Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Maximum Data Transfer Rate | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Maximum Seated Height | ROM Words | RAM Words | Width | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Data Encoding or Decoding Method | Communication Protocol | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | No. of Timers | RAM Bytes | Technology | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Drive Interface Standard | Low Power Mode | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
AUTOMOTIVE |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
8 |
SMALL OUTLINE |
4.5 V |
125 Cel |
.125 MBps |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2.65 mm |
7.5 mm |
NO |
8 |
NRZ |
24 MHz |
30 |
260 |
17.9 mm |
CMOS |
5 V |
2 |
1.27 mm |
R-PDSO-G28 |
1 |
Not Qualified |
YES |
e4 |
||||||||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
GULL WING |
28 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
TS 16949 |
0 |
SMALL OUTLINE, SHRINK PITCH |
2.7 V |
125 Cel |
.125 MBps |
-40 Cel |
MATTE TIN |
DUAL |
2 mm |
5.3 mm |
NO |
0 |
CAN |
25 MHz |
40 |
260 |
10.2 mm |
CMOS |
10 mA |
4.5 V |
1 |
SPI |
.65 mm |
R-PDSO-G28 |
2 |
YES |
||||||||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
INDUSTRIAL |
GULL WING |
28 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
8 |
TS 16949 |
3.3 |
SMALL OUTLINE, SHRINK PITCH |
SSOP28,.3 |
3.1 V |
85 Cel |
1.25 MBps |
-40 Cel |
MATTE TIN |
DUAL |
2 mm |
8192 |
5.3 mm |
NO |
SYNC; BIT ;BYTE |
25 MHz |
260 |
10.2 mm |
CMOS |
180 mA |
3.3 V |
1 |
Serial IO/Communication Controllers |
SPI |
.65 mm |
R-PDSO-G28 |
1 |
Not Qualified |
YES |
e3 |
|||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
NO LEAD |
28 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
TS 16949 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.7 V |
125 Cel |
.125 MBps |
-40 Cel |
MATTE TIN |
QUAD |
1 mm |
6 mm |
NO |
0 |
CAN |
25 MHz |
40 |
260 |
6 mm |
CMOS |
10 mA |
4.5 V |
1 |
SPI |
.65 mm |
S-PQCC-N28 |
1 |
YES |
e3 |
|||||||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
INDUSTRIAL |
NO LEAD |
28 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
8 |
TS 16949 |
0 |
3.3 |
CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG |
LCC28,.24SQ,25 |
3.1 V |
85 Cel |
1.25 MBps |
-40 Cel |
MATTE TIN |
QUAD |
1 mm |
8192 |
6 mm |
NO |
0 |
SYNC; BIT ;BYTE |
25 MHz |
40 |
260 |
6 mm |
CMOS |
180 mA |
3.3 V |
1 |
Serial IO/Communication Controllers |
SPI |
.65 mm |
S-PQCC-N28 |
1 |
Not Qualified |
YES |
e3 |
||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
INDUSTRIAL |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
8 |
TS 16949 |
0 |
3.3 |
SMALL OUTLINE |
SOP28,.4 |
3.1 V |
85 Cel |
1.25 MBps |
-40 Cel |
Matte Tin (Sn) |
DUAL |
2.65 mm |
8192 |
7.5 mm |
NO |
0 |
SYNC; BIT ;BYTE |
25 MHz |
40 |
250 |
17.9 mm |
CMOS |
180 mA |
3.3 V |
1 |
Serial IO/Communication Controllers |
SPI |
1.27 mm |
R-PDSO-G28 |
1 |
Not Qualified |
YES |
e3 |
||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
NO LEAD |
28 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
TS 16949 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.7 V |
125 Cel |
.125 MBps |
-40 Cel |
MATTE TIN |
QUAD |
1 mm |
6 mm |
NO |
0 |
CAN |
25 MHz |
40 |
260 |
6 mm |
CMOS |
10 mA |
4.5 V |
1 |
SPI |
.65 mm |
S-PQCC-N28 |
1 |
YES |
e3 |
|||||||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
COMMERCIAL |
GULL WING |
28 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
8 |
TS 16949 |
0 |
