Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Maximum Data Transfer Rate | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Maximum Seated Height | ROM Words | RAM Words | Width | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Data Encoding or Decoding Method | Communication Protocol | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | No. of Timers | RAM Bytes | Technology | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Drive Interface Standard | Low Power Mode | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.25 V |
5 |
IN-LINE |
4.75 V |
70 Cel |
.125 MBps |
0 Cel |
DUAL |
5.08 mm |
15.24 mm |
NO |
8 |
ASYNC, BIT |
4 MHz |
52.07 mm |
CMOS |
5 V |
2 |
68000 |
2.54 mm |
R-PDIP-T40 |
Not Qualified |
NO |
|||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
J BEND |
44 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.25 V |
4 |
CHIP CARRIER |
4.75 V |
70 Cel |
.125 MBps |
0 Cel |
TIN |
QUAD |
4.57 mm |
16.585 mm |
NO |
8 |
NRZ |
ASYNC, BIT |
4 MHz |
16.585 mm |
CMOS |
5 V |
2 |
1.27 mm |
R-PQCC-J44 |
3 |
Not Qualified |
NO |
e3 |
|||||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
5 |
CHIP CARRIER |
4.75 V |
70 Cel |
.125 MBps |
0 Cel |
QUAD |
4.57 mm |
16.5862 mm |
NO |
8 |
ASYNC, BIT |
4 MHz |
16.5862 mm |
CMOS |
5 V |
2 |
68000 |
1.27 mm |
S-PQCC-J44 |
Not Qualified |
NO |
|||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
THROUGH-HOLE |
48 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.5 V |
0 |
6 |
5 |
IN-LINE |
DIP48,.6 |
4.5 V |
70 Cel |
.125 MBps |
0 Cel |
DUAL |
4.9 mm |
0 |
15.24 mm |
NO |
8 |
NRZ |
ASYNC, BIT |
8 MHz |
62.1 mm |
CMOS |
50 mA |
5 V |
0 |
4 |
Serial IO/Communication Controllers |
2.54 mm |
R-PDIP-T48 |
Not Qualified |
YES |
16 |
|||||||||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
CHIP CARRIER |
LDCC44,.7SQ |
70 Cel |
0 Cel |
QUAD |
CMOS |
5 V |
Serial IO/Communication Controllers |
1.27 mm |
S-PQCC-J44 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
8 |
FLATPACK, LOW PROFILE, FINE PITCH |
4.5 V |
70 Cel |
.125 MBps |
0 Cel |
QUAD |
1.6 mm |
14 mm |
NO |
8 |
ASYNC, BIT; SYNC, BYTE |
14 mm |
CMOS |
5 V |
8 |
.5 mm |
S-PQFP-G100 |
Not Qualified |
NO |
|||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
5.5 V |
0 |
4 |
IN-LINE |
4.5 V |
70 Cel |
.125 MBps |
0 Cel |
DUAL |
5.72 mm |
0 |
15.24 mm |
NO |
8 |
NRZ |
ASYNC, BIT |
4 MHz |
52.39 mm |
CMOS |
10 mA |
5 V |
0 |
2 |
2.54 mm |
R-GDIP-T40 |
Not Qualified |
YES |
15 |
||||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
THROUGH-HOLE |
64 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.25 V |
0 |
6 |
IN-LINE |
4.75 V |
70 Cel |
.125 MBps |
0 Cel |
DUAL |
5.84 mm |
0 |
22.86 mm |
NO |
8 |
NRZ |
ASYNC, BIT |
4 MHz |
81.665 mm |
CMOS |
30 mA |
5 V |
0 |
8 |
2.54 mm |
R-PDIP-T64 |
Not Qualified |
YES |
0 |
||||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
3.63 V |
0 |
7 |
CHIP CARRIER |
2.97 V |
70 Cel |
0 Cel |
QUAD |
4.57 mm |
0 |
24.2316 mm |
NO |
8 |
NRZ |
ASYNC, BIT |
33 MHz |
24.2316 mm |
CMOS |
35 mA |
3.3 V |
0 |
4 |
1.27 mm |
