COMMERCIAL Other Function uPs,uCs & Peripheral ICs 2,400+

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

MC68153L

NXP Semiconductors

COMMERCIAL

THROUGH-HOLE

40

DIP

RECTANGULAR

CERAMIC

NO

5

IN-LINE

DIP40,.6

70 Cel

0 Cel

DUAL

MOS

385 mA

5 V

Other uPs/uCs/Peripheral ICs

2.54 mm

R-XDIP-T40

Not Qualified

MPC8272VRPIE

NXP Semiconductors

COMMERCIAL

BALL

516

BGA

SQUARE

PLASTIC/EPOXY

YES

1.5,3.3

GRID ARRAY

BGA516,26X26,40

70 Cel

0 Cel

BOTTOM

CMOS

Other uPs/uCs/Peripheral ICs

1 mm

S-PBGA-B516

Not Qualified

MPC8271VRMIB

NXP Semiconductors

COMMERCIAL

BALL

516

BGA

SQUARE

PLASTIC/EPOXY

YES

1.5,3.3

GRID ARRAY

BGA516,26X26,40

70 Cel

0 Cel

BOTTOM

CMOS

Other uPs/uCs/Peripheral ICs

1 mm

S-PBGA-B516

Not Qualified

MPC8272ZQPIE

NXP Semiconductors

COMMERCIAL

BALL

516

BGA

SQUARE

PLASTIC/EPOXY

YES

1.5,3.3

GRID ARRAY

BGA516,26X26,40

70 Cel

0 Cel

BOTTOM

CMOS

Other uPs/uCs/Peripheral ICs

1 mm

S-PBGA-B516

Not Qualified

MC68302FC20

NXP Semiconductors

COMMERCIAL

GULL WING

132

BQFP

SQUARE

PLASTIC/EPOXY

YES

5

FLATPACK

SPQFP132,1.1SQ

70 Cel

0 Cel

QUAD

CMOS

5 V

Other uPs/uCs/Peripheral ICs

.635 mm

S-PQFP-G132

Not Qualified

MPC8247VRMIB

NXP Semiconductors

COMMERCIAL

BALL

516

BGA

SQUARE

PLASTIC/EPOXY

YES

1.5,3.3

GRID ARRAY

BGA516,26X26,40

70 Cel

0 Cel

BOTTOM

CMOS

Other uPs/uCs/Peripheral ICs

1 mm

S-PBGA-B516

Not Qualified

LH79520N0M000B1

NXP Semiconductors

COMMERCIAL

GULL WING

176

QFP

SQUARE

PLASTIC/EPOXY

YES

1.8,3.3

FLATPACK

QFP176,.87SQ,16

70 Cel

0 Cel

QUAD

Other uPs/uCs/Peripheral ICs

.4 mm

S-PQFP-G176

Not Qualified

MCIMX283DVM4C

NXP Semiconductors

SYSTEM ON CHIP

COMMERCIAL

BALL

289

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.55 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA289,17X17,32

1.35 V

70 Cel

-20 Cel

TIN SILVER COPPER

BOTTOM

1.37 mm

14 mm

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

40

260

14 mm

CMOS

1.45 V

.8 mm

S-PBGA-B289

3

e1

MCIMX507CVK1B

NXP Semiconductors

SYSTEM ON CHIP

COMMERCIAL

BALL

416

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.275 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA416,24X24,20

1.175 V

70 Cel

0 Cel

BOTTOM

1.52 mm

13 mm

13 mm

CMOS

1.225 V

.5 mm

S-PBGA-B416

Not Qualified

MCIMX508CVK1B

NXP Semiconductors

SYSTEM ON CHIP

COMMERCIAL

BALL

416

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.275 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA416,24X24,20

1.175 V

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.52 mm

13 mm

40

260

13 mm

CMOS

1.225 V

.5 mm

S-PBGA-B416

3

Not Qualified

e1

MCIMX507CVM8B

NXP Semiconductors

SYSTEM ON CHIP

COMMERCIAL

BALL

400

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.275 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA400,20X20,32

