COMMERCIAL Other Function uPs,uCs & Peripheral ICs 2,400+

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Screening Level	DAC Channels	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Maximum Seated Height	Width	Data EEPROM Size	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Analog To Digital Convertors	Maximum Supply Current	Nominal Supply Voltage	PWM Channels	Sub-Category	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code	No. of I/O Lines
FT245BL-REEL	FTDI	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY		YES	5.25 V				FLATPACK, LOW PROFILE		4.35 V	70 Cel	0 Cel	MATTE TIN		QUAD		1.6 mm	7 mm						30	260	7 mm	CMOS			5 V				.8 mm		S-PQFP-G32	3		e3
FT245BL	FTDI	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY		YES	5.25 V				FLATPACK, LOW PROFILE		4.35 V	70 Cel	0 Cel	MATTE TIN		QUAD		1.6 mm	7 mm						30	260	7 mm	CMOS			5 V				.8 mm		S-PQFP-G32	3	Not Qualified	e3
DS2413P	Maxim Integrated	MICROPROCESSOR CIRCUIT	COMMERCIAL	C BEND	6	SOC	RECTANGULAR	PLASTIC/EPOXY		YES	5.25 V				SMALL OUTLINE		2.8 V	70 Cel	0 Cel	TIN LEAD		DUAL		1.5 mm	3.76 mm							245	3.94 mm	CMOS			3.3 V				1.27 mm		R-PDSO-C6	1	Not Qualified	e0
CC3200MODR1M2AMOBR	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	BUTT	63	BCC	RECTANGULAR	UNSPECIFIED		YES	3.6 V		NO		CHIP CARRIER		2.3 V	70 Cel	-20 Cel	NICKEL GOLD	YES	BOTTOM	NO	2.45 mm	17.5 mm	0			0		30	260	20.5 mm	CMOS	4-Ch 12-Bit		3.3 V	NO		I2C; SPI; UART	1.27 mm		R-XBCC-B63	3		e4	25
DS2413P/T&R	Maxim Integrated	MICROPROCESSOR CIRCUIT	COMMERCIAL	C BEND	6	SOC	RECTANGULAR	PLASTIC/EPOXY		YES	5.25 V				SMALL OUTLINE		2.8 V	70 Cel	0 Cel	TIN LEAD		DUAL		1.5 mm	3.76 mm								3.94 mm	CMOS			3.3 V				1.27 mm		R-PDSO-C6	1	Not Qualified	e0
FT245BL-T/R	FTDI	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY		YES	5.25 V				FLATPACK, LOW PROFILE		4.35 V	70 Cel	0 Cel	MATTE TIN		QUAD		1.6 mm	7 mm						30	260	7 mm	CMOS			5 V				.8 mm		S-PQFP-G32	3		e3
6AV2181-8XP00-0AX0	Siemens	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD		DIE	RECTANGULAR	UNSPECIFIED		YES					UNCASED CHIP			50 Cel	0 Cel			UPPER									NOT SPECIFIED	NOT SPECIFIED		CMOS			3.3 V						R-XUUC-N
USB4640-HZH-03	Microchip Technology	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	1.3 V	TS 16949		1.2,3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.28SQ,20	1.1 V	70 Cel	0 Cel	MATTE TIN		QUAD		1 mm	7 mm				0	24 MHz			7 mm	CMOS		60 mA	1.2 V		Bus Controllers		.5 mm		S-PQCC-N48		Not Qualified	e3
LTC4263CS#PBF	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V				SMALL OUTLINE		4.5 V	70 Cel	0 Cel	MATTE TIN		DUAL		1.752 mm	3.899 mm						30	260	8.649 mm	CMOS			5 V				1.27 mm		R-PDSO-G14	1	Not Qualified	e3
RF430FRL152HCRGER	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	24	VQCCN	SQUARE	PLASTIC/EPOXY		YES					CHIP CARRIER, VERY THIN PROFILE			70 Cel	0 Cel	NICKEL PALLADIUM GOLD		QUAD		1 mm	4 mm		IT REQUIRES 1.45V TO 1.65V LOW SUPPLY VOLTAGE		0		30	260	4 mm	CMOS						I2C; SPI	.5 mm		S-PQCC-N24	2		e4
CC3200MODR1M2AMOBT	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	BUTT	63	BCC	RECTANGULAR	UNSPECIFIED		YES	3.6 V		NO		CHIP CARRIER		2.3 V	70 Cel	-20 Cel	NICKEL GOLD	YES	BOTTOM	NO	2.45 mm	17.5 mm	0			0		30	260	20.5 mm	CMOS	4-Ch 12-Bit		3.3 V	NO		I2C; SPI; UART	1.27 mm		R-XBCC-B63	3		e4	25
