Maxim Integrated Other Function uPs,uCs & Peripheral ICs 144

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

DS2413P

Maxim Integrated

MICROPROCESSOR CIRCUIT

COMMERCIAL

C BEND

6

SOC

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

SMALL OUTLINE

2.8 V

70 Cel

0 Cel

TIN LEAD

DUAL

1.5 mm

3.76 mm

245

3.94 mm

CMOS

3.3 V

1.27 mm

R-PDSO-C6

1

Not Qualified

e0

DS2413P/T&R

Maxim Integrated

MICROPROCESSOR CIRCUIT

COMMERCIAL

C BEND

6

SOC

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

SMALL OUTLINE

2.8 V

70 Cel

0 Cel

TIN LEAD

DUAL

1.5 mm

3.76 mm

3.94 mm

CMOS

3.3 V

1.27 mm

R-PDSO-C6

1

Not Qualified

e0

DS8007-ENG

Maxim Integrated

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

6 V

3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

2.7 V

85 Cel

-40 Cel

TIN LEAD

QUAD

1.6 mm

7 mm

7 mm

CMOS

325 mA

3.3 V

Other Microprocessor ICs

.5 mm

S-PQFP-G48

1

Not Qualified

e0

MXD1210EWE

Maxim Integrated

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE

4.5 V

85 Cel

-40 Cel

TIN LEAD

DUAL

1.75 mm

3.9 mm

9.9 mm

CMOS

.5 mA

5 V

1.27 mm

R-PDSO-G16

1

Not Qualified

e0

MXD1210CWE

Maxim Integrated

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE

4.5 V

70 Cel

0 Cel

TIN LEAD

DUAL

1.75 mm

3.9 mm

9.9 mm

CMOS

.5 mA

5 V

1.27 mm

R-PDSO-G16

1

Not Qualified

e0

MXD1210EWE-T

Maxim Integrated

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE

4.5 V

85 Cel

-40 Cel

TIN LEAD

DUAL

1.75 mm

3.9 mm

9.9 mm

CMOS

.5 mA

5 V

1.27 mm

R-PDSO-G16

1

Not Qualified

e0

DS2460S

Maxim Integrated

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

3/5

SMALL OUTLINE

SOP8,.25

2.7 V

85 Cel

-40 Cel

TIN LEAD

DUAL

1.75 mm

3.9 mm

245

4.9 mm

CMOS

.5 mA

Other Microprocessor ICs

1.27 mm

R-PDSO-G8

Not Qualified

e0

DS2460S/T&R

Maxim Integrated

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

3/5

SMALL OUTLINE

SOP8,.25

2.7 V

85 Cel

-40 Cel

TIN LEAD

DUAL

1.75 mm

3.9 mm

4.9 mm

CMOS

.5 mA

Other Microprocessor ICs

1.27 mm

R-PDSO-G8

Not Qualified

e0

MAX7349AEG

Maxim Integrated

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

2.5/3.3

SMALL OUTLINE, SHRINK PITCH

SSOP24,.24

2.4 V

125 Cel

-40 Cel

TIN LEAD

DUAL

1.73 mm

3.9 mm

8.65 mm

BICMOS

.1 mA

3.3 V

Parallel IO Port

.635 mm

R-PDSO-G24

1

Not Qualified

e0

DS1073-60

Maxim Integrated

MICROPROCESSOR CIRCUIT

COMMERCIAL

THROUGH-HOLE

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

3.6 V

IN-LINE

2.7 V

70 Cel

0 Cel

TIN LEAD

DUAL

4.572 mm

7.62 mm

9.375 mm

CMOS

3 V

2.54 mm

R-PDIP-T8

Not Qualified

e0

MAX7347ATE+

Maxim Integrated

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

2.5/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.16SQ,25

2.4 V

125 Cel

-40 Cel

MATTE TIN

QUAD

.8 mm

4 mm

MONITORS UP TO 24 KEYS

30

260

4 mm

BICMOS

.1 mA

3.3 V

Parallel IO Port

.65 mm

S-XQCC-N16

1

Not Qualified

e3

MAX78615+PPM/A03T

Maxim Integrated

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3 V

85 Cel

-40 Cel

MATTE TIN

QUAD

.8 mm

4 mm

30

260

4 mm

CMOS

3.3 V

.5 mm

S-XQCC-N24

1

e3

DS1211S+

Maxim Integrated

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

SMALL OUTLINE

70 Cel

0 Cel

MATTE TIN

DUAL

2.65 mm

7.5 mm

30

260

12.8 mm

CMOS

5 V

1.27 mm

R-PDSO-G20

1

Not Qualified

e3

DS1211SN

Maxim Integrated

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

SMALL OUTLINE

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

2.65 mm

7.5 mm

20

240

12.8 mm

CMOS

5 V

1.27 mm

R-PDSO-G20

1

Not Qualified

e0

DS1073M-100

Maxim Integrated

MICROPROCESSOR CIRCUIT

COMMERCIAL

THROUGH-HOLE

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

3.6 V

IN-LINE

2.7 V

70 Cel

0 Cel