SMALL OUTLINE, SHRINK PITCH |
SSOP28,.3 |
3.1 V |
70 Cel |
1.25 MBps |
0 Cel |
MATTE TIN |
DUAL |
2 mm |
8192 |
5.3 mm |
NO |
0 |
SYNC; BIT ;BYTE |
25 MHz |
40 |
260 |
10.2 mm |
CMOS |
180 mA |
3.3 V |
1 |
SPI |
.65 mm |
R-PDSO-G28 |
2 |
YES |
e3 |
|||||||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
AUTOMOTIVE |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
8 |
SMALL OUTLINE |
4.5 V |
125 Cel |
.125 MBps |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2.65 mm |
7.5 mm |
NO |
8 |
NRZ |
24 MHz |
30 |
260 |
17.9 mm |
CMOS |
5 V |
2 |
1.27 mm |
R-PDSO-G28 |
1 |
Not Qualified |
YES |
e4 |
||||||||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
INDUSTRIAL |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
8 |
TS 16949 |
0 |
3.3 |
SMALL OUTLINE |
SOP28,.4 |
3.1 V |
85 Cel |
1.25 MBps |
-40 Cel |
MATTE TIN |
DUAL |
2.65 mm |
8192 |
7.5 mm |
NO |
0 |
SYNC; BIT ;BYTE |
25 MHz |
250 |
17.9 mm |
CMOS |
180 mA |
3.3 V |
1 |
Serial IO/Communication Controllers |
SPI |
1.27 mm |
R-PDSO-G28 |
1 |
Not Qualified |
YES |
e3 |
|||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
INDUSTRIAL |
GULL WING |
28 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
8 |
TS 16949 |
3.3 |
SMALL OUTLINE, SHRINK PITCH |
SSOP28,.3 |
3.1 V |
85 Cel |
1.25 MBps |
-40 Cel |
MATTE TIN |
DUAL |
2 mm |
8192 |
5.3 mm |
NO |
SYNC; BIT ;BYTE |
25 MHz |
40 |
260 |
10.2 mm |
CMOS |
180 mA |
3.3 V |
1 |
Serial IO/Communication Controllers |
SPI |
.65 mm |
R-PDSO-G28 |
2 |
Not Qualified |
YES |
e3 |
||||||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
GULL WING |
28 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
2 |
2.5/3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP28,.25 |
3 V |
95 Cel |
.625 MBps |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
1.1 mm |
4.4 mm |
ALSO OPERATES AT 2.5V SUPPLY |
NO |
0 |
ASYNC, BIT |
80 MHz |
30 |
260 |
9.7 mm |
CMOS |
3.3 V |
2 |
Serial IO/Communication Controllers |
.65 mm |
R-PDSO-G28 |
1 |
Not Qualified |
YES |
e4 |
||||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
GULL WING |
28 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
AEC-Q100; TS 16949 |
0 |
SMALL OUTLINE, SHRINK PITCH |
2.7 V |
125 Cel |
.125 MBps |
-40 Cel |
DUAL |
2 mm |
5.3 mm |
NO |
0 |
CAN |
25 MHz |
10.2 mm |
CMOS |
10 mA |
4.5 V |
1 |
SPI |
.65 mm |
R-PDSO-G28 |
YES |
||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
COMMERCIAL |
GULL WING |
28 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
8 |
TS 16949 |
3.3 |
SMALL OUTLINE, SHRINK PITCH |
SSOP28,.3 |
3.1 V |
70 Cel |
1.25 MBps |
0 Cel |
MATTE TIN |
DUAL |
2 mm |
8192 |
5.3 mm |
NO |
SYNC; BIT ;BYTE |
25 MHz |
10.2 mm |
CMOS |
180 mA |
3.3 V |
1 |
Serial IO/Communication Controllers |
SPI |
.65 mm |
R-PDSO-G28 |
Not Qualified |
YES |
e3 |
|||||||||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
GULL WING |
28 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
2 |
2.5/3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP28,.25 |
3 V |
95 Cel |
.625 MBps |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
1.1 mm |
4.4 mm |
ALSO OPERATES AT 2.5V SUPPLY |
NO |
0 |
ASYNC, BIT |
80 MHz |
30 |
260 |
9.7 mm |
CMOS |
3.3 V |
2 |
Serial IO/Communication Controllers |
.65 mm |
R-PDSO-G28 |
1 |
Not Qualified |
YES |
e4 |
||||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
GULL WING |
28 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
TS 16949 |
0 |
SMALL OUTLINE, SHRINK PITCH |
2.7 V |
125 Cel |
.125 MBps |
-40 Cel |
MATTE TIN |
DUAL |
2 mm |
5.3 mm |
