COMMERCIAL Other Function uPs,uCs & Peripheral ICs 2,400+

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

AD892TJP

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

J BEND

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

CHIP CARRIER

70 Cel

0 Cel

TIN LEAD

QUAD

4.57 mm

16.5862 mm

ALSO REQUIRES 12V SUPPLY

16.5862 mm

CMOS

5 V

1.27 mm

S-PQCC-J44

Not Qualified

e0

ADSP-SC587KBCZ-5B

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

BALL

349

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA529,23X23,32

1.05 V

70 Cel

0 Cel

BOTTOM

1.5 mm

19 mm

500 MHz

260

19 mm

CMOS

1.1 V

SPI; UART

.8 mm

S-PBGA-B349

3

AD9807JS

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

5.25 V

FLATPACK

4.75 V

70 Cel

0 Cel

QUAD

2.35 mm

14 mm

14 mm

CMOS

5 V

.8 mm

S-PQFP-G64

Not Qualified

AD9807

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

5.25 V

FLATPACK

4.75 V

70 Cel

0 Cel

TIN LEAD

QUAD

2.35 mm

14 mm

14 mm

CMOS

5 V

.8 mm

S-PQFP-G64

Not Qualified

e0

ADSP-SC584KBCZ-3A

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

BALL

349

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA529,23X23,32

1.05 V

70 Cel

0 Cel

BOTTOM

1.5 mm

19 mm

500 MHz

30

260

19 mm

CMOS

1.1 V

SPI; UART

.8 mm

S-PBGA-B349

3

IA80152JC-PLC68C

Analog Devices

COMMERCIAL

J BEND

68

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5

CHIP CARRIER

LDCC68,1.0SQ

70 Cel

0 Cel

TIN LEAD

QUAD

235

CMOS

.1 mA

5 V

Other Microprocessor ICs

1.27 mm

S-PQCC-J68

3

Not Qualified

e0

ADSP-SC584KBCZ-5A

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

BALL

349

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA529,23X23,32

1.05 V

70 Cel

0 Cel

BOTTOM

1.5 mm

19 mm

500 MHz

260

19 mm

CMOS

1.1 V

SPI; UART

.8 mm

S-PBGA-B349

3

ADSP-21583KBCZ-4A

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

BALL

349

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA529,23X23,32

1.05 V

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.5 mm

19 mm

500 MHz

30

260

19 mm

CMOS

1.1 V

SPI; UART

.8 mm

S-PBGA-B349

3

e1

AD892EJP

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

J BEND

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

CHIP CARRIER

70 Cel

0 Cel

TIN LEAD

QUAD

4.57 mm

16.5862 mm

ALSO REQUIRES 12V SUPPLY

16.5862 mm

CMOS

5 V

1.27 mm

S-PQCC-J44

Not Qualified

e0

AD9807JS-REEL

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

5.25 V

FLATPACK

4.75 V

70 Cel

0 Cel

QUAD

2.35 mm

14 mm

14 mm

CMOS

5 V

.8 mm

S-PQFP-G64

Not Qualified

ADSP-21571-SWZENG

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

176

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

3.47 V

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

3.13 V

70 Cel

0 Cel

QUAD

1.6 mm

24 mm

NOT SPECIFIED

NOT SPECIFIED

24 mm

CMOS

3.3 V

.5 mm

S-PQFP-G176

IA82510-PLC28C-01

Analog Devices

COMMERCIAL

J BEND

28

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5

CHIP CARRIER

LDCC28,.5SQ

70 Cel

0 Cel

TIN LEAD

QUAD

235

22.4 mA

5 V

Other Microprocessor ICs

1.27 mm

S-PQCC-J28

3

Not Qualified

e0

AD9805JS

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

5.25 V

FLATPACK

4.75 V

70 Cel

0 Cel

QUAD

2.35 mm

14 mm

14 mm

CMOS

5 V

.8 mm

S-PQFP-G64

Not Qualified

ADSP-21573-BCZENG

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

BALL

400

LFBGA

SQUARE

PLASTIC/EPOXY

YES

3.47 V

GRID ARRAY, LOW PROFILE, FINE PITCH

3.13 V

70 Cel

0 Cel

BOTTOM

1.5 mm

17 mm

17 mm

CMOS

3.3 V

.8 mm

S-PBGA-B400

IA80152JA-PLC68C

Analog Devices

COMMERCIAL

J BEND

68

QCCJ

SQUARE

PLASTIC/EPOXY

YES

5

CHIP CARRIER

LDCC68,1.0SQ

70 Cel

0 Cel

TIN LEAD

QUAD

235

CMOS

.1 mA

5 V

Other Microprocessor ICs

1.27 mm

S-PQCC-J68

3

Not Qualified

e0

ADSP-21584KBCZ-5A

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

BALL

349

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.15 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA529,23X23,32

