Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Maximum Data Transfer Rate | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Maximum Seated Height | ROM Words | RAM Words | Width | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Data Encoding or Decoding Method | Communication Protocol | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | No. of Timers | RAM Bytes | Technology | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Drive Interface Standard | Low Power Mode | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
3 |
CHIP CARRIER |
4.5 V |
70 Cel |
.0046875 MBps |
0 Cel |
TIN |
QUAD |
4.57 mm |
11.505 mm |
NO |
8 |
NRZ |
ASYNC, BIT |
4 MHz |
11.505 mm |
CMOS |
5 V |
1 |
1.27 mm |
S-PQCC-J28 |
YES |
e3 |
||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
3 |
FLATPACK, LOW PROFILE, FINE PITCH |
4.5 V |
85 Cel |
.375 MBps |
-40 Cel |
QUAD |
1.6 mm |
10 mm |
ALSO OPERATES AT 2.5V OR 3.3V SUPPLY |
NO |
8 |
ASYNC, BIT |
48 MHz |
40 |
260 |
10 mm |
CMOS |
5 V |
1 |
.5 mm |
S-PQFP-G64 |
Not Qualified |
YES |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.63 V |
5 |
FLATPACK, LOW PROFILE, FINE PITCH |
2.97 V |
85 Cel |
.625 MBps |
-40 Cel |
TIN |
QUAD |
1.6 mm |
10 mm |
ALSO OPERATES AT 2.5V OR 5V SUPPLY |
NO |
8 |
ASYNC, BIT |
80 MHz |
10 mm |
CMOS |
3 V |
4 |
.5 mm |
S-PQFP-G64 |
YES |
e3 |
||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.95 V |
0 |
FLATPACK, LOW PROFILE, FINE PITCH |
1.65 V |
85 Cel |
.625 MBps |
-40 Cel |
TIN |
QUAD |
1.6 mm |
7 mm |
NO |
8 |
NRZ |
ASYNC, BIT |
80 MHz |
7 mm |
CMOS |
1.8 V |
2 |
.5 mm |
S-PQFP-G48 |
YES |
e3 |
||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
J BEND |
84 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
0 |
8 |
5 |
CHIP CARRIER |
LDCC84,1.2SQ |
4.5 V |
85 Cel |
.06103515625 MBps |
-40 Cel |
QUAD |
4.57 mm |
0 |
29.3116 mm |
NO |
8 |
NRZ |
ASYNC, BIT |
8 MHz |
29.3116 mm |
CMOS |
200 mA |
5 V |
0 |
8 |
Serial IO/Communication Controllers |
1.27 mm |
S-PQCC-J84 |
Not Qualified |
YES |
3 |
|||||||||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.63 V |
4 |
2.5/5 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
2.97 V |
85 Cel |
.625 MBps |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
1 mm |
5 mm |
ALSO OPERATES AT 2.5V OR 5V SUPPLY |
NO |
8 |
ASYNC, BIT |
80 MHz |
30 |
260 |
5 mm |
CMOS |
3.3 V |
2 |
Serial IO/Communication Controllers |
.5 mm |
S-PQCC-N32 |
1 |
Not Qualified |
YES |
e4 |
||||||||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.63 V |
5 |
FLATPACK, LOW PROFILE, FINE PITCH |
2.97 V |
85 Cel |
.625 MBps |
-40 Cel |
QUAD |
1.6 mm |
10 mm |
ALSO OPERATES AT 2.5V OR 5V SUPPLY |
NO |
8 |
ASYNC, BIT |
80 MHz |
40 |
260 |
10 mm |
CMOS |
3.3 V |
4 |
.5 mm |
S-PQFP-G64 |
Not Qualified |
YES |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
MILITARY |
NO LEAD |
44 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
5.5 V |
0 |
4 |
CHIP CARRIER |
4.5 V |
125 Cel |
.125 MBps |
-55 Cel |
QUAD |
3.048 mm |
0 |
16.5354 mm |
NO |
8 |
NRZ |
ASYNC, BIT; SYNC, BYTE |
4 MHz |
16.5354 mm |
MOS |
175 mA |
5 V |
0 |
2 |
1.27 mm |
S-CQCC-N44 |
Not Qualified |
NO |
15 |
||||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
3 |
FLATPACK, LOW PROFILE, FINE PITCH |
4.5 V |
85 Cel |
.375 MBps |
-40 Cel |
TIN |
QUAD |
1.6 mm |
7 mm |
ALSO OPERATES AT 2.5V OR 3.3V SUPPLY |
NO |
8 |
ASYNC, BIT |
48 MHz |
7 mm |
CMOS |
5 V |
1 |
.5 mm |
S-PQFP-G48 |
YES |
e3 |
||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
BALL |
64 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
2 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
2.7 V |
70 Cel |
50 MBps |
0 Cel |
BOTTOM |
1.5 mm |
8 mm |
NO |
8 |
24.576 MHz |
8 mm |
CMOS |
3 V |
2 |
.8 mm |
S-PBGA-B64 |
