Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Information Access Method | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | No. of Bits | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Interrupt Capability | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Ultraviolet Erasable | Terminal Position | DMA Channels | No. of Ports | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | ROM Bits Size | No. of Timers | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Minimum Time | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | Volatile | JESD-609 Code | Maximum Standby Current | On Chip Program ROM Width | No. of I/O Lines | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Maxim Integrated |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.25 V |
IN-LINE |
4.75 V |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
4.572 mm |
7.62 mm |
9.375 mm |
CMOS |
5 V |
2.54 mm |
R-PDIP-T8 |
Not Qualified |
e0 |
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|
Maxim Integrated |
CRYPTOGRAPHIC AUTHENTICATOR |
NO LEAD |
10 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.63 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC10,.16,20 |
2.97 V |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
.8 mm |
3 mm |
30 |
260 |
4 mm |
CMOS |
3.3 V |
.5 mm |
R-PDSO-N10 |
1 |
e4 |
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|
Maxim Integrated |
CRYPTOGRAPHIC AUTHENTICATOR |
NO LEAD |
DIE |
UNSPECIFIED |
UNSPECIFIED |
YES |
UNCASED CHIP |
85 Cel |
-40 Cel |
UPPER |
CMOS |
X-XUUC-N |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.62 V |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
.8 mm |
3.5 mm |
30 |
260 |
3.5 mm |
BICMOS |
2.5 V |
.4 mm |
S-XQCC-N24 |
1 |
e3 |
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Maxim Integrated |
COMMERCIAL |
GULL WING |
160 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
FLATPACK |
QFP160,1.2SQ |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
5 V |
Other Microprocessor ICs |
.635 mm |
S-PQFP-G160 |
Not Qualified |
e0 |
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|
Maxim Integrated |
TIN SILVER COPPER NICKEL |
30 |
260 |
1 |
e2 |
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|
Maxim Integrated |
MICROPROCESSOR CIRCUIT |
MATTE TIN |
30 |
260 |
CMOS |
1 |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
TIN SILVER COPPER NICKEL |
30 |
260 |
1 |
e2 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
SMALL OUTLINE |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
2.65 mm |
7.5 mm |
245 |
12.8 mm |
CMOS |
5 V |
1.27 mm |
R-PDSO-G20 |
1 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
3 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.25 V |
CYLINDRICAL |
4.75 V |
70 Cel |
0 Cel |
TIN LEAD |
BOTTOM |
CMOS |
5 V |
R-PBCY-T3 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
5.25 V |
4.75 V |
70 Cel |
0 Cel |
TIN LEAD |
CMOS |
5 V |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
MICROPROCESSOR CIRCUIT |
MATTE TIN |
30 |
260 |
CMOS |
1 |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
GULL WING |
44 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.63 V |
3.3 |
FLATPACK |
QFP44,.5SQ,32 |
2.97 V |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
2.45 mm |
10 mm |
10 mm |
CMOS |
3 mA |
3.3 V |
Other Microprocessor ICs |
.8 mm |
S-PQFP-G44 |
Not Qualified |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
14 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
109 Cel |
-40 Cel |
MATTE TIN |
DUAL |
30 |
260 |
CMOS |
R-PDSO-G14 |
1 |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
BALL |
30 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
2.7 V |
85 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
.69 mm |
2.52 mm |
30 |
260 |
3.03 mm |
BICMOS |
3.7 V |
.5 mm |
R-PBGA-B30 |
1 |
Not Qualified |
e1 |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
BALL |
117 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
1.33 V |
85 Cel |
-40 Cel |
BOTTOM |
.81 mm |
4.665 mm |
NOT SPECIFIED |
NOT SPECIFIED |
6.875 mm |
CMOS |
1.8 V |
.5 mm |
R-PBGA-B117 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
MATTE TIN |
30 |
260 |
1 |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
14 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
109 Cel |
-40 Cel |
MATTE TIN |
DUAL |
30 |
260 |
CMOS |
R-PDSO-G14 |
1 |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
3 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.25 V |
CYLINDRICAL |
4.75 V |
70 Cel |
0 Cel |
TIN LEAD |
BOTTOM |
CMOS |
5 V |
R-PBCY-T3 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5 |
SMALL OUTLINE |
SOP16,.4 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
CMOS |
.5 mA |
5 V |
Other Microprocessor ICs |
1.27 mm |
R-PDSO-G16 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
3 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.25 V |
CYLINDRICAL |
4.75 V |
70 Cel |
0 Cel |
TIN LEAD |
BOTTOM |
CMOS |
5 V |
R-PBCY-T3 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.5 V |
IN-LINE |
DIP14,.3 |
4.5 V |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
4.572 mm |
7.62 mm |
19.05 mm |
CMOS |
5 V |
Other Microprocessor ICs |
2.54 mm |
R-PDIP-T14 |
1 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
3.6 V |
IN-LINE |
2.7 V |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
4.572 mm |
7.62 mm |
9.375 mm |
CMOS |
3 V |
2.54 mm |
R-PDIP-T8 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
VQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, VERY THIN PROFILE |
3 V |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
.8 mm |
4 mm |
30 |