1.05 V

70 Cel

0 Cel

BOTTOM

1.5 mm

19 mm

500 MHz

260

19 mm

CMOS

1.1 V

SPI; UART

.8 mm

S-PBGA-B349

3

DS1209S-16

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5

SMALL OUTLINE

SOP16,.4

70 Cel

0 Cel

TIN LEAD

DUAL

CMOS

5 V

Other Microprocessor ICs

1.27 mm

R-PDSO-G16

Not Qualified

e0

DS1237

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

THROUGH-HOLE

16

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5.5 V

IN-LINE

4.5 V

70 Cel

0 Cel

TIN LEAD

DUAL

4.572 mm

7.62 mm

19.175 mm

CMOS

5 V

2.54 mm

R-PDIP-T16

Not Qualified

e0

DS1209S-20

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5

SMALL OUTLINE

SOP16,.4

70 Cel

0 Cel

TIN LEAD

DUAL

CMOS

.004 mA

5 V

Other Microprocessor ICs

1.27 mm

R-PDSO-G16

Not Qualified

e0

DS1237S

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE

4.5 V

70 Cel

0 Cel

TIN LEAD

DUAL

2.65 mm

7.5 mm

10.3 mm

CMOS

5 V

1.27 mm

R-PDSO-G16

1

Not Qualified

e0

LTC4263CDE-1#PBF

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

NO LEAD

14

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

4.5 V

70 Cel

0 Cel

MATTE TIN

DUAL

.8 mm

3 mm

30

260

4 mm

CMOS

5 V

.5 mm

R-PDSO-N14

1

Not Qualified

e3

LTC4263CS#TR

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE

4.5 V

70 Cel

0 Cel

TIN LEAD

DUAL

1.752 mm

3.9 mm

8.649 mm

CMOS

5 V

1.27 mm

R-PDSO-G14

1

Not Qualified

e0

LTC4263CS

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE

4.5 V

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

DUAL

1.752 mm

3.9 mm

8.649 mm

CMOS

5 V

1.27 mm

R-PDSO-G14

1

Not Qualified

e0

LTC4263CS#TRPBF

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE

4.5 V

70 Cel

0 Cel

MATTE TIN

DUAL

1.752 mm

3.899 mm

30

260

8.649 mm

CMOS

5 V

1.27 mm

R-PDSO-G14

1

Not Qualified

e3

LTC4263CDE#TR

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

NO LEAD

14

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE, VERY THIN PROFILE

4.5 V

70 Cel

0 Cel

TIN LEAD

DUAL

.8 mm

3 mm

4 mm

CMOS

5 V

.5 mm

R-PDSO-N14

1

Not Qualified

e0

LTC4263CDE

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

NO LEAD

14

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE, VERY THIN PROFILE

4.5 V

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

DUAL

.8 mm

3 mm

4 mm

CMOS

5 V

.5 mm

R-PDSO-N14

1

Not Qualified

e0

LTC4263CDE-1#TRPBF

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

NO LEAD

14

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

4.5 V

70 Cel

0 Cel

MATTE TIN

DUAL

.8 mm

3 mm

30

260

4 mm

CMOS

5 V

.5 mm

R-PDSO-N14

1

Not Qualified

e3

LTC4263CDE#PBF

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

NO LEAD

14

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

4.5 V

70 Cel

0 Cel

MATTE TIN

DUAL

.8 mm

3 mm

30

260

4 mm

CMOS

5 V

.5 mm

R-PDSO-N14

1

Not Qualified

e3

MXD1210CSA+T

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE

4.5 V

70 Cel

0 Cel

Matte Tin (Sn) - annealed

DUAL

1.75 mm

3.9 mm

30

260

4.9 mm

CMOS

.5 mA

5 V

1.27 mm

R-PDSO-G8

1

Not Qualified

e3

DS28E84Q+T

Analog Devices

CRYPTOGRAPHIC AUTHENTICATOR

COMMERCIAL

NO LEAD

6

HVSON

SQUARE

UNSPECIFIED

YES

3.63 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC6,.12,38

2.97 V

50 Cel

0 Cel

Matte Tin (Sn) - annealed

DUAL

.8 mm

3 mm

30

260

3 mm

CMOS

3.3 V

.95 mm

S-XDSO-N6

1

e3

MXD1210CWE+T

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE

4.5 V

70 Cel

0 Cel

Matte Tin (Sn) - annealed

DUAL

1.75 mm

3.9 mm

9.9 mm

CMOS

.5 mA

5 V

1.27 mm

R-PDSO-G16

1

Not Qualified

e3

MXD1210CSA+

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE

4.5 V

70 Cel

0 Cel

Matte Tin (Sn) - annealed

DUAL

1.75 mm

3.9 mm

30

260

4.9 mm

CMOS

.5 mA

5 V

1.27 mm

R-PDSO-G8

1

Not Qualified

e3

DS28E83Q+T

Analog Devices

