Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Information Access Method | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | No. of Bits | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Interrupt Capability | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Ultraviolet Erasable | Terminal Position | DMA Channels | No. of Ports | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | ROM Bits Size | No. of Timers | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Minimum Time | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | Volatile | JESD-609 Code | Maximum Standby Current | On Chip Program ROM Width | No. of I/O Lines | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Nordic Semiconductor Asa |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.7 V |
85 Cel |
-40 Cel |
QUAD |
.95 mm |
6 mm |
NOT SPECIFIED |
NOT SPECIFIED |
6 mm |
CMOS |
3 V |
.4 mm |
S-XQCC-N48 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Espressif Systems (Shanghai) |
SoC |
NO LEAD |
41 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
MICROELECTRONIC ASSEMBLY |
3 V |
85 Cel |
-40 Cel |
UNSPECIFIED |
3.35 mm |
18 mm |
19.2 mm |
CMOS |
3.3 V |
1.27 mm |
R-XXMA-N41 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Espressif Systems (Shanghai) |
SoC |
NO LEAD |
41 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
MICROELECTRONIC ASSEMBLY |
3 V |
85 Cel |
-40 Cel |
UNSPECIFIED |
3.35 mm |
18 mm |
19.2 mm |
CMOS |
3.3 V |
1.27 mm |
R-XXMA-N41 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Espressif Systems (Shanghai) |
SoC |
NO LEAD |
41 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
MICROELECTRONIC ASSEMBLY |
3 V |
85 Cel |
-40 Cel |
UNSPECIFIED |
3.35 mm |
18 mm |
19.2 mm |
CMOS |
3.3 V |
1.27 mm |
R-XXMA-N41 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Espressif Systems (Shanghai) |
SoC |
NO LEAD |
41 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
MICROELECTRONIC ASSEMBLY |
3 V |
65 Cel |
-40 Cel |
UNSPECIFIED |
3.35 mm |
18 mm |
19.2 mm |
CMOS |
3.3 V |
1.27 mm |
R-XXMA-N41 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Nordic Semiconductor Asa |
SoC |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,16 |
1.7 V |
85 Cel |
-40 Cel |
QUAD |
.9 mm |
6 mm |
6 mm |
CMOS |
3 V |
.4 mm |
S-XQCC-N48 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
OTHER |
NO LEAD |
32 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3/3.3 |
CHIP CARRIER |
LCC32,.2SQ,20 |
85 Cel |
-25 Cel |
QUAD |
30 |
260 |
100 mA |
Other Microprocessor ICs |
.5 mm |
S-PQCC-N32 |
1 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Espressif Systems (Shanghai) |
SoC |
NO LEAD |
41 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
MICROELECTRONIC ASSEMBLY |
3 V |
85 Cel |
-40 Cel |
UNSPECIFIED |
3.35 mm |
18 mm |
19.2 mm |
CMOS |
3.3 V |
1.27 mm |
R-XXMA-N41 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Nordic Semiconductor Asa |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.7 V |
85 Cel |
-40 Cel |
QUAD |
.95 mm |
5 mm |
NOT SPECIFIED |
NOT SPECIFIED |
5 mm |
CMOS |
3 V |
.5 mm |
S-XQCC-N32 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
Espressif Systems (Shanghai) |
MICROPROCESSOR CIRCUIT |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
3 V |
105 Cel |
-40 Cel |
QUAD |
.9 mm |
5 mm |
ALSO HAVE PACKING METHOD TR, 7 INCH WITH 1000 QUANTITY |
5 mm |
CMOS |
3.3 V |
.5 mm |
S-PQCC-N32 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
Espressif Systems (Shanghai) |
MICROPROCESSOR CIRCUIT |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
3 V |
105 Cel |
-40 Cel |
QUAD |
.9 mm |
5 mm |
ALSO HAVE PACKING METHOD TR, 7 INCH WITH 1000 QUANTITY |
