Maxim Integrated Other Function uPs,uCs & Peripheral ICs 144

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

DS1075M

Maxim Integrated

MICROPROCESSOR CIRCUIT

COMMERCIAL

THROUGH-HOLE

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5.25 V

IN-LINE

4.75 V

70 Cel

0 Cel

TIN LEAD

DUAL

4.572 mm

7.62 mm

9.375 mm

CMOS

5 V

2.54 mm

R-PDIP-T8

Not Qualified

e0

MAX66242ETB-A+

Maxim Integrated

CRYPTOGRAPHIC AUTHENTICATOR

NO LEAD

10

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

3.63 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC10,.16,20

2.97 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

.8 mm

3 mm

30

260

4 mm

CMOS

3.3 V

.5 mm

R-PDSO-N10

1

e4

MAX66240/W+

Maxim Integrated

CRYPTOGRAPHIC AUTHENTICATOR

NO LEAD

DIE

UNSPECIFIED

UNSPECIFIED

YES

UNCASED CHIP

85 Cel

-40 Cel

UPPER

CMOS

X-XUUC-N

MAX7359BETG+T

Maxim Integrated

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.62 V

85 Cel

-40 Cel

MATTE TIN

QUAD

.8 mm

3.5 mm

30

260

3.5 mm

BICMOS

2.5 V

.4 mm

S-XQCC-N24

1

e3

DS83CH20

Maxim Integrated

COMMERCIAL

GULL WING

160

QFP

SQUARE

PLASTIC/EPOXY

YES

5

FLATPACK

QFP160,1.2SQ

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

CMOS

5 V

Other Microprocessor ICs

.635 mm

S-PQFP-G160

Not Qualified

e0

MAX11835EWA+T

Maxim Integrated

TIN SILVER COPPER NICKEL

30

260

1

e2

78M6610+PSU/C48T

Maxim Integrated

MICROPROCESSOR CIRCUIT

MATTE TIN

30

260

CMOS

1

e3

MAX11835EWA+

Maxim Integrated

TIN SILVER COPPER NICKEL

30

260

1

e2

DS1211S

Maxim Integrated

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

SMALL OUTLINE

70 Cel

0 Cel

TIN LEAD

DUAL

2.65 mm

7.5 mm

245

12.8 mm

CMOS

5 V

1.27 mm

R-PDSO-G20

1

Not Qualified

e0

DS1065-66

Maxim Integrated

MICROPROCESSOR CIRCUIT

COMMERCIAL

THROUGH-HOLE

3

RECTANGULAR

PLASTIC/EPOXY

NO

5.25 V

CYLINDRICAL

4.75 V

70 Cel

0 Cel

TIN LEAD

BOTTOM

CMOS

5 V

R-PBCY-T3

Not Qualified

e0

DS1075C-XXX

Maxim Integrated

MICROPROCESSOR CIRCUIT

COMMERCIAL

5.25 V

4.75 V

70 Cel

0 Cel

TIN LEAD

CMOS

5 V

Not Qualified

e0

78M6610+PSU/B48T

Maxim Integrated

MICROPROCESSOR CIRCUIT

MATTE TIN

30

260

CMOS

1

e3

DS1680FP-3+

Maxim Integrated

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

44

QFP

SQUARE

PLASTIC/EPOXY

YES

3.63 V

3.3

FLATPACK

QFP44,.5SQ,32

2.97 V

70 Cel

0 Cel

MATTE TIN

QUAD

2.45 mm

10 mm

10 mm

CMOS

3 mA

3.3 V

Other Microprocessor ICs

.8 mm

S-PQFP-G44

Not Qualified

e3

MAXQ1062EUD+T

Maxim Integrated

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

14

RECTANGULAR

PLASTIC/EPOXY

YES

109 Cel

-40 Cel

MATTE TIN

DUAL

30

260

CMOS

R-PDSO-G14

1

e3

MAX8893CEWV+

Maxim Integrated

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

30

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.7 V

85 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

.69 mm

2.52 mm

30

260

3.03 mm

BICMOS

3.7 V

.5 mm

R-PBGA-B30

1

Not Qualified

e1

MAX98096EWF+T

Maxim Integrated

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

117

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.33 V

85 Cel

-40 Cel

BOTTOM

.81 mm

4.665 mm

NOT SPECIFIED