CRYPTOGRAPHIC AUTHENTICATOR

COMMERCIAL

NO LEAD

6

HVSON

SQUARE

PLASTIC/EPOXY

YES

3.63 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC6,.12,38

2.97 V

50 Cel

0 Cel

Matte Tin (Sn) - annealed

DUAL

.8 mm

3 mm

30

260

3 mm

CMOS

3.3 V

.95 mm

S-PDSO-N6

1

e3

MXD1210CPA+

Analog Devices

MICROPROCESSOR CIRCUIT

COMMERCIAL

THROUGH-HOLE

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5.5 V

IN-LINE

4.5 V

70 Cel

0 Cel

Matte Tin (Sn) - annealed

DUAL

4.572 mm

7.62 mm

30

260

9.375 mm

CMOS

.5 mA

5 V

2.54 mm

R-PDIP-T8

1

Not Qualified

e3

CAT93C5733U-30TE13

Onsemi

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

8

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

6 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

2.7 V

70 Cel

0 Cel

TIN LEAD

DUAL

1.1 mm

3 mm

3 mm

CMOS

5 V

.65 mm

R-PDSO-G8

1

Not Qualified

e0

CAT93C8632J-30TE13

Onsemi

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

6 V

SMALL OUTLINE

2.7 V

70 Cel

0 Cel

TIN LEAD

DUAL

1.75 mm

3.9 mm

4.9 mm

CMOS

5 V

1.27 mm

R-PDSO-G8

Not Qualified

e0

CAT93C6614S-30TE13

Onsemi

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

6 V

SMALL OUTLINE

2.7 V

70 Cel

0 Cel

TIN LEAD

DUAL

1.75 mm

3.9 mm

4.9 mm

CMOS

5 V

1.27 mm

R-PDSO-G8

Not Qualified

e0

CAT93C8612P-25

Onsemi

MICROPROCESSOR CIRCUIT

COMMERCIAL

THROUGH-HOLE

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

6 V

IN-LINE

2.7 V

70 Cel

0 Cel

TIN LEAD

DUAL

4.57 mm

7.62 mm

9.27 mm

CMOS

5 V

2.54 mm

R-PDIP-T8

Not Qualified

e0

CAT93C5632J-42TE13

Onsemi

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

6 V

SMALL OUTLINE

2.7 V

70 Cel

0 Cel

TIN LEAD

DUAL

1.75 mm

3.9 mm

4.9 mm

CMOS

5 V

1.27 mm

R-PDSO-G8

Not Qualified

e0

CAT93C5614S-25TE13

Onsemi

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

6 V

SMALL OUTLINE

2.7 V

70 Cel

0 Cel

TIN LEAD

DUAL

1.75 mm

3.9 mm

4.9 mm

CMOS

5 V

1.27 mm

R-PDSO-G8

Not Qualified

e0

CAT93C6623S-42TE13

Onsemi

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

6 V

SMALL OUTLINE

2.7 V

70 Cel

0 Cel

TIN LEAD

DUAL

1.75 mm

3.9 mm

4.9 mm

CMOS

5 V

1.27 mm

R-PDSO-G8

Not Qualified

e0

CAT93C5614U-42TE13

Onsemi

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

8

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

6 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

2.7 V

70 Cel

0 Cel

TIN LEAD

DUAL

1.1 mm

3 mm

3 mm

CMOS

5 V

.65 mm

R-PDSO-G8

1

Not Qualified

e0

CAT93C5724S-25TE13

Onsemi

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

6 V

SMALL OUTLINE

2.7 V

70 Cel

0 Cel

TIN LEAD

DUAL

1.75 mm

3.9 mm

4.9 mm

CMOS

5 V

1.27 mm

R-PDSO-G8

Not Qualified

e0

CAT93C5611P-42

Onsemi

MICROPROCESSOR CIRCUIT

COMMERCIAL

THROUGH-HOLE

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

6 V

IN-LINE

2.7 V

70 Cel

0 Cel

TIN LEAD

DUAL

4.57 mm

7.62 mm

9.27 mm

CMOS

5 V

2.54 mm

R-PDIP-T8

Not Qualified

e0

CAT93C6621K-30TE13

Onsemi

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

6 V

SMALL OUTLINE

2.7 V

70 Cel

0 Cel

TIN LEAD

DUAL

2.03 mm

5.25 mm

5.3 mm

CMOS

5 V

1.27 mm

R-PDSO-G8

Not Qualified

e0

CAT93C6632K-28TE13

Onsemi

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

6 V

SMALL OUTLINE

2.7 V

70 Cel

0 Cel

TIN LEAD

DUAL

2.03 mm

5.25 mm

5.3 mm

CMOS

5 V

1.27 mm

R-PDSO-G8

Not Qualified

e0

CAT93C8624J-25TE13

Onsemi

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

6 V

SMALL OUTLINE

2.7 V

70 Cel

0 Cel

TIN LEAD

DUAL

1.75 mm

3.9 mm

4.9 mm

CMOS

5 V

1.27 mm

R-PDSO-G8

Not Qualified

e0

CAT93C8631K-25TE13

Onsemi

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

6 V

SMALL OUTLINE

2.7 V

70 Cel

0 Cel

TIN LEAD

DUAL

2.03 mm

5.25 mm

5.3 mm

CMOS

5 V

1.27 mm

R-PDSO-G8

Not Qualified

e0

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.