COMMERCIAL Serial Communication Controllers 1,090

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Maximum Data Transfer Rate	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Data Encoding or Decoding Method	Communication Protocol	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Bus Compatibility	Terminal Pitch	JESD-30 Code	Qualification	Low Power Mode	JESD-609 Code	No. of I/O Lines
FW322-06-DB	Broadcom	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	GULL WING	120	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		32		FLATPACK, LOW PROFILE, FINE PITCH		3 V	70 Cel	50 MBps	0 Cel		QUAD	1.6 mm		14 mm		NO	32			24.5785 MHz	NOT SPECIFIED	NOT SPECIFIED	14 mm	CMOS		3.3 V		2		PCI	.4 mm	S-PQFP-G120	Not Qualified	YES
L-FW322-07-NV100-DB	Broadcom	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	BALL	100	LFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V		0	3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA100,12X12,32	3 V	70 Cel	50 MBps	0 Cel	TIN SILVER COPPER	BOTTOM	1.46 mm		10 mm		NO	0		ASYNC, BIT	24.5785 MHz			10 mm	CMOS		3.3 V		2	Bus Controllers		.8 mm	S-PBGA-B100	Not Qualified	YES	e1
88800	Broadcom	SERIAL IO/COMMUNICATION CONTROLLER, LAN	COMMERCIAL	BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	3.465 V		8		GRID ARRAY, LOW PROFILE		3.135 V	70 Cel	12.5 MBps	0 Cel	TIN LEAD	BOTTOM	1.7 mm		35 mm		NO	16	NRZI; BIPH-LEVEL(MANCHESTER)		75 MHz	30	225	35 mm	CMOS		3.3 V		8			1.27 mm	S-PBGA-B352	Not Qualified	YES	e0
VSB1400BP-35	Broadcom		COMMERCIAL	THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY	NO				5	IN-LINE	DIP24,.3		70 Cel		0 Cel	Tin/Lead (Sn/Pb)	DUAL													CMOS		5 V			Serial IO/Communication Controllers		2.54 mm	R-PDIP-T24	Not Qualified		e0
L-FW32207T100-DT	Broadcom	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		0	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	3 V	70 Cel	50 MBps	0 Cel	MATTE TIN	QUAD	1.6 mm		14 mm		NO	0		ASYNC, BIT	24.578 MHz			14 mm	CMOS		3.3 V		2	Bus Controllers		.5 mm	S-PQFP-G100	Not Qualified	YES	e3
L-FW322-06-NV129-DB	Broadcom	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	BALL	129	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V		32	3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA129,13X13,20	3 V	70 Cel	50 MBps	0 Cel	TIN SILVER COPPER	BOTTOM	.98 mm		7 mm		NO	32			24.5785 MHz			7 mm	CMOS		3.3 V		2	Bus Controllers		.5 mm	S-PBGA-B129	Not Qualified	YES	e1
L_ET1310R1B2-M-D	Broadcom	SERIAL IO/COMMUNICATION CONTROLLER, LAN	COMMERCIAL	NO LEAD	68	QCCN	SQUARE	UNSPECIFIED	YES	2.62 V				CHIP CARRIER		2.38 V	70 Cel	125 MBps	0 Cel	MATTE TIN	QUAD			10 mm		YES		BIPH-LEVEL(MANCHESTER)		25 MHz	40	260	10 mm	CMOS		2.5 V		1			.5 mm	S-XQCC-N68	Not Qualified	YES	e3
L63500A0LC-30	Broadcom		COMMERCIAL	J BEND	196	QCCJ		CERAMIC	YES				5	CHIP CARRIER	LDCC196(UNSPEC)		70 Cel		0 Cel	Tin/Lead (Sn/Pb)	QUAD													CMOS		5 V			Serial IO/Communication Controllers				Not Qualified		e0
L-FW32207T100-DB	Broadcom	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		0	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	3 V	70 Cel	50 MBps	0 Cel	MATTE TIN	QUAD	1.6 mm		14 mm		NO	0		ASYNC, BIT	24.578 MHz			14 mm	CMOS		3.3 V		2	Bus Controllers		.5 mm	S-PQFP-G100	Not Qualified	YES	e3
L-FW32206T100	Broadcom	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		32	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	3 V	70 Cel	50 MBps	0 Cel	MATTE TIN	QUAD	1.6 mm		14 mm		NO	32			24.5785 MHz	40	260	14 mm	CMOS		3.3 V		2	Bus Controllers	PCI	.5 mm	S-PQFP-G100	Not Qualified	YES	e3
VSB1400BJC-35	Broadcom		COMMERCIAL	J BEND	28	QCCJ	SQUARE	CERAMIC	YES				5	CHIP CARRIER	LDCC28,.5SQ		70 Cel		0 Cel	Tin/Lead (Sn/Pb)	QUAD													CMOS		5 V			Serial IO/Communication Controllers		1.27 mm	S-XQCC-J28	Not Qualified		e0
