Intel Other Function uPs,uCs & Peripheral ICs 143

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Part	Manufacturer	Peripheral IC Type	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Position	Maximum Seated Height	Width	Additional Features	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	Qualification
1SX280HN3F43I3VG	Intel	SoC FPGA
5CSEBA2U19C6N	Intel	SoC
5CSEBA2U19C7SN	Intel	SoC
5CSEMA5F31C6N	Intel	SoC
5CSEMA6U23C6N	Intel	SoC
80312	Intel	MICROPROCESSOR CIRCUIT	BALL	540	BGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	GRID ARRAY		3 V			BOTTOM	4.1 mm	42.5 mm		42.5 mm	CMOS	3.3 V	1.27 mm	S-PBGA-B540	Not Qualified
AGIB027R31B1E1VAA	Intel	SoC FPGA
10AS048H4F34E3SG	Intel	SoC	BALL	1152	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY	BGA1152,34X34,40	.87 V	100 Cel	0 Cel	BOTTOM	3.35 mm	35 mm		35 mm	TSMC	.9 V	1 mm	S-PBGA-B1152
10AS066H2F34I1HG	Intel	SoC	BALL	1152	BGA	SQUARE	PLASTIC/EPOXY	YES		GRID ARRAY	BGA1152,34X34,40		100 Cel	-40 Cel	BOTTOM	3.35 mm	35 mm		35 mm	TSMC		1 mm	S-PBGA-B1152
5CSEBA4U23I7SN	Intel	SoC
5CSEBA5U19A7N	Intel	SoC
5CSEBA5U23C7SN	Intel	SoC
5CSEMA6F31I7N	Intel	SoC
10AS016C4U19I3LG	Intel	SoC	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, FINE PITCH	BGA484,22X22,32	.87 V	100 Cel	-40 Cel	BOTTOM	3.25 mm	19 mm		19 mm	TSMC	.9 V	.8 mm	S-PBGA-B484
10AS032H3F35E2SG	Intel	SoC	BALL	1152	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY	BGA1152,34X34,40	.87 V	100 Cel	0 Cel	BOTTOM	3.35 mm	35 mm	ALSO OPERATES AT 0.95V NOMINAL SUPPLY	35 mm	TSMC	.9 V	1 mm	S-PBGA-B1152
5CSEBA2U23C6N	Intel	SoC
5CSEBA2U23C7SN	Intel	SoC
5CSEBA2U23C8SN	Intel	SoC
5CSEBA4U19C8SN	Intel	SoC
5CSEBA4U19I7N	Intel	SoC
5CSEBA5U19I7LN	Intel	SoC
5CSEBA5U23I7SN	Intel	SoC
5CSEMA6F31A7N	Intel	SoC
10AS057K4F40E3SG	Intel	SoC	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY	BGA1517,39X39,40	.87 V	100 Cel	0 Cel	BOTTOM	3.5 mm	40 mm		40 mm	TSMC	.9 V	1 mm	S-PBGA-B1517
1SX085HN3F43I2LG	Intel	MICROPROCESSOR CIRCUIT
1SX110HN1F43E1VG	Intel	MICROPROCESSOR CIRCUIT
1SX165HN1F43E2VG	Intel	SoC FPGA
1SX250LU3F50I3XG	Intel	SoC FPGA
1SX280HN3F43E1VG	Intel	SoC FPGA
5CSEBA5U19C6N	Intel	SoC
5CSEMA5F31C8N	Intel	SoC
AGFA006R16A3E3V	Intel	SoC FPGA	BALL	1546		RECTANGULAR	PLASTIC/EPOXY	YES					100 Cel	0 Cel	BOTTOM								R-PBGA-B1546
10AS016E4F29I3LG	Intel	SoC	BALL	780	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY	BGA780,28X28,40	.87 V	100 Cel	-40 Cel	BOTTOM	3.35 mm	29 mm		29 mm	TSMC	.9 V	1 mm	S-PBGA-B780
5CSEBA2U19C8SN	Intel	SoC
10AS016E4F27E3SG	Intel	SoC	BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY	BGA672,26X26,40	.87 V	100 Cel	0 Cel	BOTTOM	3.35 mm	27 mm		27 mm	TSMC	.9 V	1 mm	S-PBGA-B672
1SX250LN2F43I2VG	Intel	SoC FPGA
DH82QM87SR17C	Intel	MICROPROCESSOR CIRCUIT	UNSPECIFIED			SQUARE	UNSPECIFIED								UNSPECIFIED					CMOS
10AS016E3F27E2SG	Intel	SoC	BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY	BGA672,26X26,40	.87 V	100 Cel	0 Cel	BOTTOM	3.35 mm	27 mm	ALSO OPERATES AT 0.95V NOMINAL SUPPLY	27 mm	TSMC	.9 V	1 mm	S-PBGA-B672
EY82C621ASRH58	Intel	MICROPROCESSOR CIRCUIT	BALL	1310		RECTANGULAR	PLASTIC/EPOXY	YES							BOTTOM					CMOS			R-PBGA-B1310
10AS027E2F27E2LG	Intel	SoC	BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY	BGA672,26X26,40	.87 V	100 Cel	0 Cel	BOTTOM	3.35 mm	27 mm	ALSO OPERATES AT 0.95V NOMINAL SUPPLY	27 mm	TSMC	.9 V	1 mm	S-PBGA-B672
10AS027E3F29E2LG	Intel	SoC	BALL	780	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY	BGA780,28X28,40	.87 V	100 Cel	0 Cel	BOTTOM	3.35 mm	29 mm	ALSO OPERATES AT 0.95V NOMINAL SUPPLY	29 mm	TSMC	.9 V	1 mm	S-PBGA-B780
5CSEBA6U19I7SN	Intel	SoC
5CSXFC6C6U23C6N	Intel	SoC
DH82HM86SR17E	Intel	MICROPROCESSOR CIRCUIT
10AS016C3U19E2LG	Intel	SoC	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY, FINE PITCH	BGA484,22X22,32	.87 V	100 Cel	0 Cel	BOTTOM	3.25 mm	19 mm	ALSO OPERATES AT 0.95V NOMINAL SUPPLY	19 mm	TSMC	.9 V	.8 mm	S-PBGA-B484
10AS016E4F29E3SG	Intel	SoC	BALL	780	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY	BGA780,28X28,40	.87 V	100 Cel	0 Cel	BOTTOM	3.35 mm	29 mm		29 mm	TSMC	.9 V	1 mm	S-PBGA-B780
10AS048E3F29E2LG	Intel	SoC	BALL	780	BGA	SQUARE	PLASTIC/EPOXY	YES	.93 V	GRID ARRAY	BGA780,28X28,40	.87 V	100 Cel	0 Cel	BOTTOM	3.35 mm	29 mm	ALSO OPERATES AT 0.95V NOMINAL SUPPLY	29 mm	TSMC	.9 V	1 mm	S-PBGA-B780
5CSEBA2U23C8N	Intel	SoC

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.