NXP Semiconductors - MCIMX233DJM4C

MCIMX233DJM4C by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MCIMX233DJM4C
Description SYSTEM ON CHIP; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 169; Package Code: LFBGA; Package Shape: SQUARE;
Datasheet MCIMX233DJM4C Datasheet
In Stock897
NAME DESCRIPTION
Minimum Supply Voltage: 1 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.35 V
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Seated Height: 1.43 mm
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 169
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: S-PBGA-B169
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 70 Cel
Package Code: LFBGA
Width: 11 mm
Moisture Sensitivity Level (MSL): 3
Peripheral IC Type: SYSTEM ON CHIP
Maximum Supply Voltage: 1.55 V
JESD-609 Code: e1
Minimum Operating Temperature: -10 Cel
Package Equivalence Code: BGA169,13X13,32
Length: 11 mm
Peak Reflow Temperature (C): 260
Terminal Pitch: .8 mm
Temperature Grade: COMMERCIAL
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