NQ80C03	Broadcom	SERIAL IO/COMMUNICATION CONTROLLER, LAN	COMMERCIAL	J BEND	44	QCCJ	SQUARE	CERAMIC	YES				5	CHIP CARRIER	LDCC44,.7SQ		70 Cel		0 Cel	Tin/Lead (Sn/Pb)	QUAD													CMOS	40 mA	5 V			Serial IO/Communication Controllers		1.27 mm	S-XQCC-J44	Not Qualified		e0
L-FW323-07-NV129-DB	Broadcom	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	BALL	129	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V		0	3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA129,13X13,20	3 V	70 Cel	50 MBps	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	.98 mm		7 mm		NO	0		ASYNC, BIT	24.578 MHz			7 mm	CMOS		3.3 V		2	Bus Controllers		.5 mm	S-PBGA-B129	Not Qualified	YES	e1
OX16PCI954-TQA1G	Broadcom	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	GULL WING	160	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		32	5	FLATPACK, LOW PROFILE, FINE PITCH	QFP160,1.0SQ,20	4.5 V	70 Cel	7.5 MBps	0 Cel		QUAD	1.6 mm		24 mm		NO	32			60 MHz	NOT SPECIFIED	NOT SPECIFIED	24 mm	CMOS	116.6 mA	5 V		4	Bus Controllers	PCI	.5 mm	S-PQFP-G160	Not Qualified	YES
VSB1400AP-35	Broadcom		COMMERCIAL	THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY	NO				5	IN-LINE	DIP24,.3		70 Cel		0 Cel	Tin/Lead (Sn/Pb)	DUAL													CMOS		5 V			Serial IO/Communication Controllers		2.54 mm	R-PDIP-T24	Not Qualified		e0
NQ8501	Broadcom		COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES				5	CHIP CARRIER	LDCC28,.5SQ		70 Cel		0 Cel	Tin/Lead (Sn/Pb)	QUAD													CMOS		5 V			Serial IO/Communication Controllers		1.27 mm	S-PQCC-J28	Not Qualified		e0
FW32206T100	Broadcom	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V		32	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	3 V	70 Cel	50 MBps	0 Cel	TIN LEAD	QUAD	1.6 mm		14 mm		NO	32			24.5785 MHz			14 mm	CMOS		3.3 V		2	Bus Controllers	PCI	.5 mm	S-PQFP-G100	Not Qualified	YES	e0
L80600VQM	Broadcom	SERIAL IO/COMMUNICATION CONTROLLER, LAN	COMMERCIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	3.465 V		8		FLATPACK, FINE PITCH		3.135 V	70 Cel	125 MBps	0 Cel	TIN LEAD	QUAD	3.7 mm		28 mm		YES	8	NRZ; NRZI; BIPH-LEVEL(MANCHESTER)		125 MHz			28 mm	CMOS		3.3 V		4			.5 mm	S-PQFP-G208	Not Qualified	YES	e0
VSB1400BP-25	Broadcom		COMMERCIAL	THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY	NO				5	IN-LINE	DIP24,.3		70 Cel		0 Cel	Tin/Lead (Sn/Pb)	DUAL													CMOS		5 V			Serial IO/Communication Controllers		2.54 mm	R-PDIP-T24	Not Qualified		e0
OX16PCI952-TQC60-A	Broadcom	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V		32		FLATPACK, LOW PROFILE, FINE PITCH		4.5 V	70 Cel	7.5 MBps	0 Cel		QUAD	1.6 mm		24 mm		NO	32		ASYNC, BIT	40 MHz			24 mm	CMOS		5 V		2		PCI	.5 mm	S-PQFP-G128		YES
KS82C52-16CL	Samsung	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	6 V		2		CHIP CARRIER	LCC28,.5SQ	4 V	70 Cel		0 Cel	Tin/Lead (Sn/Pb)	QUAD	4.572 mm		11.48 mm			8		ASYNC, BIT	16 MHz			11.48 mm	CMOS	3 mA	5 V				8080; 8085; 8086; 8088; 80186; 80286; 80386	1.27 mm	S-PQCC-N28	Not Qualified	YES	e0
KS82C452B-10CL	Samsung	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES	5.25 V	0	3		CHIP CARRIER		4.75 V	70 Cel	.00457763671875 MBps	0 Cel		QUAD	4.57 mm	0	24.2062 mm	CENTRONIX PRINTER INTERFACE	NO	8	NRZ	ASYNC, BIT				24.2062 mm	MOS	50 mA	5 V	0	2		PC-AT	1.27 mm	S-PQCC-J68	Not Qualified	NO		8
KS82C50A-8CP	Samsung	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V	0	3		IN-LINE		4.5 V	70 Cel	.0762939453125 MBps	0 Cel		DUAL		0	15.24 mm		NO	8	NRZ	ASYNC, BIT				52.07 mm	CMOS	6 mA	5 V	0	1			2.54 mm	R-PDIP-T40	Not Qualified	YES		0
KS5812N	Samsung	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO				5	IN-LINE	DIP40,.6		70 Cel		-20 Cel	Tin/Lead (Sn/Pb)	DUAL													CMOS		5 V			Serial IO/Communication Controllers		2.54 mm	R-PDIP-T40	Not Qualified		e0
