Xilinx - XC7Z007S-1CLG225C

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XC7Z007S-1CLG225C by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC7Z007S-1CLG225C
Description SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 225; Package Code: LFBGA; Package Shape: SQUARE; Terminal Pitch: .8 mm;
Datasheet XC7Z007S-1CLG225C Datasheet
In Stock2,152
NAME DESCRIPTION
Minimum Supply Voltage: .95 V
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: SYSTEM ON CHIP
Nominal Supply Voltage: 1 V
Maximum Supply Voltage: 1.05 V
Maximum Seated Height: 1.5 mm
Surface Mount: YES
Minimum Operating Temperature: 0 Cel
No. of Terminals: 225
Package Equivalence Code: BGA225,15X15,32
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH
Length: 13 mm
Technology: CMOS
JESD-30 Code: S-PBGA-B225
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: LFBGA
Width: 13 mm
Terminal Pitch: .8 mm
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