FBGA Serial Communication Controllers 15

Reset All

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Address Bus Width	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Boundary Scan	External Data Bus Width	Communication Protocol	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of Serial I/Os	Sub-Category	Bus Compatibility	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Low Power Mode	JESD-609 Code
BC358239A-INN-E4	Qualcomm		INDUSTRIAL	BALL	96	FBGA	SQUARE	PLASTIC/EPOXY	YES			1.8,1.8/3.3	GRID ARRAY, FINE PITCH	BGA96,11X11,32		105 Cel	-40 Cel		BOTTOM													Serial IO/Communication Controllers		.8 mm	S-PBGA-B96		Not Qualified
TSB43EA43ZGU	Texas Instruments	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	BALL	144	FBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	0	1.5/3.3	GRID ARRAY	BGA144,13X13,32	3 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		12 mm	YES	0	ASYNC, BIT	30	260	12 mm	CMOS		3.3 V	2	Bus Controllers		.8 mm	S-PBGA-B144	3	Not Qualified	NO	e1
TSB43EA42ZGU	Texas Instruments	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	BALL	144	FBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	0	1.5/3.3	GRID ARRAY	BGA144,13X13,32	3 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	12 mm	YES	0	ASYNC, BIT	30	260	12 mm	CMOS		3.3 V	2	Bus Controllers	PCI	.8 mm	S-PBGA-B144	3	Not Qualified	NO	e1
TSB43EC42ZGU	Texas Instruments	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	BALL	144	FBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	0	1.5/3.3	GRID ARRAY	BGA144,13X13,32	3 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	12 mm	YES	0	ASYNC, BIT	30	260	12 mm	CMOS		3.3 V	2	Bus Controllers	PCI	.8 mm	S-PBGA-B144	3	Not Qualified	NO	e1
TSB43EB42ZGU	Texas Instruments	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	BALL	144	FBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	0	1.5/3.3	GRID ARRAY	BGA144,13X13,32	3 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	12 mm	YES	0	ASYNC, BIT	30	260	12 mm	CMOS		3.3 V	2	Bus Controllers	PCI	.8 mm	S-PBGA-B144	3	Not Qualified	NO	e1
SC16C850IET-G	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	BALL	36	FBGA	SQUARE	PLASTIC/EPOXY	YES			2.5/3.3	GRID ARRAY, FINE PITCH	BGA36,6X6,20		85 Cel	-40 Cel		BOTTOM									CMOS				Serial IO/Communication Controllers		.5 mm	S-PBGA-B36		Not Qualified
SC16C850LIET-S	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	BALL	36	FBGA	SQUARE	PLASTIC/EPOXY	YES			1.8	GRID ARRAY, FINE PITCH	BGA36,6X6,20		85 Cel	-40 Cel		BOTTOM									CMOS		1.8 V		Serial IO/Communication Controllers		.5 mm	S-PBGA-B36		Not Qualified
SC16C852VIET-S	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	BALL	36	FBGA	SQUARE	PLASTIC/EPOXY	YES			1.8	GRID ARRAY, FINE PITCH	BGA36,6X6,20		85 Cel	-40 Cel		BOTTOM									CMOS		1.8 V		Serial IO/Communication Controllers		.5 mm	S-PBGA-B36		Not Qualified
SC16C850IET-S	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	BALL	36	FBGA	SQUARE	PLASTIC/EPOXY	YES			2.5/3.3	GRID ARRAY, FINE PITCH	BGA36,6X6,20		85 Cel	-40 Cel		BOTTOM									CMOS				Serial IO/Communication Controllers		.5 mm	S-PBGA-B36		Not Qualified
SC16C852VIET-G	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	BALL	36	FBGA	SQUARE	PLASTIC/EPOXY	YES			1.8	GRID ARRAY, FINE PITCH	BGA36,6X6,20		85 Cel	-40 Cel		BOTTOM									CMOS		1.8 V		Serial IO/Communication Controllers		.5 mm	S-PBGA-B36		Not Qualified
SC16C850LIET-G	NXP Semiconductors	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	INDUSTRIAL	BALL	36	FBGA	SQUARE	PLASTIC/EPOXY	YES			1.8	GRID ARRAY, FINE PITCH	BGA36,6X6,20		85 Cel	-40 Cel		BOTTOM									CMOS		1.8 V		Serial IO/Communication Controllers		.5 mm	S-PBGA-B36		Not Qualified
UPD800232F1-012-HN2	Renesas Electronics	SERIAL IO/COMMUNICATION CONTROLLER, LAN	INDUSTRIAL	BALL	304	FBGA	SQUARE	PLASTIC/EPOXY	YES			1.5	GRID ARRAY, FINE PITCH	BGA304,22X22,32		85 Cel	-40 Cel		BOTTOM									MOS	495 mA	1.5 V		Serial IO/Communication Controllers		.8 mm	S-PBGA-B304		Not Qualified
UPD800261F1-523-HN2	Renesas Electronics	SERIAL IO/COMMUNICATION CONTROLLER, LAN	INDUSTRIAL	BALL	304	FBGA	SQUARE	PLASTIC/EPOXY	YES			1.5	GRID ARRAY, FINE PITCH	BGA304,22X22,32		85 Cel	-40 Cel		BOTTOM									MOS	535 mA	1.5 V		Serial IO/Communication Controllers		.8 mm	S-PBGA-B304		Not Qualified
UPD800261F1-523-HN2-A	Renesas Electronics	SERIAL IO/COMMUNICATION CONTROLLER, LAN	INDUSTRIAL	BALL	304	FBGA	SQUARE	PLASTIC/EPOXY	YES			1.5	GRID ARRAY, FINE PITCH	BGA304,22X22,32		85 Cel	-40 Cel		BOTTOM									MOS	535 mA	1.5 V		Serial IO/Communication Controllers		.8 mm	S-PBGA-B304		Not Qualified
UPD800232F1-012-HN2-A	Renesas Electronics	SERIAL IO/COMMUNICATION CONTROLLER, LAN	INDUSTRIAL	BALL	304	FBGA	SQUARE	PLASTIC/EPOXY	YES			1.5	GRID ARRAY, FINE PITCH	BGA304,22X22,32		85 Cel	-40 Cel		BOTTOM									MOS	495 mA	1.5 V		Serial IO/Communication Controllers		.8 mm	S-PBGA-B304		Not Qualified

Serial Communication Controllers

Serial communication controllers are electronic devices that manage the input/output operations between a computer or microcontroller and other devices through serial communication protocols such as UART, SPI, I2C, and USB. These controllers provide an interface that allows the computer or microcontroller to send and receive data over a serial connection and manage the communication operations.

Serial communication controllers can be integrated into the computer or microcontroller's chipset or added as an external module. They typically include a serial interface that connects to the device and a host interface that connects to the computer or microcontroller's bus system. The serial interface can be based on various standards such as UART, SPI, or I2C, while the host interface can be based on various standards such as PCI, PCIe, or USB.

Serial communication controllers offer various benefits such as increased data transfer rates, improved reliability, and increased compatibility with a wide range of devices. They also provide advanced features such as error checking, flow control, and clock synchronization that can improve the accuracy and reliability of the communication.