MCIMX280DVM4B	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.55 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	70 Cel	-20 Cel	TIN SILVER COPPER		BOTTOM		1.37 mm	14 mm		IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V				40	260	14 mm	CMOS			1.45 V				.8 mm		S-PBGA-B289	3	Not Qualified	e1
MPC8248CVRTIEA	NXP Semiconductors	SoC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY		YES	1.575 V			1.5,3.3	GRID ARRAY	BGA516,26X26,40	1.425 V	105 Cel	-40 Cel	TIN SILVER		BOTTOM		2.55 mm	27 mm						30	245	27 mm	CMOS			1.5 V		Other uPs/uCs/Peripheral ICs		1 mm		S-PBGA-B516	3	Not Qualified	e2
66AK2G12ABY60	Texas Instruments	SYSTEM ON CHIP	COMMERCIAL	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY		YES	.945 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA625,25X25,32	.855 V	70 Cel	0 Cel	TIN SILVER COPPER		BOTTOM		1.56 mm	21 mm						30	260	21 mm	CMOS			.9 V				.8 mm		S-PBGA-B625	3		e1
CM108AH	C-media Electronics		COMMERCIAL	GULL WING	48	QFP	SQUARE	PLASTIC/EPOXY		YES				5	FLATPACK	QFP48,.35SQ,20		70 Cel	-15 Cel			QUAD															5 V		Other Microprocessor ICs		.5 mm		S-PQFP-G48		Not Qualified
MCIMX280DVM4BR	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.55 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	70 Cel	-20 Cel	TIN SILVER COPPER		BOTTOM		1.37 mm	14 mm		IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V				40	260	14 mm	CMOS			1.45 V				.8 mm		S-PBGA-B289	3		e1
MCIMX286DVM4B	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.55 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	70 Cel	-20 Cel	TIN SILVER COPPER		BOTTOM		1.37 mm	14 mm		IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V				40	260	14 mm	CMOS			1.45 V				.8 mm		S-PBGA-B289	3	Not Qualified	e1
MCIMX283DVM4B	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.55 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	70 Cel	-20 Cel	TIN SILVER COPPER		BOTTOM		1.37 mm	14 mm		IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V				40	260	14 mm	CMOS			1.45 V				.8 mm		S-PBGA-B289	3	Not Qualified	e1
ATTPM20P-G3MA1-10-B	Microchip Technology	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY		YES	3.3 V	TS 16949			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.11,20	1.8 V	70 Cel	0 Cel			DUAL		.6 mm	2 mm								3 mm	CMOS						SPI	.5 mm		R-PDSO-N8
MC68302EH16CR2	NXP Semiconductors	MICROPROCESSOR CIRCUIT	COMMERCIAL	UNSPECIFIED			UNSPECIFIED	UNSPECIFIED			5.5 V						4.5 V	70 Cel	0 Cel	TIN		UNSPECIFIED									40	260		CMOS			5 V							3		e3
9LPRS511EGLFT	Integrated Device Technology	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	64	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES				3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP64,.32,20		70 Cel	0 Cel	TIN		DUAL										260		CMOS			3.3 V		Clock Generators		.5 mm		R-PDSO-G64	1	Not Qualified	e3
MXD1210CWE	Maxim Integrated	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V				SMALL OUTLINE		4.5 V	70 Cel	0 Cel	TIN LEAD		DUAL		1.75 mm	3.9 mm								9.9 mm	CMOS		.5 mA	5 V				1.27 mm		R-PDSO-G16	1	Not Qualified	e0
MXD1210CWE+	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V				SMALL OUTLINE		4.5 V	70 Cel	0 Cel	Matte Tin (Sn) - annealed		DUAL		1.75 mm	3.9 mm						30	260	9.9 mm	CMOS			5 V				1.27 mm		R-PDSO-G16	1	Not Qualified	e3