S-PQCC-J68 |
Not Qualified |
YES |
4 |
|||||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
COMMERCIAL |
J BEND |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
0 |
6 |
5 |
CHIP CARRIER |
LDCC52,.8SQ |
4.5 V |
70 Cel |
1.25 MBps |
0 Cel |
QUAD |
4.57 mm |
0 |
19.125 mm |
NO |
8 |
NRZ; NRZI; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) |
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; X.75; BISYNC; EXT SYNC; ADCCP; DDCMP |
16 MHz |
40 |
245 |
19.125 mm |
CMOS |
80 mA |
5 V |
0 |
2 |
Other Microprocessor ICs |
8086; IAPX 86 |
1.27 mm |
S-PQCC-J52 |
Not Qualified |
NO |
8 |
||||||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.5 V |
0 |
3 |
IN-LINE |
4.5 V |
70 Cel |
.0046875 MBps |
0 Cel |
TIN |
DUAL |
4.7 mm |
0 |
7.62 mm |
NO |
8 |
NRZ |
ASYNC, BIT |
4 MHz |
31.7 mm |
CMOS |
2 mA |
5 V |
0 |
1 |
2.54 mm |
R-PDIP-T24 |
Not Qualified |
YES |
e3 |
1 |
|||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
BALL |
357 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
32 |
GRID ARRAY |
4.75 V |
70 Cel |
1.25 MBps |
0 Cel |
TIN LEAD |
BOTTOM |
1.86 mm |
25 mm |
ALSO OPERATES AT 3.3 V |
YES |
32 |
NRZ; NRZI-MARK; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL |
BISYNC, HDLC; ETHERNET, PROFIBUS; SS7 TRANSPARENT; X.21; V.14; UART; APPLE TALK; DDCMP |
25 MHz |
25 mm |
CMOS |
5 V |
MC68040; MC68030 |
1.27 mm |
S-PBGA-B357 |
3 |
YES |
e0 |
||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
0 |
4 |
CHIP CARRIER |
4.5 V |
70 Cel |
.125 MBps |
0 Cel |
TIN |
QUAD |
4.57 mm |
0 |
16.5862 mm |
ALSO OPERATES AT 2.5V SUPPLY |
NO |
8 |
NRZ |
ASYNC, BIT |
8 MHz |
16.5862 mm |
CMOS |
25 mA |
5 V |
0 |
2 |
1.27 mm |
S-PQCC-J44 |
3 |
Not Qualified |
YES |
e3 |
15 |
|||||||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.5 V |
0 |
4 |
IN-LINE |
4.5 V |
70 Cel |
.125 MBps |
0 Cel |
TIN |
DUAL |
4.7 mm |
0 |
15.24 mm |
ALSO OPERATES AT 2.5V SUPPLY |
NO |
8 |
NRZ |
ASYNC, BIT |
8 MHz |
52 mm |
CMOS |
25 mA |
5 V |
0 |
2 |
2.54 mm |
R-PDIP-T40 |
Not Qualified |
YES |
e3 |
15 |
||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
8 |
FLATPACK, LOW PROFILE, FINE PITCH |
3 V |
70 Cel |
.125 MBps |
0 Cel |
QUAD |
1.6 mm |
14 mm |
NO |
8 |
ASYNC, BIT; SYNC, BYTE |
14 mm |
CMOS |
3.3 V |
8 |
.5 mm |
S-PQFP-G100 |
Not Qualified |
NO |
|||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
J BEND |
84 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
0 |
6 |
5 |
CHIP CARRIER |
LDCC84,1.2SQ |
4.75 V |
70 Cel |
.125 MBps |
0 Cel |
Tin (Sn) |
QUAD |
4.57 mm |
0 |
29.31 mm |
NO |
8 |
NRZ |
ASYNC, BIT |
4 MHz |
30 |
245 |
29.31 mm |
CMOS |
30 mA |
5 V |
0 |
8 |
Serial IO/Communication Controllers |
1.27 mm |
S-PQCC-J84 |
3 |
Not Qualified |
YES |
e3 |
0 |
|||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
GULL WING |
44 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
0 |
4 |
5 |
FLATPACK |
QFP44,.5SQ,32 |
4.5 V |
70 Cel |
.125 MBps |
0 Cel |
Tin/Silver (Sn/Ag) |
QUAD |
2.1 mm |
0 |
10 mm |
NO |
8 |
NRZ |
ASYNC, BIT |
3.6864 MHz |
30 |
260 |
10 mm |
CMOS |
10 mA |
5 V |
0 |
2 |
