
Package Code: | LFBGA |
Width: | 10 mm |
Terminal Pitch: | .65 mm |
Moisture Sensitivity Level (MSL): | 3 |