NO |
0 |
CAN |
25 MHz |
40 |
260 |
10.2 mm |
CMOS |
10 mA |
4.5 V |
1 |
SPI |
.65 mm |
R-PDSO-G28 |
2 |
YES |
||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
AUTOMOTIVE |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
8 |
5 |
SMALL OUTLINE |
SOP28,.4 |
4.5 V |
125 Cel |
.125 MBps |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2.65 mm |
7.5 mm |
NO |
8 |
NRZ |
24 MHz |
30 |
260 |
17.9 mm |
CMOS |
15 mA |
5 V |
2 |
Serial IO/Communication Controllers |
1.27 mm |
R-PDSO-G28 |
1 |
Not Qualified |
YES |
e4 |
||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
AUTOMOTIVE |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
8 |
SMALL OUTLINE |
4.5 V |
125 Cel |
.125 MBps |
-40 Cel |
MATTE TIN |
DUAL |
2.65 mm |
7.5 mm |
NO |
8 |
NRZ |
24 MHz |
17.9 mm |
CMOS |
5 V |
2 |
1.27 mm |
R-PDSO-G28 |
Not Qualified |
YES |
e3 |
||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
INDUSTRIAL |
NO LEAD |
28 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
8 |
TS 16949 |
0 |
3.3 |
CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG |
LCC28,.24SQ,25 |
3.1 V |
85 Cel |
1.25 MBps |
-40 Cel |
MATTE TIN |
QUAD |
1 mm |
8192 |
6 mm |
NO |
0 |
SYNC; BIT ;BYTE |
25 MHz |
40 |
260 |
6 mm |
CMOS |
180 mA |
3.3 V |
1 |
Serial IO/Communication Controllers |
SPI |
.65 mm |
S-PQCC-N28 |
1 |
Not Qualified |
YES |
e3 |
||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
AUTOMOTIVE |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
8 |
SMALL OUTLINE |
4.5 V |
125 Cel |
.125 MBps |
-40 Cel |
MATTE TIN |
DUAL |
2.65 mm |
7.5 mm |
NO |
8 |
NRZ |
24 MHz |
17.9 mm |
CMOS |
5 V |
2 |
1.27 mm |
R-PDSO-G28 |
Not Qualified |
YES |
e3 |
||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
INDUSTRIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
3.6 V |
8 |
TS 16949 |
0 |
3.3 |
IN-LINE |
DIP28,.6 |
3.1 V |
85 Cel |
1.25 MBps |
-40 Cel |
MATTE TIN |
DUAL |
4.572 mm |
8192 |
15.24 mm |
NO |
0 |
SYNC; BIT ;BYTE |
25 MHz |
34.671 mm |
CMOS |
180 mA |
3.3 V |
1 |
Serial IO/Communication Controllers |
SPI |
2.54 mm |
R-PDIP-T28 |
Not Qualified |
YES |
e3 |
|||||||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
GULL WING |
28 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
2 |
2.5/3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP28,.25 |
3 V |
95 Cel |
.625 MBps |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
1.1 mm |
4.4 mm |
ALSO OPERATES AT 2.5V SUPPLY |
NO |
0 |
ASYNC, BIT |
80 MHz |
30 |
260 |
9.7 mm |
CMOS |
3.3 V |
2 |
Serial IO/Communication Controllers |
.65 mm |
R-PDSO-G28 |
1 |
Not Qualified |
YES |
e4 |
||||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
NO LEAD |
28 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
AEC-Q100; TS 16949 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.7 V |
125 Cel |
.125 MBps |
-40 Cel |
QUAD |
1 mm |
6 mm |
NO |
0 |
CAN |
25 MHz |
6 mm |
CMOS |
10 mA |
4.5 V |
1 |
SPI |
.65 mm |
S-PQCC-N28 |
YES |
||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
AUTOMOTIVE |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
8 |
5 |
SMALL OUTLINE |
SOP28,.4 |
4.5 V |
125 Cel |
.125 MBps |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
2.65 mm |
7.5 mm |
NO |
8 |
NRZ |
24 MHz |
40 |
260 |
17.9 mm |
CMOS |
15 mA |
5 V |
2 |
Serial IO/Communication Controllers |
1.27 mm |
R-PDSO-G28 |
Not Qualified |
YES |
e4 |
|||||||||||||||||||||||||||||
Maxim Integrated |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
GULL WING |
28 |
HSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