260 |
4 mm |
CMOS |
3.3 V |
.5 mm |
S-XQCC-N24 |
1 |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
VQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, VERY THIN PROFILE |
3 V |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
.8 mm |
4 mm |
30 |
260 |
4 mm |
CMOS |
3.3 V |
.5 mm |
S-XQCC-N24 |
1 |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.5 V |
IN-LINE |
DIP14,.3 |
4.5 V |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
4.572 mm |
7.62 mm |
19.05 mm |
CMOS |
5 V |
Other Microprocessor ICs |
2.54 mm |
R-PDIP-T14 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
MICROPROCESSOR CIRCUIT |
MATTE TIN |
30 |
260 |
CMOS |
1 |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
SMALL OUTLINE |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
2.65 mm |
7.5 mm |
245 |
12.8 mm |
CMOS |
5 V |
1.27 mm |
R-PDSO-G20 |
1 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
CRYPTOGRAPHIC AUTHENTICATOR |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.63 V |
SMALL OUTLINE |
SOP8,.25 |
2.97 V |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
1.75 mm |
3.9 mm |
30 |
260 |
4.9 mm |
CMOS |
3.3 V |
1.27 mm |
R-PDSO-G8 |
1 |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
BALL |
30 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
2.7 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
.69 mm |
2.52 mm |
30 |
260 |
3.03 mm |
CMOS |
3.7 V |
.5 mm |
R-PBGA-B30 |
1 |
e1 |
|||||||||||||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
SMALL OUTLINE |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
2.65 mm |
7.5 mm |
12.8 mm |
CMOS |
5 V |
1.27 mm |
R-PDSO-G20 |
1 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3 V |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
.8 mm |
4 mm |
30 |
260 |
4 mm |
CMOS |
3.3 V |
.5 mm |
S-XQCC-N24 |
1 |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
IN-LINE |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
4.572 mm |
7.62 mm |
26.16 mm |
CMOS |
5 V |
2.54 mm |
R-PDIP-T20 |
1 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
6 V |
3.3,5 |
SMALL OUTLINE |
SOP28,.4 |
2.7 V |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
2.65 mm |
7.5 mm |
30 |
260 |
17.9 mm |
CMOS |
3.3 V |
Other Microprocessor ICs |
1.27 mm |
R-PDSO-G28 |
1 |
Not Qualified |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
3 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.25 V |
CYLINDRICAL |
4.75 V |
70 Cel |
0 Cel |
TIN LEAD |
BOTTOM |
CMOS |
5 V |
R-PBCY-T3 |
Not Qualified |
e0 |
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Maxim Integrated |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
3.6 V |
IN-LINE |
2.7 V |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
4.572 mm |
7.62 mm |
9.375 mm |
CMOS |
3 V |
2.54 mm |
R-PDIP-T8 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
AEC-Q100 |
MATTE TIN |
30 |
260 |
1 |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
3.6 V |
IN-LINE |
2.7 V |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
4.572 mm |
7.62 mm |
9.375 mm |
CMOS |
3 V |
2.54 mm |
R-PDIP-T8 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3 V |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
.8 mm |
4 mm |
30 |
260 |
4 mm |
CMOS |
3.3 V |
.5 mm |
S-XQCC-N24 |
1 |
e3 |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
MICROPROCESSOR CIRCUIT |
MATTE TIN |
30 |
260 |
CMOS |
1 |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
GULL WING |
44 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
5 |
FLATPACK |
QFP44,.5SQ,32 |
4.5 V |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
2.45 mm |
10 mm |
10 mm |
CMOS |
5 mA |
5 V |
Other Microprocessor ICs |
.8 mm |
S-PQFP-G44 |
3 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
3.6 V |
IN-LINE |
2.7 V |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
4.572 mm |
7.62 mm |
9.375 mm |
CMOS |
3 V |
2.54 mm |
R-PDIP-T8 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
3.6 V |
IN-LINE |
2.7 V |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
4.572 mm |
7.62 mm |
9.375 mm |
CMOS |
3 V |
2.54 mm |
R-PDIP-T8 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
GULL WING |
20 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
SMALL OUTLINE |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
2.65 mm |
7.5 mm |
12.8 mm |
CMOS |
5 V |
1.27 mm |
R-PDSO-G20 |
1 |
Not Qualified |
e3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
MICROPROCESSOR CIRCUIT |
COMMERCIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
SMALL OUTLINE |
SOP16,.4 |
4.5 V |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
2.65 mm |
7.5 mm |
10.3 mm |
CMOS |
5 V |
Other Microprocessor ICs |
1.27 mm |
R-PDSO-G16 |
1 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||||||
Maxim Integrated |
MICROPROCESSOR CIRCUIT |
AUTOMOTIVE |
GULL WING |
24 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
2.5/3.3 |
SMALL OUTLINE, SHRINK PITCH |
SSOP24,.24 |
2.4 V |
125 Cel |
-40 Cel |
TIN LEAD |
DUAL |
1.73 mm |
3.9 mm |
8.65 mm |
BICMOS |
.1 mA |
3.3 V |
Parallel IO Port |
.635 mm |
R-PDSO-G24 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||||||||
|
Maxim Integrated |
MICROPROCESSOR CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
IN-LINE |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
4.572 mm |
7.62 mm |
30 |
260 |
26.16 mm |
CMOS |
5 V |
2.54 mm |
R-PDIP-T20 |
1 |
Not Qualified |
e3 |
Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.
Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.
Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.
Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.