240 Serial Communication Controllers 18

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Maximum Data Transfer Rate	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Data Encoding or Decoding Method	Communication Protocol	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Low Power Mode	JESD-609 Code	No. of I/O Lines
MC68360AI25L	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	GULL WING	240	QFP	SQUARE	PLASTIC/EPOXY	YES			32	FLATPACK			85 Cel	1.25 MBps	-40 Cel	TIN	QUAD					YES	32		ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC	25 MHz	40	260		CMOS					68000		S-PQFP-G240	3		YES	e3
MC68EN360AI25L	NXP Semiconductors	MICROCONTROLLER, RISC		GULL WING	240	QFP	SQUARE	PLASTIC/EPOXY	YES				FLATPACK						TIN	QUAD										40	260		CMOS							S-PQFP-G240	3			e3
MC68360CAI25L	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL		GULL WING	240	FQFP	SQUARE	PLASTIC/EPOXY	YES		8	32	FLATPACK, FINE PITCH	QFP240,1.3SQ,20		85 Cel	1.25 MBps	-40 Cel	TIN	QUAD	4.1 mm	2560	32 mm		YES	32		ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC	25 MHz	40	260	32 mm	CMOS			2	7	SCC, SMC, SPI, UART	.5 mm	S-PQFP-G240	3		YES	e3
MC68EN360CAI25L	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL		GULL WING	240	QFP	SQUARE	PLASTIC/EPOXY	YES			32	FLATPACK				1.25 MBps		TIN	QUAD					YES	32		ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC	25 MHz	40	260		CMOS			2		68000		S-PQFP-G240	3		YES	e3
MC68MH360AI25L	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	GULL WING	240	FQFP	SQUARE	PLASTIC/EPOXY	YES	5.25 V		32	FLATPACK, FINE PITCH		4.75 V	70 Cel	1.25 MBps	0 Cel	TIN	QUAD	4.15 mm		31.305 mm	ALSO OPERATES AT 3.3 V	YES	32	NRZ; NRZI-MARK; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL	BISYNC, HDLC; ETHERNET, PROFIBUS; SS7 TRANSPARENT; X.21; V.14; UART; APPLE TALK; DDCMP	25 MHz	40	260	31.305 mm	CMOS		5 V			MC68040; MC68030	.5 mm	S-PQFP-G240	3		YES	e3
MC68360AI33L	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	GULL WING	240	QFP	SQUARE	PLASTIC/EPOXY	YES			32	FLATPACK			85 Cel	1.25 MBps	-40 Cel	TIN	QUAD					YES	32		ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC	25 MHz	40	260		CMOS					68000		S-PQFP-G240	3		YES	e3
MC68360EM25L	Motorola	SERIAL IO/COMMUNICATION CONTROLLER, LAN	COMMERCIAL	GULL WING	240	FQFP	SQUARE	PLASTIC/EPOXY	YES	5.25 V		32	FLATPACK, FINE PITCH		4.75 V	70 Cel	1.25 MBps	0 Cel		QUAD	4.15 mm		31.305 mm		YES	32	NRZ; NRZI; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL	ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC	25 MHz			31.305 mm	HCMOS		5 V		4	68000	.5 mm	S-PQFP-G240		Not Qualified	YES
TNETX3270PGV	Texas Instruments	SERIAL IO/COMMUNICATION CONTROLLER, LAN	OTHER	GULL WING	240	HFQFP	SQUARE	PLASTIC/EPOXY	YES	2.7 V		2	FLATPACK, HEAT SINK/SLUG, FINE PITCH		2.3 V	95 Cel	75 MBps	0 Cel		QUAD	4.2 mm		32 mm	ALSO REQUIRES 3.3V SUPPLY	YES	8			83.33 MHz	NOT SPECIFIED	NOT SPECIFIED	32 mm	CMOS		2.5 V		27		.5 mm	S-PQFP-G240		Not Qualified	NO
TNETX3100PGC	Texas Instruments	SERIAL IO/COMMUNICATION CONTROLLER, LAN	OTHER	GULL WING	240	FQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		2	FLATPACK, FINE PITCH		3 V	95 Cel	25 MBps	0 Cel		QUAD	4.2 mm		32 mm	ALSO REQUIRES 5V SUPPLY	YES	8			50 MHz	NOT SPECIFIED	NOT SPECIFIED	32 mm	CMOS		3.3 V		10		.5 mm	S-PQFP-G240		Not Qualified	NO
TNETX3100PGW	Texas Instruments	SERIAL IO/COMMUNICATION CONTROLLER, LAN	OTHER	GULL WING	240	HQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		2	FLATPACK, HEAT SINK/SLUG		3 V	95 Cel	25 MBps	0 Cel		QUAD				ALSO REQUIRES 5V SUPPLY	YES	8			50 MHz	NOT SPECIFIED	NOT SPECIFIED		CMOS		3.3 V		10			S-PQFP-G240		Not Qualified	NO
TNETX3190PGV	Texas Instruments	SERIAL IO/COMMUNICATION CONTROLLER, LAN	OTHER	GULL WING	240	HFQFP	SQUARE	PLASTIC/EPOXY	YES	2.7 V		2	FLATPACK, HEAT SINK/SLUG, FINE PITCH		2.3 V	95 Cel	75 MBps	0 Cel		QUAD	4.2 mm		32 mm	ALSO REQUIRES 3.3V SUPPLY	YES	8			83.33 MHz	NOT SPECIFIED	NOT SPECIFIED	32 mm	CMOS		2.5 V		19		.5 mm	S-PQFP-G240		Not Qualified	NO