5 mm |
CMOS |
3.3 V |
.5 mm |
S-PQCC-N32 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.89 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
1.71 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
QUAD |
.55 mm |
4 mm |
Capacitive Touch Sense Controller |
4 mm |
CMOS |
1.8 V |
.5 mm |
S-XQCC-N24 |
3 |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
Nordic Semiconductor Asa |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.7 V |
85 Cel |
-40 Cel |
QUAD |
.95 mm |
6 mm |
NOT SPECIFIED |
NOT SPECIFIED |
6 mm |
CMOS |
3 V |
.4 mm |
S-XQCC-N48 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
CRYPTOGRAPHIC AUTHENTICATOR |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.12SQ,16 |
1.62 V |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
QUAD |
.33 mm |
3 mm |
30 |
260 |
3 mm |
CMOS |
1.8 V |
.4 mm |
S-PQCC-N20 |
1 |
e4 |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
47 |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
MICROELECTRONIC ASSEMBLY |
2.1 V |
85 Cel |
-40 Cel |
NICKEL GOLD |
UNSPECIFIED |
3.34 mm |
17.8 mm |
250 |
26.7 mm |
CMOS |
3.3 V |
1.27 mm |
R-XXMA-N47 |
e4 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
CRYPTOGRAPHIC AUTHENTICATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,20 |
2 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
.6 mm |
2 mm |
260 |
3 mm |
CMOS |
I2C |
.5 mm |
R-PDSO-N8 |
1 |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
CRYPTOGRAPHIC AUTHENTICATOR |
NO LEAD |
8 |
HVSON |
RECTANGULAR |
UNSPECIFIED |
YES |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
105 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
1 mm |
5 mm |
260 |
6 mm |
CMOS |
1.27 mm |
R-XDSO-N8 |
3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
CRYPTOGRAPHIC AUTHENTICATOR |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.95 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
1.65 V |
85 Cel |
-20 Cel |
QUAD |
.9 mm |
5 mm |
ALSO AVAILABLE WITH 3.3V NOM SUPPLY |
5 mm |
CMOS |
1.8 V |
.5 mm |
S-PQCC-N32 |
3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.24SQ,20 |
2 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
8 |
6 mm |
TIMER(4) |
0 |
30 |
260 |
6 mm |
8192 |
CMOS |
3 V |
Other uPs/uCs/Peripheral ICs |
I2C; SPI; USART; USB |
.5 mm |
S-PQCC-N40 |
3 |
Not Qualified |
e4 |
23 |
|||||||||||||||||||||||||||||||||||||||
|
Espressif Systems (Shanghai) |
SoC |
NO LEAD |
41 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
MICROELECTRONIC ASSEMBLY |
3 V |
85 Cel |
-40 Cel |
UNSPECIFIED |
3.35 mm |
18 mm |
19.2 mm |
CMOS |
3.3 V |
1.27 mm |
R-XXMA-N41 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
28 |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
MICROELECTRONIC ASSEMBLY |
2.7 V |
85 Cel |
-40 Cel |
UNSPECIFIED |
2.113 mm |
14.73 mm |
NOT SPECIFIED |
NOT SPECIFIED |
21.72 mm |
CMOS |
3.3 V |
R-XXMA-N28 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
Microchip Technology |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
28 |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
TS 16949 |
MICROELECTRONIC ASSEMBLY |
MODULE28(UNSPEC) |
2.7 V |
80 Cel |
-40 Cel |
UNSPECIFIED |
2.11 mm |
14.73 mm |
48 MHz |
21.72 mm |
CMOS |
3.3 V |
R-XXMA-N28 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
Microchip Technology |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
28 |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
TS 16949 |
MICROELECTRONIC ASSEMBLY |
2.7 V |
85 Cel |
-40 Cel |
UNSPECIFIED |
2.113 mm |
14.73 mm |
21.72 mm |
CMOS |
3.3 V |
R-XXMA-N28 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