1.175 V

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.6 mm

17 mm

ALSO OPERATES AT 0.9 V MINIMUM SUPPLY 24 MHZ

40

260

17 mm

CMOS

1.225 V

.8 mm

S-PBGA-B400

3

Not Qualified

e1

MCIMX6G0DVM05AA

NXP Semiconductors

SYSTEM ON CHIP

COMMERCIAL

BALL

289

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.3 V

GRID ARRAY

BGA289,17X17,32

1.15 V

95 Cel

0 Cel

BOTTOM

1.32 mm

14 mm

40

260

14 mm

CMOS

.8 mm

S-PBGA-B289

3

MCIMX507CVK8B

NXP Semiconductors

SYSTEM ON CHIP

COMMERCIAL

BALL

416

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA416,24X24,20

.95 V

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.52 mm

13 mm

40

260

13 mm

CMOS

1.05 V

.5 mm

S-PBGA-B416

3

Not Qualified

e1

MCIMX508CVK8BR2

NXP Semiconductors

SYSTEM ON CHIP

COMMERCIAL

BALL

416

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA416,24X24,20

.95 V

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.52 mm

13 mm

40

260

13 mm

CMOS

1.05 V

.5 mm

S-PBGA-B416

3

Not Qualified

e1

MCIMX507CVM1BR2

NXP Semiconductors

SYSTEM ON CHIP

COMMERCIAL

BALL

400

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.35 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA400,20X20,32

1.2 V

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.6 mm

17 mm

40

260

17 mm

CMOS

1.275 V

.8 mm

S-PBGA-B400

3

Not Qualified

e1

MCIMX507CVM1B

NXP Semiconductors

SYSTEM ON CHIP

COMMERCIAL

BALL

400

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.35 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA400,20X20,32

1.2 V

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.6 mm

17 mm

40

260

17 mm

CMOS

1.275 V

.8 mm

S-PBGA-B400

3

Not Qualified

e1

MCIMX508CVM8B

NXP Semiconductors

SYSTEM ON CHIP

COMMERCIAL

BALL

400

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.275 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA400,20X20,32

1.175 V

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.6 mm

17 mm

ALSO OPERATES AT 0.9 V MINIMUM SUPPLY 24 MHZ

40

260

17 mm

CMOS

1.225 V

.8 mm

S-PBGA-B400

3

Not Qualified

e1

MCIMX507CVK8BR2

NXP Semiconductors

SYSTEM ON CHIP

COMMERCIAL

BALL

416

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA416,24X24,20

.95 V

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.52 mm

13 mm

40

260

13 mm

CMOS

1.05 V

.5 mm

S-PBGA-B416

3

Not Qualified

e1

MCIMX508CVM1B

NXP Semiconductors

SYSTEM ON CHIP

COMMERCIAL

BALL

400

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.275 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA400,20X20,32

1.175 V

70 Cel

0 Cel

BOTTOM

1.6 mm

17 mm

17 mm

CMOS

1.225 V

.8 mm

S-PBGA-B400

Not Qualified

MCIMX508CZK8B

NXP Semiconductors

SYSTEM ON CHIP

COMMERCIAL

BALL

416

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1.275 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA416,24X24,20

1.175 V

70 Cel

0 Cel

BOTTOM

.9 mm

13 mm

13 mm

CMOS

1.225 V

.5 mm

S-PBGA-B416

MCIMX502CVM8B

NXP Semiconductors

SYSTEM ON CHIP

COMMERCIAL

BALL

400

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.275 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA400,20X20,32

1.175 V

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.6 mm

17 mm

ALSO OPERATES AT 0.9 V MINIMUM SUPPLY 24 MHZ

40

260

17 mm

CMOS

1.225 V

.8 mm

S-PBGA-B400

3

Not Qualified

e1

MCIMX280DVM4CR

NXP Semiconductors

SYSTEM ON CHIP

COMMERCIAL

BALL

289

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.55 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA289,17X17,32