KS5824N	Samsung		COMMERCIAL	THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY	NO				5	IN-LINE	DIP24,.6		70 Cel		-20 Cel	Tin/Lead (Sn/Pb)	DUAL													CMOS		5 V			Serial IO/Communication Controllers		2.54 mm	R-PDIP-T24	Not Qualified		e0
KS82C52-16CP	Samsung	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	6 V		2		IN-LINE	DIP28,.6	4 V	70 Cel		0 Cel	Tin/Lead (Sn/Pb)	DUAL	6.096 mm		15.24 mm			8		ASYNC, BIT	16 MHz			36.322 mm	CMOS	3 mA	5 V				8080; 8085; 8086; 8088; 80186; 80286; 80386	2.54 mm	R-PDIP-T28	Not Qualified	YES	e0
KS82C452	Samsung	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES				5	CHIP CARRIER	LDCC68,1.0SQ		70 Cel		0 Cel	Tin/Lead (Sn/Pb)	QUAD															5 V			Serial IO/Communication Controllers		1.27 mm	S-PQCC-J68	Not Qualified		e0
KS82C50A-10CL	Samsung	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	5.5 V	0	3	5	CHIP CARRIER	LDCC44,.7SQ	4.5 V	70 Cel	.0762939453125 MBps	0 Cel	TIN LEAD	QUAD	4.57 mm	0	16.5862 mm		NO	8	NRZ	ASYNC, BIT				16.5862 mm	CMOS	6 mA	5 V	0	1	Serial IO/Communication Controllers		1.27 mm	S-PQCC-J44	Not Qualified	YES	e0	0
KS82C50ACL	Samsung	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES				5	CHIP CARRIER	LDCC44,.7SQ		70 Cel		0 Cel		QUAD													CMOS		5 V			Serial IO/Communication Controllers		1.27 mm	S-PQCC-J44	Not Qualified
KS82C50A-10CP	Samsung	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	5.5 V	0	3	5	IN-LINE	DIP40,.6	4.5 V	70 Cel	.0762939453125 MBps	0 Cel	TIN LEAD	DUAL		0	15.24 mm		NO	8	NRZ	ASYNC, BIT				52.07 mm	CMOS	6 mA	5 V	0	1	Serial IO/Communication Controllers		2.54 mm	R-PDIP-T40	Not Qualified	YES	e0	0
KS82C50ACP	Samsung	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO				5	IN-LINE	DIP40,.6		70 Cel		0 Cel		DUAL													CMOS		5 V			Serial IO/Communication Controllers		2.54 mm	R-PDIP-T40	Not Qualified
KS82C450-CL	Samsung	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES				5	CHIP CARRIER	LDCC44,.7SQ		70 Cel		0 Cel	Tin/Lead (Sn/Pb)	QUAD													CMOS		5 V			Serial IO/Communication Controllers		1.27 mm	S-PQCC-J44	Not Qualified		e0
KS82C50A-8CL	Samsung	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	5.5 V	0	3		CHIP CARRIER		4.5 V	70 Cel	.0762939453125 MBps	0 Cel		QUAD	4.57 mm	0	16.5862 mm		NO	8	NRZ	ASYNC, BIT				16.5862 mm	CMOS	6 mA	5 V	0	1			1.27 mm	S-PQCC-J44	Not Qualified	YES		0
KS82C450-CP	Samsung	SERIAL IO/COMMUNICATION CONTROLLER, SERIAL	COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO				5	IN-LINE	DIP40,.6		70 Cel		0 Cel	Tin/Lead (Sn/Pb)	DUAL													CMOS		5 V			Serial IO/Communication Controllers		2.54 mm	R-PDIP-T40	Not Qualified		e0

Serial Communication Controllers

Serial communication controllers are electronic devices that manage the input/output operations between a computer or microcontroller and other devices through serial communication protocols such as UART, SPI, I2C, and USB. These controllers provide an interface that allows the computer or microcontroller to send and receive data over a serial connection and manage the communication operations.

Serial communication controllers can be integrated into the computer or microcontroller's chipset or added as an external module. They typically include a serial interface that connects to the device and a host interface that connects to the computer or microcontroller's bus system. The serial interface can be based on various standards such as UART, SPI, or I2C, while the host interface can be based on various standards such as PCI, PCIe, or USB.

Serial communication controllers offer various benefits such as increased data transfer rates, improved reliability, and increased compatibility with a wide range of devices. They also provide advanced features such as error checking, flow control, and clock synchronization that can improve the accuracy and reliability of the communication.