TIN LEAD

DUAL

4.572 mm

7.62 mm

9.375 mm

CMOS

3 V

2.54 mm

R-PDIP-T8

Not Qualified

e0

78M6610+PSU/B00T

Maxim Integrated

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3 V

85 Cel

-40 Cel

MATTE TIN

QUAD

.8 mm

4 mm

30

260

4 mm

CMOS

3.3 V

.5 mm

S-XQCC-N24

1

e3

78M6610+LMU/B01

Maxim Integrated

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

24

VQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

CHIP CARRIER, VERY THIN PROFILE

3 V

85 Cel

-40 Cel

MATTE TIN

QUAD

.8 mm

4 mm

30

260

4 mm

CMOS

3.3 V

.5 mm

S-XQCC-N24

1

e3

DS1073Z-66

Maxim Integrated

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

SMALL OUTLINE

2.7 V

70 Cel

0 Cel

TIN LEAD

DUAL

1.75 mm

3.9 mm

4.9 mm

CMOS

3 V

1.27 mm

R-PDSO-G8

Not Qualified

e0

MAX78615+LMU/A01T

Maxim Integrated

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

3.45 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3.15 V

85 Cel

-40 Cel

MATTE TIN

QUAD

.8 mm

4 mm

30

260

4 mm

CMOS

3.3 V

.5 mm

S-XQCC-N24

1

e3

MAX78615+LMU/A01

Maxim Integrated

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

3.45 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3.15 V

85 Cel

-40 Cel

MATTE TIN

QUAD

.8 mm

4 mm

30

260

4 mm

CMOS

3.3 V

.5 mm

S-XQCC-N24

1

e3

DS1073-80

Maxim Integrated

MICROPROCESSOR CIRCUIT

COMMERCIAL

THROUGH-HOLE

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

3.6 V

IN-LINE

2.7 V

70 Cel

0 Cel

TIN LEAD

DUAL

4.572 mm

7.62 mm

9.375 mm

CMOS

3 V

2.54 mm

R-PDIP-T8

Not Qualified

e0

MAX66240ESA+T

Maxim Integrated

CRYPTOGRAPHIC AUTHENTICATOR

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

SMALL OUTLINE

SOP8,.25

85 Cel

-40 Cel

MATTE TIN

DUAL

1.75 mm

3.9 mm

30

260

4.9 mm

CMOS

1.27 mm

R-PDSO-G8

1

MAX7347AEE-T

Maxim Integrated

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

GULL WING

16

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

2.5/3.3

SMALL OUTLINE, SHRINK PITCH

SSOP16,.25

2.4 V

125 Cel

-40 Cel

TIN LEAD

DUAL

1.73 mm

3.9 mm

4.89 mm

BICMOS

.1 mA

3.3 V

Parallel IO Port

.635 mm

R-PDSO-G16

1

Not Qualified

e0

MAX7348AEP-T

Maxim Integrated

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

GULL WING

20

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

2.5/3.3

SMALL OUTLINE, SHRINK PITCH

SSOP20,.25

2.4 V

125 Cel

-40 Cel

TIN LEAD

DUAL

1.73 mm

3.9 mm

8.65 mm

BICMOS

.1 mA

3.3 V

Parallel IO Port

.635 mm

R-PDSO-G20

Not Qualified

e0

DS1221NS

Maxim Integrated

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE

4.5 V

85 Cel

-40 Cel

TIN LEAD

DUAL

2.65 mm

7.5 mm

10.3 mm

CMOS

5 V

1.27 mm

R-PDSO-G16

1

Not Qualified

e0

DS1075Z

Maxim Integrated

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.25 V

SMALL OUTLINE

4.75 V

70 Cel

0 Cel

TIN LEAD

DUAL

1.75 mm

3.9 mm

4.9 mm

CMOS

5 V

1.27 mm

R-PDSO-G8

1

Not Qualified

e0

73S1120F-CGTR/F

Maxim Integrated

DS1481S+

Maxim Integrated

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE

2.7 V

40 Cel

0 Cel

MATTE TIN

DUAL

1.75 mm

3.9 mm

30

260

8.65 mm

CMOS

5 V

1.27 mm

R-PDSO-G14

1

Not Qualified

e3

78M6610+LMU/D01

Maxim Integrated

MICROPROCESSOR CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

CMOS

DS1680FP-5+

Maxim Integrated

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

44

QFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

5

FLATPACK

QFP44,.5SQ,32

4.5 V

70 Cel

0 Cel

MATTE TIN

QUAD

2.45 mm

10 mm

10 mm

CMOS

5 mA

5 V

Other Microprocessor ICs

.8 mm

S-PQFP-G44

Not Qualified

e3

MAX8893AEWV+T

Maxim Integrated

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

30

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.7 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