Serial IO/Communication Controllers |
.8 mm |
S-PQFP-G44 |
3 |
Not Qualified |
YES |
e2 |
15 |
|||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
J BEND |
84 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
8 |
CHIP CARRIER |
4.5 V |
70 Cel |
.125 MBps |
0 Cel |
QUAD |
4.57 mm |
29.3116 mm |
NO |
8 |
ASYNC, BIT; SYNC, BYTE |
29.3116 mm |
CMOS |
5 V |
8 |
1.27 mm |
S-PQCC-J84 |
Not Qualified |
NO |
|||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
3 |
5 |
CHIP CARRIER |
LDCC44,.7SQ |
4.5 V |
70 Cel |
.125 MBps |
0 Cel |
Tin/Silver (Sn/Ag) |
QUAD |
4.57 mm |
16.585 mm |
NO |
8 |
NRZ |
ASYNC, BIT |
4 MHz |
30 |
245 |
16.585 mm |
CMOS |
5 V |
2 |
Serial IO/Communication Controllers |
1.27 mm |
S-PQCC-J44 |
3 |
Not Qualified |
NO |
e2 |
||||||||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
GULL WING |
44 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
0 |
4 |
FLATPACK |
4.5 V |
70 Cel |
.125 MBps |
0 Cel |
TIN |
QUAD |
2.1 mm |
0 |
10 mm |
NO |
8 |
NRZ |
ASYNC, BIT |
3.6864 MHz |
10 mm |
CMOS |
10 mA |
5 V |
0 |
2 |
.8 mm |
S-PQFP-G44 |
3 |
Not Qualified |
YES |
e3 |
15 |
||||||||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
CHIP CARRIER |
LDCC44,.7SQ |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
30 |
245 |
CMOS |
5 V |
Serial IO/Communication Controllers |
1.27 mm |
S-PQCC-J44 |
3 |
Not Qualified |
e3 |
||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
J BEND |
84 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
0 |
8 |
CHIP CARRIER |
4.5 V |
70 Cel |
.06103515625 MBps |
0 Cel |
QUAD |
4.57 mm |
0 |
29.3116 mm |
NO |
8 |
NRZ |
ASYNC, BIT |
8 MHz |
29.3116 mm |
CMOS |
200 mA |
5 V |
0 |
8 |
1.27 mm |
S-PQCC-J84 |
Not Qualified |
YES |
3 |
||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.25 V |
4 |
5 |
IN-LINE |
DIP40,.6 |
4.75 V |
70 Cel |
.125 MBps |
0 Cel |
TIN SILVER |
DUAL |
4.7 mm |
15.24 mm |
NO |
8 |
NRZ |
ASYNC, BIT |
4 MHz |
52 mm |
CMOS |
5 V |
2 |
Serial IO/Communication Controllers |
S68000 |
2.54 mm |
R-PDIP-T40 |
Not Qualified |
NO |
e2 |
||||||||||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.5 V |
0 |
4 |
5 |
IN-LINE |
DIP28,.6 |
4.5 V |
70 Cel |
.125 MBps |
0 Cel |
TIN |
DUAL |
5.1 mm |
0 |
15.24 mm |
NO |
8 |
NRZ |
ASYNC, BIT |
3.6864 MHz |
35.5 mm |
CMOS |
10 mA |
5 V |
0 |
2 |
Serial IO/Communication Controllers |
2.54 mm |
R-PDIP-T28 |
Not Qualified |
YES |
e3 |
3 |
||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
BALL |
357 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
32 |
GRID ARRAY |
4.75 V |
70 Cel |
1.25 MBps |
0 Cel |
TIN LEAD |
BOTTOM |
1.86 mm |
25 mm |
ALSO OPERATES AT 3.3 V |
YES |
32 |
NRZ; NRZI-MARK; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL |
BISYNC, HDLC; ETHERNET, PROFIBUS; SS7 TRANSPARENT; X.21; V.14; UART; APPLE TALK; DDCMP |
25 MHz |
40 |
260 |
25 mm |
CMOS |
5 V |
MC68040; MC68030 |
1.27 mm |
S-PBGA-B357 |
3 |
YES |
e0 |
||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.5 V |
4 |
IN-LINE |
4.5 V |
70 Cel |
.125 MBps |
0 Cel |
TIN |
DUAL |
5.1 mm |
15.24 mm |
NO |