1.35 V

70 Cel

-20 Cel

BOTTOM

1.37 mm

14 mm

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

40

260

14 mm

CMOS

1.45 V

.8 mm

S-PBGA-B289

3

MCIMX280DVM4C

NXP Semiconductors

SYSTEM ON CHIP

COMMERCIAL

BALL

289

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.55 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA289,17X17,32

1.35 V

70 Cel

-20 Cel

BOTTOM

1.37 mm

14 mm

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

40

260

14 mm

CMOS

1.45 V

.8 mm

S-PBGA-B289

3

MCIMX508CVM8BR2

NXP Semiconductors

SYSTEM ON CHIP

COMMERCIAL

BALL

400

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA400,20X20,32

.95 V

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.6 mm

17 mm

40

260

17 mm

CMOS

1.05 V

.8 mm

S-PBGA-B400

3

Not Qualified

e1

MCIMX502CVK8B

NXP Semiconductors

SYSTEM ON CHIP

COMMERCIAL

BALL

416

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA416,24X24,20

.95 V

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.52 mm

13 mm

40

260

13 mm

CMOS

1.05 V

.5 mm

S-PBGA-B416

3

Not Qualified

e1

MCIMX283DVM4CR2

NXP Semiconductors

SYSTEM ON CHIP

COMMERCIAL

BALL

289

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.55 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA289,17X17,32

1.35 V

70 Cel

-20 Cel

BOTTOM

1.37 mm

14 mm

IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V

40

260

14 mm

CMOS

1.45 V

.8 mm

S-PBGA-B289

3

VAC068-GC

Infineon Technologies

COMMERCIAL

PIN/PEG

145

PGA

SQUARE

CERAMIC

NO

5

GRID ARRAY

PGA145,15X15

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

PERPENDICULAR

CMOS

5 V

Other Microprocessor ICs

2.54 mm

S-XPGA-P145

Not Qualified

e0

VAC068-UC

Infineon Technologies

COMMERCIAL

FLAT

144

QFF

SQUARE

CERAMIC

YES

5

FLATPACK

QFL144,1.1SQ,25

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

CMOS

5 V

Other Microprocessor ICs

.635 mm

S-XQFP-F144

Not Qualified

e0

CY82C690-NC

Infineon Technologies

COMMERCIAL

GULL WING

208

QFP

SQUARE

PLASTIC/EPOXY

YES

3.3,5

FLATPACK

QFP208,1.2SQ,20

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

Other Microprocessor ICs

.5 mm

S-PQFP-G208

Not Qualified

e0

VAC068-NC

Infineon Technologies

COMMERCIAL

GULL WING

144

QFP

SQUARE

PLASTIC/EPOXY

YES

5

FLATPACK

QFP144,1.2SQ

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

CMOS

5 V

Other Microprocessor ICs

.635 mm

S-PQFP-G144

Not Qualified

e0

VAC068-BC

Infineon Technologies

COMMERCIAL

PIN/PEG

145

PGA

SQUARE

PLASTIC/EPOXY

NO

5

GRID ARRAY

PGA145,15X15

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

PERPENDICULAR

CMOS

5 V

Other Microprocessor ICs

2.54 mm

S-PPGA-P145

Not Qualified

e0

SAB82532-2N

Infineon Technologies

COMMERCIAL

J BEND

68

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5

CHIP CARRIER

LDCC68,1.0SQ

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

CMOS

5 V

Other Microprocessor ICs

1.27 mm

S-PQCC-J68

Not Qualified

e0

SAB82538N-10

Infineon Technologies

COMMERCIAL

GULL WING

160

QFP

PLASTIC/EPOXY

YES

5

FLATPACK

QFP160(UNSPEC)