TNETX3151PGV	Texas Instruments	SERIAL IO/COMMUNICATION CONTROLLER, LAN	OTHER	GULL WING	240	HFQFP	SQUARE	PLASTIC/EPOXY	YES	2.7 V		2	FLATPACK, HEAT SINK/SLUG, FINE PITCH		2.3 V	95 Cel	12.5 MBps	0 Cel		QUAD	4.2 mm		32 mm	ALSO REQUIRES 3.3V SUPPLY	YES	8			83.33 MHz	NOT SPECIFIED	NOT SPECIFIED	32 mm	CMOS		2.5 V		15		.5 mm	S-PQFP-G240		Not Qualified	NO
TNETX3110PGV	Texas Instruments	SERIAL IO/COMMUNICATION CONTROLLER, LAN	OTHER	GULL WING	240	HFQFP	SQUARE	PLASTIC/EPOXY	YES	2.7 V		2	FLATPACK, HEAT SINK/SLUG, FINE PITCH		2.3 V	95 Cel	75 MBps	0 Cel		QUAD	4.2 mm		32 mm	ALSO REQUIRES 3.3V SUPPLY	YES	8				NOT SPECIFIED	NOT SPECIFIED	32 mm	CMOS		2.5 V		11		.5 mm	S-PQFP-G240		Not Qualified	NO
MC68MH360AI25VL	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	GULL WING	240	FQFP	SQUARE	PLASTIC/EPOXY	YES	5.25 V		32	FLATPACK, FINE PITCH		4.75 V	70 Cel	1.25 MBps	0 Cel	Matte Tin (Sn)	QUAD	4.15 mm		31.305 mm	ALSO OPERATES AT 3.3 V	YES	32	NRZ; NRZI-MARK; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL	BISYNC, HDLC; ETHERNET, PROFIBUS; SS7 TRANSPARENT; X.21; V.14; UART; APPLE TALK; DDCMP	25 MHz	40	260	31.305 mm	CMOS		5 V			MC68040; MC68030	.5 mm	S-PQFP-G240	3		YES	e3
MC68360FE25V	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL		GULL WING	240	FQFP	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	3.3 V		32	FLATPACK, FINE PITCH	QFP240,1.3SQ,20	2.7 V	70 Cel	1.25 MBps	0 Cel		QUAD	4.15 mm		31.305 mm		YES	32		ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC	25 MHz			31.305 mm	CMOS	327 mA	3 V	2	6	SCC, SMC	.5 mm	S-CQFP-G240			YES		46
MC68360AI33L,557	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	GULL WING	240	QFP	SQUARE	PLASTIC/EPOXY	YES			32	FLATPACK			85 Cel	1.25 MBps	-40 Cel		QUAD					YES	32		ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC	25 MHz				CMOS					68000		S-PQFP-G240			YES
MC68EN360CAI25L,557	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL		GULL WING	240	QFP	SQUARE	PLASTIC/EPOXY	YES			32	FLATPACK				.0000006061088009 MBps		Tin (Sn)	QUAD					YES	32		BISYNC, HDLC; ETHERNET, PROFIBUS; SS7; TRANSPARENT; X.21; V.14; UART; APPLE TALK; DDCMP					CMOS					68000		S-PQFP-G240	3		YES	e3
MC68360CFE25	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL		GULL WING	240	FQFP	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	5.25 V		32	FLATPACK, FINE PITCH	QFP240,1.3SQ,20	4.75 V	85 Cel	1.25 MBps	-40 Cel		QUAD	4.15 mm		31.305 mm		YES	32		ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC	25 MHz			31.305 mm	CMOS	327 mA	5 V	2	6	SCC, SMC	.5 mm	S-CQFP-G240			YES		46

Serial Communication Controllers

Serial communication controllers are electronic devices that manage the input/output operations between a computer or microcontroller and other devices through serial communication protocols such as UART, SPI, I2C, and USB. These controllers provide an interface that allows the computer or microcontroller to send and receive data over a serial connection and manage the communication operations.

Serial communication controllers can be integrated into the computer or microcontroller's chipset or added as an external module. They typically include a serial interface that connects to the device and a host interface that connects to the computer or microcontroller's bus system. The serial interface can be based on various standards such as UART, SPI, or I2C, while the host interface can be based on various standards such as PCI, PCIe, or USB.

Serial communication controllers offer various benefits such as increased data transfer rates, improved reliability, and increased compatibility with a wide range of devices. They also provide advanced features such as error checking, flow control, and clock synchronization that can improve the accuracy and reliability of the communication.