Not Qualified |
YES |
||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.63 V |
4 |
2.5/5 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
2.97 V |
85 Cel |
.625 MBps |
-40 Cel |
Tin (Sn) |
QUAD |
1.6 mm |
7 mm |
ALSO OPERATES AT 2.5V OR 5V SUPPLY |
NO |
8 |
ASYNC, BIT |
80 MHz |
30 |
260 |
7 mm |
CMOS |
3.3 V |
2 |
Serial IO/Communication Controllers |
.5 mm |
S-PQFP-G48 |
1 |
Not Qualified |
YES |
e3 |
||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
COMMERCIAL |
J BEND |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
0 |
6 |
CHIP CARRIER |
4.75 V |
70 Cel |
.5 MBps |
0 Cel |
QUAD |
4.57 mm |
0 |
19.1262 mm |
NO |
8 |
NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) |
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; X.75; BISYNC; EXT SYNC; ADCCP; DDCMP |
16 MHz |
19.1262 mm |
NMOS |
275 mA |
5 V |
0 |
2 |
68000 |
1.27 mm |
S-PQCC-J52 |
Not Qualified |
NO |
8 |
|||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
0 |
3 |
5 |
CHIP CARRIER |
LDCC44,.7SQ |
4.75 V |
70 Cel |
.25 MBps |
0 Cel |
QUAD |
4.57 mm |
0 |
16.5862 mm |
NO |
16 |
NRZ |
SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC; ADCCP; DDCMP |
2 MHz |
16.5862 mm |
NMOS |
150 mA |
5 V |
0 |
1 |
Serial IO/Communication Controllers |
1.27 mm |
S-PQCC-J44 |
Not Qualified |
NO |
0 |
|||||||||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
GULL WING |
80 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.63 V |
3 |
FLATPACK, LOW PROFILE, FINE PITCH |
2.97 V |
85 Cel |
.625 MBps |
-40 Cel |
QUAD |
1.6 mm |
12 mm |
ALSO OPERATES AT 2.5V OR 5V SUPPLY |
NO |
8 |
ASYNC, BIT |
80 MHz |
40 |
260 |
12 mm |
CMOS |
3.3 V |
4 |
.5 mm |
S-PQFP-G80 |
Not Qualified |
YES |
||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
2 |
FLATPACK, LOW PROFILE, FINE PITCH |
2.7 V |
70 Cel |
50 MBps |
0 Cel |
QUAD |
1.6 mm |
10 mm |
NO |
8 |
24.576 MHz |
10 mm |
CMOS |
3 V |
2 |
.5 mm |
S-PQFP-G64 |
1 |
Not Qualified |
YES |
|||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
3 |
CHIP CARRIER |
4.5 V |
70 Cel |
.0046875 MBps |
0 Cel |
TIN |
QUAD |
4.57 mm |
11.505 mm |
NO |
8 |
NRZ |
ASYNC, BIT |
4 MHz |
11.505 mm |
CMOS |
5 V |
1 |
1.27 mm |
S-PQCC-J28 |
YES |
e3 |
||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.95 V |
0 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.65 V |
85 Cel |
.625 MBps |
-40 Cel |
QUAD |
1 mm |
5 mm |
NO |
8 |
NRZ |
ASYNC, BIT |
80 MHz |
5 mm |
CMOS |
1.8 V |
2 |
.5 mm |
S-PQCC-N32 |
YES |
||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.63 V |
5 |
FLATPACK, LOW PROFILE, FINE PITCH |
2.97 V |
85 Cel |
.625 MBps |
-40 Cel |
TIN |
QUAD |
1.6 mm |
10 mm |
ALSO OPERATES AT 2.5V OR 5V SUPPLY |
NO |
8 |
ASYNC, BIT |
80 MHz |
10 mm |
CMOS |
3 V |
4 |
.5 mm |
S-PQFP-G64 |
YES |
e3 |
||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
4 |
CHIP CARRIER |
4.5 V |
70 Cel |
.125 MBps |
0 Cel |
PURE TIN |
QUAD |
4.57 mm |
16.5862 mm |
NO |
8 |
ASYNC, BIT |
4 MHz |
16.5862 mm |
CMOS |
5 V |
2 |
1.27 mm |
S-PQCC-J44 |
3 |
Not Qualified |
YES |
|||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
GULL WING |
44 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.63 V |
4 |
FLATPACK |
2.97 V |
85 Cel |
.125 MBps |
-40 Cel |
PURE TIN |
QUAD |
2.1 mm |
10 mm |
ALSO OPERATES AT 5V SUPPLY |
NO |
8 |
ASYNC, BIT |
8 MHz |
10 mm |
CMOS |
3.3 V |
2 |
68XXX; 80XXX |
.8 mm |
S-PQFP-G44 |
3 |
Not Qualified |
NO |
|||||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
3 |
CHIP CARRIER |
4.5 V |
85 Cel |
.375 MBps |
-40 Cel |
TIN |
QUAD |
4.57 mm |
16.585 mm |
ALSO OPERATES AT 2.5V SUPPLY |
NO |
8 |
NRZ |
ASYNC, BIT |
48 MHz |
16.585 mm |
CMOS |
5 V |
1 |
1.27 mm |
S-PQCC-J44 |
NO |
e3 |
|||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
3.63 V |
5 |
