NXP Semiconductors - MC68302EH16CB1

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MC68302EH16CB1 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MC68302EH16CB1
Description Other uPs/uCs/Peripheral ICs; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 132; Package Code: BQFP; Package Shape: SQUARE;
In Stock40
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s): 40
Sub-Category: Other uPs/uCs/Peripheral ICs
Surface Mount: YES
Terminal Finish: TIN
JESD-609 Code: e3
Minimum Operating Temperature: 0 Cel
No. of Terminals: 132
Qualification: Not Qualified
Package Equivalence Code: SPQFP132,1.1SQ
Terminal Position: QUAD
Package Style (Meter): FLATPACK
Technology: CMOS
JESD-30 Code: S-PQFP-G132
Package Shape: SQUARE
Terminal Form: GULL WING
Maximum Operating Temperature: 70 Cel
Peak Reflow Temperature (C): 260
Package Code: BQFP
Terminal Pitch: .635 mm
Temperature Grade: COMMERCIAL
Moisture Sensitivity Level (MSL): 3
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