CRYPTOGRAPHIC AUTHENTICATOR |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1.95 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
1.65 V |
105 Cel |
-40 Cel |
NICKEL GOLD PALLADIUM SILVER |
QUAD |
.9 mm |
5 mm |
ALSO OPERATES WITH 3.3V SUPPLY |
5 mm |
CMOS |
1.8 V |
.5 mm |
S-XQCC-N32 |
1 |
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
OTHER |
NO LEAD |
32 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3/3.3 |
CHIP CARRIER |
LCC32,.2SQ,20 |
85 Cel |
-25 Cel |
QUAD |
30 |
260 |
100 mA |
Other Microprocessor ICs |
.5 mm |
S-PQCC-N32 |
1 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.8 V |
85 Cel |
CORTEX-M3 |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
1 mm |
5 mm |
NOT SPECIFIED |
260 |
5 mm |
28672 |
CMOS |
3.3 V |
.5 mm |
S-PQCC-N32 |
3 |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
28 |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
MICROELECTRONIC ASSEMBLY |
2.7 V |
85 Cel |
-40 Cel |
UNSPECIFIED |
2.113 mm |
14.73 mm |
NOT SPECIFIED |
NOT SPECIFIED |
21.72 mm |
CMOS |
3.3 V |
R-XXMA-N28 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
FTDI |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.25 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3.3 V |
85 Cel |
-40 Cel |
QUAD |
1 mm |
5 mm |
5 mm |
CMOS |
.5 mm |
S-XQCC-N32 |
3 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
CRYPTOGRAPHIC AUTHENTICATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,20 |
2 V |
85 Cel |
-40 Cel |
DUAL |
.6 mm |
2 mm |
3 mm |
CMOS |
1-WIRE |
.5 mm |
R-PDSO-N8 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR CIRCUIT |
OTHER |
NO LEAD |
32 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3/3.3 |
CHIP CARRIER |
LCC32,.2SQ,20 |
85 Cel |
-25 Cel |
QUAD |
30 |
260 |
100 mA |
Other Microprocessor ICs |
.5 mm |
S-PQCC-N32 |
1 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Nordic Semiconductor Asa |
MICROPROCESSOR CIRCUIT |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
1.7 V |
85 Cel |
-40 Cel |
QUAD |
.9 mm |
5 mm |
5 mm |
CMOS |
3 V |
.5 mm |
S-XQCC-N32 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
CRYPTOGRAPHIC AUTHENTICATOR |
OTHER |
NO LEAD |
20 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC20,.12SQ,16 |
1.62 V |
85 Cel |
-25 Cel |
NICKEL PALLADIUM GOLD SILVER |
QUAD |
.33 mm |
3 mm |
30 |
260 |
3 mm |
CMOS |
1.8 V |
.4 mm |
S-PQCC-N20 |
1 |
e4 |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
MICROPROCESSOR CIRCUIT |
NO LEAD |
188 |
DIE |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
UNCASED CHIP |
3 V |
85 Cel |
-40 Cel |
UPPER |
NOT SPECIFIED |
NOT SPECIFIED |
CMOS |
3.3 V |
S-XUUC-N188 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
MICROPROCESSOR CIRCUIT |
AUTOMOTIVE |
NO LEAD |
48 |
HQCCN |
SQUARE |
UNSPECIFIED |
YES |
45 V |
CHIP CARRIER, HEAT SINK/SLUG |
6.7 V |
125 Cel |
-40 Cel |
QUAD |
7 mm |
NOT SPECIFIED |
NOT SPECIFIED |
7 mm |
CMOS |
8 V |
.5 mm |
S-XQCC-N48 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Onsemi |
SYSTEM ON CHIP |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.2X.28,20 |
1.8 V |
85 Cel |
-40 Cel |
NICKEL GOLD PALLADIUM |
QUAD |
1 mm |
5 mm |
30 |
260 |
7 mm |
CMOS |
3 V |
.5 mm |
R-PQCC-N40 |
1 |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
Espressif Systems (Shanghai) |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
38 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
MICROELECTRONIC ASSEMBLY |
3 V |
85 Cel |
-40 Cel |
UNSPECIFIED |
3.35 mm |
18 mm |
250 |
19.2 mm |
CMOS |
3.3 V |
1.27 mm |
R-XXMA-N38 |
3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
NFC CONTROLLER |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.95 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.24SQ,20 |