CHIP CARRIER |
2.97 V |
85 Cel |
.625 MBps |
-40 Cel |
QUAD |
4.57 mm |
24.23 mm |
ALSO OPERATES AT 2.5V OR 5V SUPPLY |
NO |
8 |
ASYNC, BIT |
80 MHz |
40 |
245 |
24.23 mm |
CMOS |
3.3 V |
4 |
1.27 mm |
S-PQCC-J68 |
Not Qualified |
YES |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
2 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3 V |
85 Cel |
.625 MBps |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
4 mm |
CAN ALSO OPERATES AT 2.5 V SUPPLY |
NO |
0 |
NRZ |
ASYNC, BIT |
80 MHz |
4 mm |
CMOS |
3.3 V |
1 |
.5 mm |
S-PQCC-N24 |
YES |
e4 |
|||||||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, I2C BUS |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.95 V |
2 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.65 V |
85 Cel |
.625 MBps |
-40 Cel |
QUAD |
1 mm |
4 mm |
NO |
8 |
NRZB |
ASYNC, BIT; I2C |
80 MHz |
4 mm |
CMOS |
1.8 V |
1 |
.5 mm |
S-PQCC-N24 |
YES |
||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
BALL |
36 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.95 V |
8 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
1.65 V |
85 Cel |
.0000012122176018 MBps |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.15 mm |
3.5 mm |
NO |
8 |
NRZ |
ASYNC, BIT |
80 MHz |
3.5 mm |
CMOS |
1.8 V |
2 |
.5 mm |
S-PBGA-B36 |
YES |
e1 |
||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
AUTOMOTIVE |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
2.75 V |
10 |
2.5,3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
2.25 V |
125 Cel |
1.25 MBps |
-40 Cel |
TIN |
QUAD |
1.6 mm |
10 mm |
ALSO REQUIRES 3.3V SUPPLY |
NO |
16 |
NRZ |
FLEXRAY |
40 MHz |
40 |
260 |
10 mm |
CMOS |
2.5 V |
2 |
Other uPs/uCs/Peripheral ICs |
.5 mm |
S-PQFP-G64 |
3 |
Not Qualified |
NO |
e3 |
|||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
AUTOMOTIVE |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
2.75 V |
10 |
2.5,3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
2.25 V |
125 Cel |
1.25 MBps |
-40 Cel |
MATTE TIN |
QUAD |
1.6 mm |
10 mm |
ALSO REQUIRES 3.3V SUPPLY |
NO |
16 |
NRZ |
FLEXRAY |
40 MHz |
40 |
260 |
10 mm |
CMOS |
2.5 V |
2 |
Other Microprocessor ICs |
.5 mm |
S-PQFP-G64 |
3 |
Not Qualified |
NO |
e3 |
||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
BALL |
480 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.95 V |
32 |
GRID ARRAY, LOW PROFILE |
1.65 V |
85 Cel |
8.3375 MBps |
-40 Cel |
TIN LEAD |
BOTTOM |
1.65 mm |
37.5 mm |
YES |
64 |
SYNC, HDLC |
16 MHz |
37.5 mm |
CMOS |
1.8 V |
40 |
60X |
1.27 mm |
S-PBGA-B480 |
4 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.63 V |
3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.97 V |
85 Cel |
.625 MBps |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
5 mm |
ALSO OPERATES AT 2.5V SUPPLY |
NO |
8 |
ASYNC, BIT |
80 MHz |
5 mm |
CMOS |
3.3 V |
2 |
.5 mm |
S-PQCC-N32 |
YES |
e4 |
||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
AUTOMOTIVE |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
2.75 V |
16 |
3.3/5 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
2.25 V |
125 Cel |
1.25 MBps |
-40 Cel |
QUAD |
1.6 mm |
10 mm |
NO |
16 |
NRZ |
40 MHz |
10 mm |
CMOS |
2.5 V |
2 |
Other uPs/uCs/Peripheral ICs |
.5 mm |
S-PQFP-G64 |
Not Qualified |
YES |
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NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, I2C BUS |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.95 V |
2 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.65 V |
85 Cel |
.625 MBps |
-40 Cel |
QUAD |
1 mm |
4 mm |
NO |
8 |
NRZB |
ASYNC, BIT; I2C |
80 MHz |
4 mm |
CMOS |
1.8 V |
1 |
.5 mm |
S-PQCC-N24 |
YES |
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NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.63 V |