.69 mm

2.52 mm

30

260

3.03 mm

CMOS

3.7 V

.5 mm

R-PBGA-B30

1

e1

DS1073Z-80

Maxim Integrated

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

SMALL OUTLINE

2.7 V

70 Cel

0 Cel

TIN LEAD

DUAL

1.75 mm

3.9 mm

4.9 mm

CMOS

3 V

1.27 mm

R-PDSO-G8

Not Qualified

e0

DS1211+

Maxim Integrated

MICROPROCESSOR CIRCUIT

COMMERCIAL

THROUGH-HOLE

20

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

IN-LINE

70 Cel

0 Cel

MATTE TIN

DUAL

4.572 mm

7.62 mm

30

260

26.16 mm

CMOS

5 V

2.54 mm

R-PDIP-T20

1

Not Qualified

e3

78M6610+PSU/C00T

Maxim Integrated

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

3 V

85 Cel

-40 Cel

MATTE TIN

DUAL

1.1 mm

4.4 mm

30

260

5 mm

CMOS

3.3 V

.65 mm

R-PDSO-G16

1

e3

78M6610+PSU/EK#1

Maxim Integrated

MICROPROCESSOR CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

CMOS

DS1481S+T&R

Maxim Integrated

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE

2.7 V

40 Cel

0 Cel

MATTE TIN

DUAL

30

260

CMOS

5 V

R-PDSO-G14

1

Not Qualified

e3

MAXQ1062ETP+T

Maxim Integrated

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

20

RECTANGULAR

UNSPECIFIED

YES

109 Cel

-40 Cel

MATTE TIN

QUAD

30

260

CMOS

R-XQCC-N20

1

e3

DS8313-RRX+

Maxim Integrated

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

6 V

3.3,5

SMALL OUTLINE

SOP28,.4

2.7 V

85 Cel

-40 Cel

MATTE TIN

DUAL

2.65 mm

7.5 mm

30

260

17.9 mm

CMOS

85 mA

3.3 V

Other Microprocessor ICs

1.27 mm

R-PDSO-G28

1

Not Qualified

e3

MAX78615+PPM/C01

Maxim Integrated

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3 V

85 Cel

-40 Cel

MATTE TIN

QUAD

.8 mm

4 mm

30

260

4 mm

CMOS

3.3 V

.5 mm

S-XQCC-N24

1

e3

73S1120F-CGT/F

Maxim Integrated

MAX7347ATE+T

Maxim Integrated

MICROPROCESSOR CIRCUIT

AUTOMOTIVE

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

2.5/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.16SQ,25

2.4 V

125 Cel

-40 Cel

MATTE TIN

QUAD

.8 mm

4 mm

MONITORS UP TO 24 KEYS

30

260

4 mm

BICMOS

.1 mA

3.3 V

Parallel IO Port

.65 mm

S-XQCC-N16

1

Not Qualified

e3

DS1222S

Maxim Integrated

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE

SOP16,.4

4.5 V

70 Cel

0 Cel

TIN LEAD

DUAL

2.65 mm

7.5 mm

10.3 mm

CMOS

5 V

Other Microprocessor ICs

1.27 mm

R-PDSO-G16

1

Not Qualified

e0

DS1073Z-100

Maxim Integrated

MICROPROCESSOR CIRCUIT

COMMERCIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

SMALL OUTLINE

2.7 V

70 Cel

0 Cel

TIN LEAD

DUAL

1.75 mm

3.9 mm

245

4.9 mm

CMOS

3 V

1.27 mm

R-PDSO-G8

Not Qualified

e0

MAX7359ETG+G47

Maxim Integrated

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.62 V

85 Cel

-40 Cel

QUAD

.8 mm

3.5 mm

NOT SPECIFIED

NOT SPECIFIED

3.5 mm

BICMOS

2.5 V

.4 mm

S-XQCC-N24

MAX8893AEWV+

Maxim Integrated

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

30

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.7 V

85 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

.69 mm

2.52 mm

30

260

3.03 mm

BICMOS

3.7 V

.5 mm

R-PBGA-B30

1

Not Qualified

e1

MAX66240ISA+

Maxim Integrated

CRYPTOGRAPHIC AUTHENTICATOR

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

SMALL OUTLINE

SOP8,.25

85 Cel

-40 Cel

MATTE TIN

DUAL

1.75 mm

3.9 mm

30

260

4.9 mm

CMOS

1.27 mm

R-PDSO-G8

1

e3

78M6610+LMU/B01T

Maxim Integrated

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

24

VQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

CHIP CARRIER, VERY THIN PROFILE

3 V

85 Cel

-40 Cel

MATTE TIN

QUAD

.8 mm

4 mm

30

260

4 mm

CMOS

3.3 V

.5 mm

S-XQCC-N24

1

e3

MAX7359EWA+

Maxim Integrated

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1.8/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA25,5X5,16

1.62 V

85 Cel

-40 Cel

TIN SILVER COPPER NICKEL

BOTTOM

.69 mm

2.09 mm

30

260

2.09 mm

BICMOS

.06 mA

2.5 V

Parallel IO Port

.4 mm

S-PBGA-B25

1

Not Qualified

e2

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.