TIR1000PSRG4	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	3.3 V				SMALL OUTLINE		2.7 V	70 Cel	0 Cel	NICKEL PALLADIUM GOLD		DUAL		2 mm	5.3 mm		CAN ALSO OPERATE AT 5V SUPPLY				30	260	6.2 mm	CMOS			3 V				1.27 mm		R-PDSO-G8	1	Not Qualified	e4
MCIMX283DVM4BR2	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.55 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	70 Cel	-20 Cel	TIN SILVER COPPER		BOTTOM		1.37 mm	14 mm		IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V				40	260	14 mm	CMOS			1.45 V				.8 mm		S-PBGA-B289	3		e1
MCIMX233DAG4C	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.55 V				FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63SQ,16	1 V	70 Cel	-10 Cel	TIN		QUAD		1.6 mm	14 mm						40	260	14 mm	CMOS			1.35 V				.4 mm		S-PQFP-G128	3		e3
RF430FRL153HCRGER	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	24	VQCCN	SQUARE	PLASTIC/EPOXY		YES					CHIP CARRIER, VERY THIN PROFILE			70 Cel	0 Cel	NICKEL PALLADIUM GOLD		QUAD		1 mm	4 mm		IT REQUIRES 1.45V TO 1.65V LOW SUPPLY VOLTAGE		0		30	260	4 mm	CMOS						I2C; SPI	.5 mm		S-PQCC-N24	2		e4
SA3229-E1-T	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	BUTT	25	BCC	RECTANGULAR	PLASTIC/EPOXY		YES					CHIP CARRIER			40 Cel	0 Cel			BOTTOM		1.781 mm	3.18 mm						NOT SPECIFIED	NOT SPECIFIED	5.59 mm	CMOS			1.25 V						R-PBCC-B25
MCIMX233DJM4C	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	169	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.55 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA169,13X13,32	1 V	70 Cel	-10 Cel	TIN SILVER COPPER		BOTTOM		1.43 mm	11 mm						40	260	11 mm	CMOS			1.35 V				.8 mm		S-PBGA-B169	3		e1
MCIMX286DVM4BR	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.55 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	70 Cel	-20 Cel	TIN SILVER COPPER		BOTTOM		1.37 mm	14 mm		IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V				40	260	14 mm	CMOS			1.45 V				.8 mm		S-PBGA-B289	3		e1
RF430FRL154HCRGER	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	24	VQCCN	SQUARE	PLASTIC/EPOXY		YES					CHIP CARRIER, VERY THIN PROFILE			70 Cel	0 Cel	NICKEL PALLADIUM GOLD		QUAD		1 mm	4 mm		IT REQUIRES 1.45V TO 1.65V LOW SUPPLY VOLTAGE		0		30	260	4 mm	CMOS						I2C; SPI	.5 mm		S-PQCC-N24	2		e4
DLPC900ZPC	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V				GRID ARRAY	BGA516,26X26,40	1.1 V	55 Cel	0 Cel			BOTTOM		2.42 mm	27 mm				16	20 MHz			27 mm	CMOS			1.15 V			I2C; SPI; UART; USB	1 mm		S-PBGA-B516				9
LTC4263CDE#TRPBF	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY		YES	5.5 V				SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		4.5 V	70 Cel	0 Cel	MATTE TIN		DUAL		.8 mm	3 mm						30	260	4 mm	CMOS			5 V				.5 mm		R-PDSO-N14	1	Not Qualified	e3
66AK2G12ABY100	Texas Instruments	SYSTEM ON CHIP	COMMERCIAL	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA625,25X25,32	.95 V	70 Cel	0 Cel	TIN SILVER COPPER		BOTTOM		1.56 mm	21 mm						30	260	21 mm	CMOS			1 V				.8 mm		S-PBGA-B625	3		e1
FT245BM	FTDI	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY		YES	5.25 V				FLATPACK, LOW PROFILE		4.35 V	70 Cel	0 Cel	TIN LEAD		QUAD		1.6 mm	7 mm							250	7 mm	CMOS			5 V				.8 mm		S-PQFP-G32	3	Not Qualified	e0