3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.97 V |
85 Cel |
.625 MBps |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
5 mm |
ALSO OPERATES AT 2.5V SUPPLY |
NO |
8 |
ASYNC, BIT |
80 MHz |
5 mm |
CMOS |
3.3 V |
2 |
.5 mm |
S-PQCC-N32 |
YES |
e4 |
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NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
2 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3 V |
85 Cel |
.625 MBps |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
4 mm |
CAN ALSO OPERATES AT 2.5 V SUPPLY |
NO |
0 |
NRZ |
ASYNC, BIT |
80 MHz |
4 mm |
CMOS |
3.3 V |
1 |
.5 mm |
S-PQCC-N24 |
YES |
e4 |
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NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
BALL |
36 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.95 V |
0 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
1.65 V |
85 Cel |
.625 MBps |
-40 Cel |
BOTTOM |
1.15 mm |
3.5 mm |
NO |
8 |
NRZ |
ASYNC, BIT |
80 MHz |
3.5 mm |
CMOS |
1.8 V |
2 |
.5 mm |
S-PBGA-B36 |
YES |
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NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3 V |
85 Cel |
.625 MBps |
-40 Cel |
QUAD |
1 mm |
5 mm |
CAN ALSO OPERATE AT 2.5V SUPPLY |
NO |
8 |
ASYNC, BIT |
80 MHz |
5 mm |
CMOS |
3.3 V |
1 |
.5 mm |
S-PQCC-N32 |
YES |
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NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.63 V |
3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.97 V |
85 Cel |
.625 MBps |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
5 mm |
ALSO OPERATES AT 2.5V SUPPLY |
NO |
8 |
ASYNC, BIT |
80 MHz |
5 mm |
CMOS |
3.3 V |
2 |
.5 mm |
S-PQCC-N32 |
YES |
e4 |
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NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
BALL |
36 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.95 V |
0 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
1.65 V |
85 Cel |
.625 MBps |
-40 Cel |
BOTTOM |
1.15 mm |
3.5 mm |
NO |
8 |
NRZ |
ASYNC, BIT |
80 MHz |
3.5 mm |
CMOS |
1.8 V |
2 |
.5 mm |
S-PBGA-B36 |
YES |
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NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.63 V |
3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.97 V |
85 Cel |
.625 MBps |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
5 mm |
ALSO OPERATES AT 2.5V SUPPLY |
NO |
8 |
ASYNC, BIT |
80 MHz |
5 mm |
CMOS |
3.3 V |
2 |
.5 mm |
S-PQCC-N32 |
YES |
e4 |
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NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
2 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3 V |
85 Cel |
.625 MBps |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
4 mm |
CAN ALSO OPERATES AT 2.5 V SUPPLY |
NO |
0 |
NRZ |
ASYNC, BIT |
80 MHz |
4 mm |
CMOS |
3.3 V |
1 |
.5 mm |
S-PQCC-N24 |
YES |
e4 |
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NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, I2C BUS |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.95 V |
2 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
1.65 V |
85 Cel |
.625 MBps |
-40 Cel |
QUAD |
1 mm |
4 mm |
NO |
8 |
NRZB |
ASYNC, BIT; I2C |
80 MHz |
4 mm |
CMOS |
1.8 V |
1 |
.5 mm |
S-PQCC-N24 |
YES |
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|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
24 |
FLATPACK, LOW PROFILE, FINE PITCH |
1.25 MBps |
TIN |
QUAD |
1.7 mm |
14 mm |
YES |
16 |
20 MHz |
40 |
260 |
14 mm |
HCMOS |
4 |
68000 |
.5 mm |
S-PQFP-G100 |
3 |
Not Qualified |
NO |
e3 |
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NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
BALL |
36 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.95 V |