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

CMOS

15 mA

5 V

Other Microprocessor ICs

Not Qualified

e0

SAB82C552-N

Infineon Technologies

COMMERCIAL

J BEND

68

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5

CHIP CARRIER

LDCC68,1.0SQ

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

CMOS

25 mA

5 V

Other Microprocessor ICs

1.27 mm

S-PQCC-J68

Not Qualified

e0

SAB82532N10-V12

Infineon Technologies

COMMERCIAL

J BEND

68

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5

CHIP CARRIER

LDCC68,1.0SQ

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

CMOS

5 V

Other Microprocessor ICs

1.27 mm

S-PQCC-J68

Not Qualified

e0

SAB82532N

Infineon Technologies

COMMERCIAL

J BEND

68

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5

CHIP CARRIER

LDCC68,1.0SQ

70 Cel

0 Cel

QUAD

CMOS

15 mA

5 V

Other uPs/uCs/Peripheral ICs

1.27 mm

S-PQCC-J68

Not Qualified

SAB82532N4-V12

Infineon Technologies

COMMERCIAL

J BEND

68

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5

CHIP CARRIER

LDCC68,1.0SQ

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

CMOS

5 V

Other Microprocessor ICs

1.27 mm

S-PQCC-J68

Not Qualified

e0

SAB82C206-N

Infineon Technologies

COMMERCIAL

J BEND

84

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5

CHIP CARRIER

LDCC84,1.2SQ

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

CMOS

30 mA

5 V

Other Microprocessor ICs

1.27 mm

S-PQCC-J84

Not Qualified

e0

SAB82C251-N

Infineon Technologies

COMMERCIAL

J BEND

68

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5

CHIP CARRIER

LDCC68,1.0SQ

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

CMOS

20 mA

5 V

Other Microprocessor ICs

1.27 mm

S-PQCC-J68

Not Qualified

e0

SAB82538N

Infineon Technologies

COMMERCIAL

GULL WING

160

QFP

PLASTIC/EPOXY

YES

5

FLATPACK

QFP160(UNSPEC)

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

CMOS

15 mA

5 V

Other Microprocessor ICs

Not Qualified

e0

SAB82532N-V12

Infineon Technologies

COMMERCIAL

J BEND

68

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5

CHIP CARRIER

LDCC68,1.0SQ

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

CMOS

5 V

Other Microprocessor ICs

1.27 mm

S-PQCC-J68

Not Qualified

e0

SAB82532N-10

Infineon Technologies

COMMERCIAL

J BEND

68

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5

CHIP CARRIER

LDCC68,1.0SQ

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

CMOS

15 mA

5 V

Other uPs/uCs/Peripheral ICs

1.27 mm

S-PQCC-J68

Not Qualified

e0

SAB82538N-4

Infineon Technologies

COMMERCIAL

GULL WING

160

QFP

PLASTIC/EPOXY

YES

5

FLATPACK

QFP160(UNSPEC)

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

CMOS

15 mA

5 V

Other Microprocessor ICs

Not Qualified

e0

SAB82C250-N

Infineon Technologies

COMMERCIAL

J BEND

68

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5

CHIP CARRIER

LDCC68,1.0SQ

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

CMOS

20 mA

5 V

Other Microprocessor ICs

1.27 mm

S-PQCC-J68

Not Qualified

e0

SAB82C551-N

Infineon Technologies

COMMERCIAL

J BEND

68

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5

CHIP CARRIER

LDCC68,1.0SQ

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

CMOS

20 mA

5 V

Other Microprocessor ICs

1.27 mm

S-PQCC-J68

Not Qualified

e0

PT8A3405PE

Diodes Incorporated

COMMERCIAL

THROUGH-HOLE

16

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

3.5/5

IN-LINE

DIP16,.3

70 Cel

-10 Cel

DUAL

.3 mA

Other uPs/uCs/Peripheral ICs

2.54 mm

R-PDIP-T16

Not Qualified

PT8A3406PE

Diodes Incorporated

COMMERCIAL

THROUGH-HOLE

16

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

3.5/5

IN-LINE

DIP16,.3

70 Cel

-10 Cel

DUAL

.3 mA

Other uPs/uCs/Peripheral ICs

2.54 mm

R-PDIP-T16

Not Qualified

PT8A3405WE

Diodes Incorporated

COMMERCIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.5/5

SMALL OUTLINE

SOP16,.25

70 Cel

-10 Cel

DUAL

.3 mA

Other uPs/uCs/Peripheral ICs

1.27 mm

R-PDSO-G16

Not Qualified

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.