NOT SPECIFIED

6.875 mm

CMOS

1.8 V

.5 mm

R-PBGA-B117

MAX11811ETP+

Maxim Integrated

MATTE TIN

30

260

1

e3

MAXQ1062EUD+

Maxim Integrated

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

14

RECTANGULAR

PLASTIC/EPOXY

YES

109 Cel

-40 Cel

MATTE TIN

DUAL

30

260

CMOS

R-PDSO-G14

1

e3

DS1065-60

Maxim Integrated

MICROPROCESSOR CIRCUIT

COMMERCIAL

THROUGH-HOLE

3

RECTANGULAR

PLASTIC/EPOXY

NO

5.25 V

CYLINDRICAL

4.75 V

70 Cel

0 Cel

TIN LEAD

BOTTOM

CMOS

5 V

R-PBCY-T3

Not Qualified

e0

DS1209S-B1

Maxim Integrated

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5

SMALL OUTLINE

SOP16,.4

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

DUAL

CMOS

.5 mA

5 V

Other Microprocessor ICs

1.27 mm

R-PDSO-G16

Not Qualified

e0

DS1065-100

Maxim Integrated

MICROPROCESSOR CIRCUIT

COMMERCIAL

THROUGH-HOLE

3

RECTANGULAR

PLASTIC/EPOXY

NO

5.25 V

CYLINDRICAL

4.75 V

70 Cel

0 Cel

TIN LEAD

BOTTOM

CMOS

5 V

R-PBCY-T3

Not Qualified

e0

DS1222

Maxim Integrated

MICROPROCESSOR CIRCUIT

COMMERCIAL

THROUGH-HOLE

14

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5.5 V

IN-LINE

DIP14,.3

4.5 V

70 Cel

0 Cel

TIN LEAD

DUAL

4.572 mm

7.62 mm

19.05 mm

CMOS

5 V

Other Microprocessor ICs

2.54 mm

R-PDIP-T14

1

Not Qualified

e0

DS1073-66

Maxim Integrated

MICROPROCESSOR CIRCUIT

COMMERCIAL

THROUGH-HOLE

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

3.6 V

IN-LINE

2.7 V

70 Cel

0 Cel

TIN LEAD

DUAL

4.572 mm

7.62 mm

9.375 mm

CMOS

3 V

2.54 mm

R-PDIP-T8

Not Qualified

e0

78M6610+LMU/B48T

Maxim Integrated

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

24

VQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

CHIP CARRIER, VERY THIN PROFILE

3 V

85 Cel

-40 Cel

MATTE TIN

QUAD

.8 mm

4 mm

30

260

4 mm

CMOS

3.3 V

.5 mm

S-XQCC-N24

1

e3

78M6610+LMU/B48

Maxim Integrated

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

24

VQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

CHIP CARRIER, VERY THIN PROFILE

3 V

85 Cel

-40 Cel

MATTE TIN

QUAD

.8 mm

4 mm

30

260

4 mm

CMOS

3.3 V

.5 mm

S-XQCC-N24

1

e3

DS1222N

Maxim Integrated

MICROPROCESSOR CIRCUIT

COMMERCIAL

THROUGH-HOLE

14

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5.5 V

IN-LINE

DIP14,.3

4.5 V

70 Cel

0 Cel

TIN LEAD

DUAL

4.572 mm

7.62 mm

19.05 mm

CMOS

5 V

Other Microprocessor ICs

2.54 mm

R-PDIP-T14

Not Qualified

e0

78M6610+LMU/BAPT

Maxim Integrated

MICROPROCESSOR CIRCUIT

MATTE TIN

30

260

CMOS

1

e3

DS1211S/T&R

Maxim Integrated

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

SMALL OUTLINE

70 Cel

0 Cel

TIN LEAD

DUAL

2.65 mm

7.5 mm

245

12.8 mm

CMOS

5 V

1.27 mm

R-PDSO-G20

1

Not Qualified

e0

MAX66242ISA-A+T

Maxim Integrated

CRYPTOGRAPHIC AUTHENTICATOR

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.63 V

SMALL OUTLINE

SOP8,.25

2.97 V

85 Cel

-40 Cel

MATTE TIN

DUAL

1.75 mm

3.9 mm

30

260

4.9 mm

CMOS

3.3 V

1.27 mm

R-PDSO-G8

1

e3

MAX8893CEWV+T

Maxim Integrated

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

30

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.7 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