5 |
SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH |
SSOP28,.25 |
4.5 V |
70 Cel |
.029296875 MBps |
0 Cel |
TIN LEAD |
DUAL |
1.73 mm |
3.9 mm |
NO |
1 |
9.89 mm |
CMOS |
5 V |
1 |
Serial IO/Communication Controllers |
.635 mm |
R-PDSO-G28 |
1 |
Not Qualified |
YES |
e0 |
|||||||||||||||||||||||||||||||||||
|
Analog Devices |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
GULL WING |
28 |
HSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
5 |
SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH |
SSOP28,.25 |
4.5 V |
70 Cel |
.029296875 MBps |
0 Cel |
Matte Tin (Sn) - annealed |
DUAL |
1.75 mm |
3.9 mm |
NO |
1 |
30 |
260 |
9.9 mm |
CMOS |
5 V |
1 |
Serial IO/Communication Controllers |
.635 mm |
R-PDSO-G28 |
1 |
Not Qualified |
YES |
e3 |
||||||||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
8 |
3 |
5 |
CHIP CARRIER |
LDCC28,.5SQ |
4.5 V |
85 Cel |
.625 MBps |
-40 Cel |
MATTE TIN |
QUAD |
4.572 mm |
2048 |
11.5062 mm |
NO |
8 |
NRZ |
ASYNC, BIT; SYNC, BYTE |
40 MHz |
40 |
245 |
11.5062 mm |
CMOS |
5 V |
1 |
Serial IO/Communication Controllers |
8051; 6801 |
1.27 mm |
S-PQCC-J28 |
3 |
Not Qualified |
NO |
e3 |
|||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
NO LEAD |
28 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
AEC-Q100; TS 16949 |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.7 V |
125 Cel |
.125 MBps |
-40 Cel |
QUAD |
1 mm |
6 mm |
NO |
0 |
CAN |
25 MHz |
6 mm |
CMOS |
10 mA |
4.5 V |
1 |
SPI |
.65 mm |
S-PQCC-N28 |
YES |
||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
AUTOMOTIVE |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
8 |
5 |
SMALL OUTLINE |
SOP28,.4 |
4.5 V |
125 Cel |
.125 MBps |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2.65 mm |
7.5 mm |
NO |
8 |
NRZ |
24 MHz |
40 |
260 |
17.9 mm |
CMOS |
15 mA |
5 V |
2 |
Serial IO/Communication Controllers |
1.27 mm |
R-PDSO-G28 |
Not Qualified |
YES |
e4 |
|||||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
GULL WING |
28 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
AEC-Q100; TS 16949 |
0 |
SMALL OUTLINE, SHRINK PITCH |
2.7 V |
125 Cel |
.125 MBps |
-40 Cel |
DUAL |
2 mm |
5.3 mm |
NO |
0 |
CAN |
25 MHz |
10.2 mm |
CMOS |
10 mA |
4.5 V |
1 |
SPI |
.65 mm |
R-PDSO-G28 |
YES |
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|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
GULL WING |
28 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
2 |
2.5/3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP28,.25 |
3 V |
95 Cel |
.625 MBps |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
1.1 mm |
4.4 mm |
ALSO OPERATES AT 2.5V SUPPLY |
NO |
0 |
ASYNC, BIT |
80 MHz |
30 |
260 |
9.7 mm |
CMOS |
3.3 V |
2 |
Serial IO/Communication Controllers |
.65 mm |
R-PDSO-G28 |
1 |
Not Qualified |
YES |
e4 |
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|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
3.465 V |
8 |
TS 16949 |
3 |
CHIP CARRIER |
LDCC28,.5SQ |
3.135 V |
85 Cel |
.625 MBps |
-40 Cel |
MATTE TIN |
QUAD |
4.572 mm |
2048 |
11.5062 mm |
NO |
8 |
NRZ |
ASYNC, BIT |
40 MHz |
11.5062 mm |
CMOS |
3.3 V |
1 |
8051; 6801 |
1.27 mm |
S-PQCC-J28 |
Not Qualified |
NO |
e3 |
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|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
GULL WING |
28 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2.5/3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP28,.25 |
95 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
Serial IO/Communication Controllers |