8 |
NRZ |
ASYNC, BIT |
3.6864 MHz |
35.5 mm |
CMOS |
5 V |
2 |
2.54 mm |
R-PDIP-T28 |
Not Qualified |
YES |
e3 |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
J BEND |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
0 |
6 |
5 |
CHIP CARRIER |
LDCC52,.8SQ |
4.5 V |
70 Cel |
.125 MBps |
0 Cel |
QUAD |
4.57 mm |
0 |
19.1262 mm |
NO |
8 |
NRZ |
ASYNC, BIT |
8 MHz |
19.1262 mm |
CMOS |
50 mA |
5 V |
0 |
4 |
Serial IO/Communication Controllers |
1.27 mm |
S-PQCC-J52 |
Not Qualified |
YES |
16 |
|||||||||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
COMMERCIAL |
J BEND |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
0 |
6 |
5 |
CHIP CARRIER |
LDCC52,.8SQ |
4.5 V |
70 Cel |
1.25 MBps |
0 Cel |
QUAD |
4.57 mm |
0 |
19.125 mm |
NO |
8 |
NRZ; NRZI; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) |
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; X.75; BISYNC; EXT SYNC; ADCCP; DDCMP |
16 MHz |
40 |
245 |
19.125 mm |
CMOS |
80 mA |
5 V |
0 |
2 |
Other Microprocessor ICs |
8086; IAPX 86 |
1.27 mm |
S-PQCC-J52 |
Not Qualified |
NO |
8 |
|||||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
0 |
4 |
5 |
CHIP CARRIER |
LDCC44,.7SQ |
4.5 V |
70 Cel |
.125 MBps |
0 Cel |
Tin (Sn) |
QUAD |
4.57 mm |
0 |
16.5862 mm |
NO |
8 |
NRZ |
ASYNC, BIT |
3.6864 MHz |
30 |
245 |
16.5862 mm |
CMOS |
10 mA |
5 V |
0 |
2 |
Serial IO/Communication Controllers |
1.27 mm |
S-PQCC-J44 |
3 |
Not Qualified |
YES |
e3 |
15 |
|||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
BALL |
357 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
32 |
GRID ARRAY |
4.75 V |
70 Cel |
1.25 MBps |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1.86 mm |
25 mm |
ALSO OPERATES AT 3.3 V |
YES |
32 |
NRZ; NRZI-MARK; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL |
BISYNC, HDLC; ETHERNET, PROFIBUS; SS7 TRANSPARENT; X.21; V.14; UART; APPLE TALK; DDCMP |
25 MHz |
25 mm |
CMOS |
5 V |
MC68040; MC68030 |
1.27 mm |
S-PBGA-B357 |
3 |
YES |
e1 |
|||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
3 |
5 |
CHIP CARRIER |
LDCC44,.7SQ |
4.5 V |
70 Cel |
.125 MBps |
0 Cel |
TIN |
QUAD |
4.57 mm |
16.585 mm |
NO |
8 |
NRZ |
ASYNC, BIT |
4 MHz |
245 |
16.585 mm |
CMOS |
5 V |
2 |
Serial IO/Communication Controllers |
1.27 mm |
S-PQCC-J44 |
3 |
Not Qualified |
NO |
e3 |
|||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
COMMERCIAL |
THROUGH-HOLE |
48 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.5 V |
0 |
6 |
IN-LINE |
4.5 V |
70 Cel |
1.25 MBps |
0 Cel |
DUAL |
4.9 mm |
0 |
15.24 mm |
NO |
8 |
NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) |
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; X.75; BISYNC; EXT SYNC; ADCCP; DDCMP |
16 MHz |
62.1 mm |
CMOS |
80 mA |
5 V |
0 |
2 |
8086; IAPX 86 |
2.54 mm |
R-PDIP-T48 |
Not Qualified |
NO |
8 |
|||||||||||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
GULL WING |
44 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
0 |
4 |
5 |
FLATPACK |
QFP44,.5SQ,32 |
4.5 V |
70 Cel |
.125 MBps |
0 Cel |
Tin (Sn) |
QUAD |
2.1 mm |
0 |
10 mm |
