COMMERCIAL EXTENDED Other Function uPs,uCs & Peripheral ICs 16

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	JESD-609 Code
W5300	Wiznet	MICROPROCESSOR CIRCUIT	COMMERCIAL EXTENDED	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V			FLATPACK, LOW PROFILE, FINE PITCH		3 V	80 Cel	0 Cel		QUAD	1.6 mm		14 mm		40	260	14 mm	CMOS		3.3 V		.5 mm		S-PQFP-G100	3
MCIMX6X3EVN10AB	NXP Semiconductors	SoC	COMMERCIAL EXTENDED	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.53 mm		17 mm		40	260	17 mm	CMOS				.8 mm		S-PBGA-B400	3		e1
MCIMX6X1EVO10AB	NXP Semiconductors	SoC	COMMERCIAL EXTENDED	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.53 mm		17 mm		40	260	17 mm	CMOS				.8 mm		S-PBGA-B400	3		e1
MCIMX6X2EVN10AB	NXP Semiconductors	SoC	COMMERCIAL EXTENDED	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.53 mm		17 mm		40	260	17 mm	CMOS				.8 mm		S-PBGA-B400	3		e1
SN74LS783N	Motorola	MICROPROCESSOR CIRCUIT	COMMERCIAL EXTENDED	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.25 V		5	IN-LINE	DIP40,.6	4.75 V	75 Cel	0 Cel	TIN LEAD	DUAL	5.08 mm		15.24 mm				52.07 mm	BIPOLAR	230 mA	5 V	Memory Controllers	2.54 mm		R-PDIP-T40		Not Qualified	e0
TMX320DM6443BZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL EXTENDED	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	85 Cel	0 Cel		BOTTOM	1.4 mm	16384	16 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY	NOT SPECIFIED	NOT SPECIFIED	16 mm	CMOS		1.2 V	Digital Signal Processors	.8 mm	FIXED POINT	S-PBGA-B361		Not Qualified
TMX320DM6443ZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL EXTENDED	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	85 Cel	0 Cel		BOTTOM	1.4 mm	16384	16 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY			16 mm	CMOS		1.2 V	Digital Signal Processors	.8 mm	FIXED POINT	S-PBGA-B361		Not Qualified
TMX320DM6446ZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL EXTENDED	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	85 Cel	0 Cel		BOTTOM	1.4 mm	16384	16 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY			16 mm	CMOS		1.2 V	Digital Signal Processors	.8 mm	FIXED POINT	S-PBGA-B361		Not Qualified
TMX320DM6443AZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL EXTENDED	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	85 Cel	0 Cel		BOTTOM	1.4 mm	16384	16 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY			16 mm	CMOS		1.2 V	Digital Signal Processors	.8 mm	FIXED POINT	S-PBGA-B361		Not Qualified
TMS320VER6446ZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	COMMERCIAL EXTENDED	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V	32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	85 Cel	0 Cel		BOTTOM	1.4 mm	16384	16 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY	30	260	16 mm	CMOS		1.2 V	Digital Signal Processors	.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified
88MW300-XX-NAP2E000-P123	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL EXTENDED	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	1.21 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16		85 Cel	-30 Cel		QUAD	1 mm		8 mm				8 mm	CMOS		1.1 V		.4 mm		S-XQCC-N68
88MW302-XX-NXU2E000-P123	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL EXTENDED	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED	YES	1.21 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC88,.39SQ,16		85 Cel	-30 Cel		QUAD	.9 mm		10 mm				10 mm	CMOS		1.1 V		.4 mm		S-XQCC-N88
88MW302-XX-NXU2E000	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL EXTENDED	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED	YES	1.21 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC88,.39SQ,16		85 Cel	-30 Cel		QUAD	.9 mm		10 mm				10 mm	CMOS		1.1 V		.4 mm		S-XQCC-N88
MCIMX6X3EVO10AB	NXP Semiconductors	SoC	COMMERCIAL EXTENDED	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.53 mm		17 mm		40	260	17 mm	CMOS				.8 mm		S-PBGA-B400	3		e1
MCIMX538DZK1C	NXP Semiconductors	SYSTEM ON CHIP	COMMERCIAL EXTENDED	BALL	520	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1.3 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA520,29X29,16	1.2 V	85 Cel	-20 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	.986 mm		12 mm		40	260	12 mm	CMOS		1.25 V		.4 mm		S-PBGA-B520	3
HD63L05E0	Renesas Electronics	MICROPROCESSOR CIRCUIT	COMMERCIAL EXTENDED	GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	3.8 V			FLATPACK		2.2 V	75 Cel	-20 Cel		QUAD	2.9 mm		14 mm				20 mm	CMOS		3 V		.65 mm		R-PQFP-G100		Not Qualified

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.