NXP Semiconductors - MCIMX538DZK1C

MCIMX538DZK1C by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MCIMX538DZK1C
Description SYSTEM ON CHIP; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: BALL; No. of Terminals: 520; Package Code: VFBGA; Package Shape: SQUARE;
Datasheet MCIMX538DZK1C Datasheet
In Stock204
NAME DESCRIPTION
Minimum Supply Voltage: 1.2 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.25 V
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Seated Height: .986 mm
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER OVER NICKEL
No. of Terminals: 520
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: S-PBGA-B520
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: VFBGA
Width: 12 mm
Moisture Sensitivity Level (MSL): 3
Peripheral IC Type: SYSTEM ON CHIP
Maximum Supply Voltage: 1.3 V
Minimum Operating Temperature: -20 Cel
Package Equivalence Code: BGA520,29X29,16
Length: 12 mm
Peak Reflow Temperature (C): 260
Terminal Pitch: .4 mm
Temperature Grade: COMMERCIAL EXTENDED
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Pricing (USD)

Qty. Unit Price Ext. Price
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