.69 mm

2.52 mm

30

260

3.03 mm

CMOS

3.7 V

.5 mm

R-PBGA-B30

1

e1

DS1211SN/T&R

Maxim Integrated

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

SMALL OUTLINE

85 Cel

-40 Cel

TIN LEAD

DUAL

2.65 mm

7.5 mm

12.8 mm

CMOS

5 V

1.27 mm

R-PDSO-G20

1

Not Qualified

e0

78M6610+PSU/B00

Maxim Integrated

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3 V

85 Cel

-40 Cel

MATTE TIN

QUAD

.8 mm

4 mm

30

260

4 mm

CMOS

3.3 V

.5 mm

S-XQCC-N24

1

e3

DS1211N

Maxim Integrated

MICROPROCESSOR CIRCUIT

INDUSTRIAL

THROUGH-HOLE

20

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

IN-LINE

85 Cel

-40 Cel

TIN LEAD

DUAL

4.572 mm

7.62 mm

26.16 mm

CMOS

5 V

2.54 mm

R-PDIP-T20

1

Not Qualified

e0

DS8113-RNG+

Maxim Integrated

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

6 V

3.3,5

SMALL OUTLINE

SOP28,.4

2.7 V

85 Cel

-40 Cel

MATTE TIN

DUAL

2.65 mm

7.5 mm

30

260

17.9 mm

CMOS

3.3 V

Other Microprocessor ICs

1.27 mm

R-PDSO-G28

1

Not Qualified

e3

DS1065-80

Maxim Integrated

MICROPROCESSOR CIRCUIT

COMMERCIAL

THROUGH-HOLE

3

RECTANGULAR

PLASTIC/EPOXY

NO

5.25 V

CYLINDRICAL

4.75 V

70 Cel

0 Cel

TIN LEAD

BOTTOM

CMOS

5 V

R-PBCY-T3

Not Qualified

e0

73S1112F-CGTR/F

Maxim Integrated

DS1073-100

Maxim Integrated

MICROPROCESSOR CIRCUIT

COMMERCIAL

THROUGH-HOLE

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

3.6 V

IN-LINE

2.7 V

70 Cel

0 Cel

TIN LEAD

DUAL

4.572 mm

7.62 mm

9.375 mm

CMOS

3 V

2.54 mm

R-PDIP-T8

Not Qualified

e0

MAX11811GTP/V+T

Maxim Integrated

AEC-Q100

MATTE TIN

30

260

1

e3

DS1073M-66

Maxim Integrated

MICROPROCESSOR CIRCUIT

COMMERCIAL

THROUGH-HOLE

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

3.6 V

IN-LINE

2.7 V

70 Cel

0 Cel

TIN LEAD

DUAL

4.572 mm

7.62 mm

9.375 mm

CMOS

3 V

2.54 mm

R-PDIP-T8

Not Qualified

e0

MAX78615+PPM/C01T

Maxim Integrated

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3 V

85 Cel

-40 Cel

MATTE TIN

QUAD

.8 mm

4 mm

30

260

4 mm

CMOS

3.3 V

.5 mm

S-XQCC-N24

1

e3

78M6610+PSU/C48

Maxim Integrated

MICROPROCESSOR CIRCUIT

MATTE TIN

30

260

CMOS

1

e3

DS1680FP-5

Maxim Integrated

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

44

QFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

5

FLATPACK

QFP44,.5SQ,32

4.5 V

70 Cel

0 Cel

TIN LEAD

QUAD

2.45 mm

10 mm

10 mm

CMOS

5 mA

5 V

Other Microprocessor ICs

.8 mm

S-PQFP-G44

3

Not Qualified

e0

DS1073M-80

Maxim Integrated

MICROPROCESSOR CIRCUIT

COMMERCIAL

THROUGH-HOLE

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

3.6 V

IN-LINE

2.7 V

70 Cel

0 Cel

TIN LEAD

DUAL

4.572 mm

7.62 mm

9.375 mm

CMOS

3 V

2.54 mm

R-PDIP-T8

Not Qualified

e0

DS1073M-60

Maxim Integrated

MICROPROCESSOR CIRCUIT

COMMERCIAL

THROUGH-HOLE

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

3.6 V

IN-LINE

2.7 V

70 Cel

0 Cel

TIN LEAD

DUAL

4.572 mm

7.62 mm

9.375 mm

CMOS

3 V

2.54 mm

R-PDIP-T8

Not Qualified

e0

DS1211SN+T&R

Maxim Integrated

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

SMALL OUTLINE

85 Cel

-40 Cel

MATTE TIN

DUAL

2.65 mm

7.5 mm

12.8 mm

CMOS

5 V

1.27 mm

R-PDSO-G20

1

Not Qualified

e3

DS1222SN

Maxim Integrated

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE

SOP16,.4

4.5 V

70 Cel

0 Cel

TIN LEAD

DUAL

2.65 mm

7.5 mm

10.3 mm

CMOS

5 V

Other Microprocessor ICs

1.27 mm

R-PDSO-G16

1

Not Qualified

e0

MAX7349AEG-T

Maxim Integrated

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

2.5/3.3

SMALL OUTLINE, SHRINK PITCH

SSOP24,.24

2.4 V

125 Cel

-40 Cel

TIN LEAD

DUAL

1.73 mm

3.9 mm

8.65 mm

BICMOS

.1 mA

3.3 V

Parallel IO Port

.635 mm

R-PDSO-G24

Not Qualified

e0

DS1211N+

Maxim Integrated

MICROPROCESSOR CIRCUIT

INDUSTRIAL

THROUGH-HOLE

20

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

IN-LINE

85 Cel

-40 Cel

MATTE TIN

DUAL

4.572 mm

7.62 mm

30

260

26.16 mm

CMOS

5 V

2.54 mm

R-PDIP-T20

1

Not Qualified

e3

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.