.635 mm |
R-PDSO-G28 |
1 |
Not Qualified |
e4 |
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|
Silicon Labs |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
INDUSTRIAL |
NO LEAD |
28 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
8 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3.1 V |
85 Cel |
-40 Cel |
QUAD |
1 mm |
5 mm |
YES |
8 |
20 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
5 mm |
CMOS |
3.3 V |
1 |
.5 mm |
S-XQCC-N28 |
Not Qualified |
YES |
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|
Renesas Electronics |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
NO LEAD |
28 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
2 |
CHIP CARRIER |
4.5 V |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
NO |
8 |
ASYNC, BIT |
16 MHz |
30 |
245 |
CMOS |
5 V |
1 |
80C86; 80C88 |
S-PQCC-N28 |
3 |
YES |
e3 |
|||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
8 |
3 |
5 |
CHIP CARRIER |
LDCC28,.5SQ |
4.5 V |
85 Cel |
.625 MBps |
-40 Cel |
MATTE TIN |
QUAD |
4.57 mm |
2048 |
11.506 mm |
NO |
8 |
NRZ |
ASYNC, BIT; SYNC, BYTE |
20 MHz |
11.506 mm |
CMOS |
5 V |
1 |
Serial IO/Communication Controllers |
8051; 6801 |
1.27 mm |
S-PQCC-J28 |
Not Qualified |
NO |
e3 |
||||||||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
GULL WING |
28 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
2 |
2.5/3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP28,.25 |
3 V |
95 Cel |
.625 MBps |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
1.1 mm |
4.4 mm |
ALSO OPERATES AT 2.5V SUPPLY |
NO |
0 |
ASYNC, BIT |
80 MHz |
30 |
260 |
9.7 mm |
CMOS |
3.3 V |
2 |
Serial IO/Communication Controllers |
.65 mm |
R-PDSO-G28 |
1 |
Not Qualified |
YES |
e4 |
||||||||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
GULL WING |
28 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
2 |
2.5/3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP28,.25 |
3 V |
95 Cel |
.625 MBps |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
1.1 mm |
4.4 mm |
ALSO OPERATES AT 2.5V SUPPLY |
NO |
0 |
ASYNC, BIT |
80 MHz |
30 |
260 |
9.7 mm |
CMOS |
3.3 V |
2 |
Serial IO/Communication Controllers |
.65 mm |
R-PDSO-G28 |
1 |
Not Qualified |
YES |
e4 |
||||||||||||||||||||||||||||
|
Renesas Electronics |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.5 V |
2 |
IN-LINE |
4.5 V |
70 Cel |
0 Cel |
MATTE TIN |
DUAL |
NO |
8 |
ASYNC, BIT |
16 MHz |
CMOS |
5 V |
1 |
80C86; 80C88 |
R-PDIP-T28 |
YES |
e3 |
||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
5.5 V |
2 |
IN-LINE |
4.5 V |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
NO |
8 |
ASYNC, BIT |
16 MHz |
CMOS |
5 V |
1 |
80C86; 80C88 |
R-CDIP-T28 |
YES |
e0 |
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Intersil |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
5 |
IN-LINE |
DIP28,.6 |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
CMOS |
5 V |
Serial IO/Communication Controllers |
2.54 mm |
R-XDIP-T28 |
e0 |
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|
Renesas Electronics |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
NO LEAD |
28 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
2 |
CHIP CARRIER |
4.5 V |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
NO |
8 |
ASYNC, BIT |
16 MHz |
30 |
245 |
CMOS |
5 V |
1 |
80C86; 80C88 |
S-PQCC-N28 |
3 |
YES |
e3 |
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Maxim Integrated |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
GULL WING |
28 |
HSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
5 |
SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH |
SSOP28,.25 |
4.5 V |
70 Cel |
.029296875 MBps |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1.73 mm |
3.9 mm |
NO |
1 |
20 |
240 |
9.89 mm |
CMOS |
5 V |
1 |
Serial IO/Communication Controllers |
.635 mm |
R-PDSO-G28 |
1 |
Not Qualified |
YES |
e0 |
|||||||||||||||||||||||||||||||||
|
Analog Devices |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
GULL WING |
28 |
HSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
5 |
SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH |
SSOP28,.25 |
4.5 V |
70 Cel |
.029296875 MBps |
0 Cel |
Matte Tin (Sn) - annealed |
DUAL |
1.75 mm |
3.9 mm |
NO |
1 |
30 |
260 |
9.9 mm |
CMOS |
5 V |
1 |
Serial IO/Communication Controllers |
.635 mm |
R-PDSO-G28 |
1 |
Not Qualified |
YES |
e3 |
||||||||||||||||||||||||||||||||
|
Renesas Electronics |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
NO LEAD |
28 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
2 |
CHIP CARRIER |
4.5 V |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
NO |
8 |
ASYNC, BIT |
16 MHz |
30 |
245 |
CMOS |
5 V |
1 |
80C86; 80C88 |
S-PQCC-N28 |
3 |
YES |
e3 |
|||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
AUTOMOTIVE |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.5 V |
8 |
IN-LINE |
4.5 V |
125 Cel |
.125 MBps |
-40 Cel |
TIN |
DUAL |
5.1 mm |
15.24 mm |
NO |
8 |
NRZ |
24 MHz |
35.5 mm |
CMOS |
5 V |
2 |
2.54 mm |
R-PDIP-T28 |
Not Qualified |
YES |
e3 |
|||||||||||||||||||||||||||||||||||
Standard Microsystems |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
3 |
5 |
CHIP CARRIER |
LDCC28,.5SQ |
4.5 V |
85 Cel |
.625 MBps |
-40 Cel |
TIN LEAD |
QUAD |
4.572 mm |
11.5062 mm |
NO |
8 |
NRZ |
40 MHz |
235 |
11.5062 mm |
CMOS |
50 mA |
5 V |
1 |
Serial IO/Communication Controllers |
8051; 6801 |
1.27 mm |
S-PQCC-J28 |
1 |
Not Qualified |
NO |
e0 |
|||||||||||||||||||||||||||||
|
Microchip Technology |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
3.465 V |
8 |
TS 16949 |
3 |
CHIP CARRIER |
LDCC28,.5SQ |
3.135 V |
85 Cel |
.625 MBps |
-40 Cel |
QUAD |
4.572 mm |
2048 |
11.5062 mm |
NO |
8 |
NRZ |
ASYNC, BIT |
40 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
11.5062 mm |
CMOS |
3.3 V |
1 |
8051; 6801 |
1.27 mm |
S-PQCC-J28 |
NO |
Serial communication controllers are electronic devices that manage the input/output operations between a computer or microcontroller and other devices through serial communication protocols such as UART, SPI, I2C, and USB. These controllers provide an interface that allows the computer or microcontroller to send and receive data over a serial connection and manage the communication operations.
Serial communication controllers can be integrated into the computer or microcontroller's chipset or added as an external module. They typically include a serial interface that connects to the device and a host interface that connects to the computer or microcontroller's bus system. The serial interface can be based on various standards such as UART, SPI, or I2C, while the host interface can be based on various standards such as PCI, PCIe, or USB.
Serial communication controllers offer various benefits such as increased data transfer rates, improved reliability, and increased compatibility with a wide range of devices. They also provide advanced features such as error checking, flow control, and clock synchronization that can improve the accuracy and reliability of the communication.