1.65 V |
85 Cel |
-30 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
6 mm |
30 |
260 |
6 mm |
CMOS |
1.8 V |
.5 mm |
S-XQCC-N40 |
3 |
e4 |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
FTDI |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.63 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.97 V |
85 Cel |
-40 Cel |
QUAD |
1 mm |
7 mm |
NOT SPECIFIED |
NOT SPECIFIED |
7 mm |
CMOS |
3.3 V |
.5 mm |
S-XQCC-N48 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Digi International |
MICROPROCESSOR CIRCUIT |
OTHER |
NO LEAD |
400 |
LGA |
SQUARE |
UNSPECIFIED |
YES |
GRID ARRAY |
70 Cel |
-20 Cel |
BOTTOM |
50 mm |
50 mm |
CMOS |
2 mm |
S-XBGA-N400 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
CRYPTOGRAPHIC AUTHENTICATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
TS 16949 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.12,20 |
2 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
.6 mm |
2 mm |
30 |
260 |
3 mm |
CMOS |
.5 mm |
R-PDSO-N8 |
1 |
e4 |
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|
Nordic Semiconductor Asa |
MICROPROCESSOR CIRCUIT |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
1.7 V |
85 Cel |
-40 Cel |
QUAD |
.9 mm |
5 mm |
5 mm |
CMOS |
3 V |
.5 mm |
S-XQCC-N32 |
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|
Microchip Technology |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
47 |
RECTANGULAR |
UNSPECIFIED |
YES |
3.6 V |
TS 16949 |
MICROELECTRONIC ASSEMBLY |
2.1 V |
85 Cel |
-40 Cel |
NICKEL GOLD |
UNSPECIFIED |
3.34 mm |
17.78 mm |
250 |
26.67 mm |
CMOS |
3.3 V |
1.27 mm |
R-XXMA-N47 |
e4 |
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|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.8 V |
85 Cel |
CORTEX-M3 |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
1 mm |
7 mm |
NOT SPECIFIED |
260 |
7 mm |
28672 |
CMOS |
3.3 V |
.5 mm |
S-PQCC-N48 |
3 |
e4 |
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Espressif Systems (Shanghai) |
SoC |
NO LEAD |
48 |
HQCCN |
SQUARE |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG |
LCC48,.27SQ,20 |
3 V |
85 Cel |
-40 Cel |
QUAD |
1.21 mm |
7 mm |
7 mm |
CMOS |
3.3 V |
.5 mm |
S-XQCC-N48 |
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|
Texas Instruments |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.8 V |
85 Cel |
CORTEX-M3 |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
1 mm |
7 mm |
30 |
260 |
7 mm |
28672 |
CMOS |
3.3 V |
.5 mm |
S-PQCC-N48 |
3 |
e4 |
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|
Nordic Semiconductor Asa |
MICROPROCESSOR CIRCUIT |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,16 |
1.7 V |
85 Cel |
-40 Cel |
QUAD |
.9 mm |
6 mm |
6 mm |
CMOS |
3 V |
.4 mm |
S-XQCC-N48 |
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|
Infineon Technologies |
PROGRAMMABLE SoC |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
5.25 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
4.75 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
5 mm |
ALSO OPERATES AT 2.7V AND 3.3V SUPPLY |
40 |
260 |
5 mm |
CMOS |
5 V |
.5 mm |
S-XQCC-N32 |
3 |
Not Qualified |
e4 |
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Nordic Semiconductor Asa |
MICROCONTROLLER, CISC |
INDUSTRIAL |
NO LEAD |
127 |
LGA |
RECTANGULAR |
UNSPECIFIED |
YES |
5.5 V |
GRID ARRAY |
LGA127,21X30,20 |
3 V |
85 Cel |
-40 Cel |
BOTTOM |
1.1 mm |
10.5 mm |
16 mm |
CMOS |
3.8 V |
.5 mm |
R-XBGA-N127 |
Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.
Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.
Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.
Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.