BGA Serial Communication Controllers 61

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Maximum Data Transfer Rate	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Data Encoding or Decoding Method	Communication Protocol	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Low Power Mode	JESD-609 Code
MC68360ZQ25L	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	5.25 V		32		GRID ARRAY		4.75 V	70 Cel	1.25 MBps	0 Cel	TIN LEAD	BOTTOM	1.86 mm		25 mm	ALSO OPERATES AT 3.3 V	YES	32	NRZ; NRZI-MARK; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL	BISYNC, HDLC; ETHERNET, PROFIBUS; SS7 TRANSPARENT; X.21; V.14; UART; APPLE TALK; DDCMP	25 MHz			25 mm	CMOS		5 V				MC68040; MC68030	1.27 mm	S-PBGA-B357	3		YES	e0
MC68360ZQ25VL	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	5.25 V		32		GRID ARRAY		4.75 V	70 Cel	1.25 MBps	0 Cel	TIN LEAD	BOTTOM	1.86 mm		25 mm	ALSO OPERATES AT 3.3 V	YES	32	NRZ; NRZI-MARK; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL	BISYNC, HDLC; ETHERNET, PROFIBUS; SS7 TRANSPARENT; X.21; V.14; UART; APPLE TALK; DDCMP	25 MHz	40	260	25 mm	CMOS		5 V				MC68040; MC68030	1.27 mm	S-PBGA-B357	3		YES	e0
MC68E360VR25VLR2	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	5.25 V		32		GRID ARRAY		4.75 V	70 Cel	1.25 MBps	0 Cel	TIN SILVER COPPER	BOTTOM	1.86 mm		25 mm	ALSO OPERATES AT 3.3 V	YES	32	NRZ; NRZI-MARK; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL	BISYNC, HDLC; ETHERNET, PROFIBUS; SS7 TRANSPARENT; X.21; V.14; UART; APPLE TALK; DDCMP	25 MHz			25 mm	CMOS		5 V				MC68040; MC68030	1.27 mm	S-PBGA-B357	3		YES	e1
MC68EN360CVR25L	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, LAN		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES		8	32		GRID ARRAY	BGA357,19X19,50			1.25 MBps		TIN SILVER COPPER	BOTTOM	2.52 mm	2560	25 mm	ALSO OPERATES AT 3.3 V	YES	32		ASYNC, BIT; SYNC BYTE; ASYNC, HDLC; SYNC, HDLC; SYNC SDLC; BISYNC	25 MHz	40	260	25 mm	CMOS			16	1		SCC, SMC, SPI, UART	1.27 mm	S-PBGA-B357	3		YES	e1
PEF20256ME	Infineon Technologies	SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES				2.5,3.3	GRID ARRAY	BGA388,26X26,50		85 Cel		-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM													CMOS					Serial IO/Communication Controllers		1.27 mm	S-PBGA-B388		Not Qualified		e0
PEB20256ME	Infineon Technologies	SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL	COMMERCIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES				2.5,3.3	GRID ARRAY	BGA388,26X26,50		70 Cel		0 Cel	Tin/Lead (Sn/Pb)	BOTTOM													CMOS					Serial IO/Communication Controllers		1.27 mm	S-PBGA-B388		Not Qualified		e0
PEB20535E	Infineon Technologies	SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL	INDUSTRIAL	BALL	316	BGA	SQUARE	PLASTIC/EPOXY	YES				2.5,3.3	GRID ARRAY	BGA316,20X20,50		85 Cel		-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM													CMOS					Serial IO/Communication Controllers		1.27 mm	S-PBGA-B316		Not Qualified		e0
UPD98501	Renesas Electronics	SERIAL IO/COMMUNICATION CONTROLLER, LAN		BALL	352	BGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY				12.5 MBps		TIN LEAD	BOTTOM					YES				33 MHz				CMOS		2.5 V						S-PBGA-B352		Not Qualified		e0
UPD98431S1-F6	Renesas Electronics	SERIAL IO/COMMUNICATION CONTROLLER, LAN	COMMERCIAL	BALL	352	BGA	SQUARE	PLASTIC/EPOXY	YES	3.465 V		11		GRID ARRAY		3.135 V	70 Cel	12.5 MBps	0 Cel	TIN LEAD	BOTTOM	2.58 mm		35 mm		YES	32						35 mm	MOS		3.3 V		8			1.27 mm	S-PBGA-B352		Not Qualified	NO	e0
ISL3880IK-TK	Renesas Electronics	SERIAL IO/COMMUNICATION CONTROLLER, LAN	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY	BGA256,16X16,40		85 Cel		-40 Cel		BOTTOM																		Serial IO/Communication Controllers		1 mm	S-PBGA-B256		Not Qualified
UPD98501-A	Renesas Electronics	SERIAL IO/COMMUNICATION CONTROLLER, LAN		BALL	352	BGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY				12.5 MBps		TIN SILVER COPPER	BOTTOM					YES				33 MHz				CMOS		2.5 V						S-PBGA-B352		Not Qualified		e1
UPD98502N7-H6-A	Renesas Electronics	SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL	COMMERCIAL	BALL	500	BGA	SQUARE	PLASTIC/EPOXY	YES				2.5,3.3	GRID ARRAY	BGA500,30X30,50		70 Cel		0 Cel		BOTTOM										10	260		CMOS	1310 mA				Serial IO/Communication Controllers		1.27 mm	S-PBGA-B500	3	Not Qualified
BCM5715S	Broadcom	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL		BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES					GRID ARRAY				125 MBps			BOTTOM				IT ALSO OPERATES AT 2.5V AND 3.3V	NO								CMOS		1.2 V				PCI		S-PBGA-B484		Not Qualified	YES

Serial Communication Controllers

Serial communication controllers are electronic devices that manage the input/output operations between a computer or microcontroller and other devices through serial communication protocols such as UART, SPI, I2C, and USB. These controllers provide an interface that allows the computer or microcontroller to send and receive data over a serial connection and manage the communication operations.

Serial communication controllers can be integrated into the computer or microcontroller's chipset or added as an external module. They typically include a serial interface that connects to the device and a host interface that connects to the computer or microcontroller's bus system. The serial interface can be based on various standards such as UART, SPI, or I2C, while the host interface can be based on various standards such as PCI, PCIe, or USB.

Serial communication controllers offer various benefits such as increased data transfer rates, improved reliability, and increased compatibility with a wide range of devices. They also provide advanced features such as error checking, flow control, and clock synchronization that can improve the accuracy and reliability of the communication.