0 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
1.65 V |
85 Cel |
.625 MBps |
-40 Cel |
BOTTOM |
1.15 mm |
3.5 mm |
NO |
8 |
NRZ |
ASYNC, BIT |
80 MHz |
3.5 mm |
CMOS |
1.8 V |
2 |
.5 mm |
S-PBGA-B36 |
YES |
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NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
2 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3 V |
85 Cel |
.625 MBps |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 mm |
4 mm |
CAN ALSO OPERATES AT 2.5 V SUPPLY |
NO |
0 |
NRZ |
ASYNC, BIT |
80 MHz |
4 mm |
CMOS |
3.3 V |
1 |
.5 mm |
S-PQCC-N24 |
YES |
e4 |
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NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
AUTOMOTIVE |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
2.75 V |
10 |
2.5,3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP64,.47SQ,20 |
2.25 V |
125 Cel |
1.25 MBps |
-40 Cel |
TIN LEAD |
QUAD |
1.6 mm |
10 mm |
ALSO REQUIRES 3.3V SUPPLY |
NO |
16 |
NRZ |
FLEXRAY |
40 MHz |
10 mm |
CMOS |
2.5 V |
2 |
Other uPs/uCs/Peripheral ICs |
.5 mm |
S-PQFP-G64 |
Not Qualified |
NO |
e0 |
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|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
4 |
CHIP CARRIER |
4.75 V |
70 Cel |
.125 MBps |
0 Cel |
TIN |
QUAD |
4.57 mm |
16.585 mm |
NO |
8 |
NRZ |
ASYNC, BIT |
4 MHz |
16.585 mm |
CMOS |
5 V |
2 |
1.27 mm |
R-PQCC-J44 |
3 |
Not Qualified |
NO |
e3 |
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|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
3 |
CHIP CARRIER |
4.5 V |
85 Cel |
.0046875 MBps |
-40 Cel |
QUAD |
4.57 mm |
11.505 mm |
NO |
8 |
NRZ |
ASYNC, BIT |
4 MHz |
30 |
245 |
11.505 mm |
CMOS |
5 V |
1 |
1.27 mm |
S-PQCC-J28 |
3 |
YES |
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|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
BALL |
36 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
2.5/3.3 |
GRID ARRAY, FINE PITCH |
BGA36,6X6,20 |
85 Cel |
-40 Cel |
BOTTOM |
CMOS |
Serial IO/Communication Controllers |
.5 mm |
S-PBGA-B36 |
Not Qualified |
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|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
INDUSTRIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.63 V |
3 |
3.3/5 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
2.97 V |
85 Cel |
.625 MBps |
-40 Cel |
MATTE TIN |
QUAD |
1.6 mm |
7 mm |
ALSO OPERATES AT 2.5V SUPPLY |
NO |
8 |
ASYNC, BIT |
80 MHz |
7 mm |
CMOS |
3.3 V |
2 |
Serial IO/Communication Controllers |
.5 mm |
S-PQFP-G48 |
Not Qualified |
YES |
e3 |
Serial communication controllers are electronic devices that manage the input/output operations between a computer or microcontroller and other devices through serial communication protocols such as UART, SPI, I2C, and USB. These controllers provide an interface that allows the computer or microcontroller to send and receive data over a serial connection and manage the communication operations.
Serial communication controllers can be integrated into the computer or microcontroller's chipset or added as an external module. They typically include a serial interface that connects to the device and a host interface that connects to the computer or microcontroller's bus system. The serial interface can be based on various standards such as UART, SPI, or I2C, while the host interface can be based on various standards such as PCI, PCIe, or USB.
Serial communication controllers offer various benefits such as increased data transfer rates, improved reliability, and increased compatibility with a wide range of devices. They also provide advanced features such as error checking, flow control, and clock synchronization that can improve the accuracy and reliability of the communication.