MCIMX286DVM4C	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.55 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	70 Cel	-20 Cel			BOTTOM		1.37 mm	14 mm		IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V				40	260	14 mm	CMOS			1.45 V				.8 mm		S-PBGA-B289	3
R3910-CFAB-E1T	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	25		RECTANGULAR	UNSPECIFIED		YES					MICROELECTRONIC ASSEMBLY			40 Cel	0 Cel			UNSPECIFIED		1.525 mm	3.81 mm		SEATED HGT-NOM				30	260	5.59 mm	CMOS			1.25 V						R-XXMA-N25	3
DLPC900AZPC	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V				GRID ARRAY	BGA516,26X26,40	1.1 V	55 Cel	0 Cel			BOTTOM		2.42 mm	27 mm				16	20 MHz			27 mm	CMOS			1.15 V			I2C; SPI; UART; USB	1 mm		S-PBGA-B516				9
MC68302EH16CB1	NXP Semiconductors		COMMERCIAL	GULL WING	132	BQFP	SQUARE	PLASTIC/EPOXY		YES					FLATPACK	SPQFP132,1.1SQ		70 Cel	0 Cel	TIN		QUAD									40	260		CMOS					Other uPs/uCs/Peripheral ICs		.635 mm		S-PQFP-G132	3	Not Qualified	e3
MCIMX286DVM4CR	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.55 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.35 V	70 Cel	-20 Cel			BOTTOM		1.37 mm	14 mm		IT HAS ANALOG CORE SUPPLY VOLTAGE OF 1.62 TO 2.1 V				40	260	14 mm	CMOS			1.45 V				.8 mm		S-PBGA-B289	3
R3920-CFAB-E1T	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	BUTT	25	BCC	RECTANGULAR	PLASTIC/EPOXY	NO	YES					CHIP CARRIER	LGA25,3X8,27		40 Cel	0 Cel			BOTTOM		1.781 mm	3.18 mm			NO		4.218 MHz	NOT SPECIFIED	NOT SPECIFIED	5.59 mm	CMOS			1.25 V				.686 mm	FIXED POINT	R-PBCC-B25
ADSP-SC589KBCZ-4B	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel			BOTTOM		1.5 mm	19 mm					500 MHz	30	260	19 mm	CMOS			1.1 V			SPI; UART	.8 mm		S-PBGA-B349	3
E705204	Elo Touch Solutions	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY		YES					FLATPACK			70 Cel	0 Cel			QUAD					IT ALSO OPERATES AT 5V SUPPLY VOLTAGE				NOT SPECIFIED	NOT SPECIFIED		CMOS			3.3 V						S-PQFP-G64
P8279-5	Rochester Electronics	MICROPROCESSOR CIRCUIT	COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY		NO	5.5 V				IN-LINE		4.5 V	70 Cel	0 Cel			DUAL		5.08 mm	15.24 mm						NOT SPECIFIED	NOT SPECIFIED	52.26 mm	CMOS			5 V				2.54 mm		R-PDIP-T40
LH7A400N0E000B3A	NXP Semiconductors		COMMERCIAL	BALL	256	FBGA	SQUARE	CERAMIC		YES				1.8,3.3	GRID ARRAY, FINE PITCH	BGA256,16X16,32		70 Cel	0 Cel			BOTTOM																	Other uPs/uCs/Peripheral ICs		.8 mm		S-XBGA-B256		Not Qualified
HS12-100S0S/12SS30	Microchip Technology	MICROPROCESSOR CIRCUIT	COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY		YES					SMALL OUTLINE	SOP20,.4		70 Cel	0 Cel			DUAL		2.64 mm	7.49 mm		Touch Screen Microcontroller						12.8 mm	CMOS							1.27 mm		R-PDSO-G20
ADSP-SC589KBCZ-5B	Analog Devices	MICROPROCESSOR CIRCUIT	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA529,23X23,32	1.05 V	70 Cel	0 Cel			BOTTOM		1.5 mm	19 mm					500 MHz		260	19 mm	CMOS			1.1 V			SPI; UART	.8 mm		S-PBGA-B349	3
ATTPM20P-G6MA1-10	Microchip Technology	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY		YES	3.3 V	TS 16949			SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,20	1.8 V	70 Cel	0 Cel			DUAL		.6 mm	2 mm								3 mm	CMOS						SPI	.5 mm		R-PDSO-N8

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.