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| Manufacturer | Analog Devices |
|---|---|
| Manufacturer's Part Number | ADSP-21573-BCZENG |
| Description | MICROPROCESSOR CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE; |
| Datasheet | ADSP-21573-BCZENG Datasheet |
| In Stock | 1,145 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 3.13 V |
| Package Body Material: | PLASTIC/EPOXY |
| Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
| Nominal Supply Voltage: | 3.3 V |
| Maximum Supply Voltage: | 3.47 V |
| Maximum Seated Height: | 1.5 mm |
| Surface Mount: | YES |
| Minimum Operating Temperature: | 0 Cel |
| No. of Terminals: | 400 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Length: | 17 mm |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B400 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | LFBGA |
| Width: | 17 mm |
| Terminal Pitch: | .8 mm |
| Temperature Grade: | COMMERCIAL |