NO |
8 |
NRZ |
ASYNC, BIT |
3.6864 MHz |
30 |
260 |
10 mm |
CMOS |
10 mA |
5 V |
0 |
2 |
Serial IO/Communication Controllers |
.8 mm |
S-PQFP-G44 |
3 |
Not Qualified |
YES |
e3 |
15 |
|||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.5 V |
0 |
4 |
5 |
IN-LINE |
DIP40,.6 |
4.5 V |
70 Cel |
.125 MBps |
0 Cel |
TIN |
DUAL |
4.7 mm |
0 |
15.24 mm |
NO |
8 |
NRZ |
ASYNC, BIT |
4 MHz |
52 mm |
CMOS |
10 mA |
5 V |
0 |
2 |
Serial IO/Communication Controllers |
S68000 |
2.54 mm |
R-PDIP-T40 |
Not Qualified |
YES |
e3 |
14 |
|||||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.5 V |
0 |
3 |
IN-LINE |
4.5 V |
70 Cel |
.0046875 MBps |
0 Cel |
TIN |
DUAL |
4.7 mm |
0 |
7.62 mm |
NO |
8 |
NRZ |
ASYNC, BIT |
4 MHz |
31.7 mm |
CMOS |
2 mA |
5 V |
0 |
1 |
2.54 mm |
R-PDIP-T24 |
Not Qualified |
YES |
e3 |
1 |
|||||||||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
3 |
CHIP CARRIER |
4.5 V |
70 Cel |
.125 MBps |
0 Cel |
TIN |
QUAD |
4.57 mm |
16.585 mm |
NO |
8 |
NRZ |
ASYNC, BIT |
4 MHz |
16.585 mm |
CMOS |
5 V |
2 |
1.27 mm |
S-PQCC-J44 |
3 |
Not Qualified |
NO |
e3 |
|||||||||||||||||||||||||||||||||
Infineon Technologies |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
COMMERCIAL |
GULL WING |
128 |
LFQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
32 |
FLATPACK, LOW PROFILE, FINE PITCH |
3 V |
70 Cel |
12.5 MBps |
0 Cel |
QUAD |
1.6 mm |
14 mm |
NO |
32 |
NRZ; NRZI; BIPH-LEVEL(MANCHESTER) |
25 MHz |
20 mm |
CMOS |
3.3 V |
1 |
PCI; CARDBUS |
.5 mm |
R-PQFP-G128 |
Not Qualified |
YES |
|||||||||||||||||||||||||||||||||||||
Infineon Technologies |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
COMMERCIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
FLATPACK, LOW PROFILE, FINE PITCH |
3 V |
70 Cel |
60 MBps |
0 Cel |
QUAD |
1.6 mm |
14 mm |
25 MHZ NOMINAL CLOCK AVAILABLE; IEEE802.3X |
NO |
ASYNC, BIT; SYNC, BYTE; ETHERNET |
14 mm |
CMOS |
3.3 V |
4 |
USB |
.5 mm |
S-PQFP-G100 |
YES |
||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
COMMERCIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
FLATPACK, LOW PROFILE, FINE PITCH |
3 V |
70 Cel |
12.5 MBps |
0 Cel |
MATTE TIN |
QUAD |
1.6 mm |
14 mm |
NO |
25 MHz |
260 |
14 mm |
CMOS |
3.3 V |
2 |
USB |
.5 mm |
S-PQFP-G100 |
3 |
Not Qualified |
YES |
e3 |
|||||||||||||||||||||||||||||||||||
Infineon Technologies |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
COMMERCIAL |
GULL WING |
160 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
FLATPACK |
QFP160,1.2SQ |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
100 mA |
5 V |
Serial IO/Communication Controllers |
.635 mm |
S-PQFP-G160 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
COMMERCIAL |
GULL WING |
160 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
FLATPACK |
QFP160,1.2SQ |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
400 mA |
5 V |
Serial IO/Communication Controllers |
.635 mm |
S-PQFP-G160 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
COMMERCIAL |
GULL WING |
176 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5 |
FLATPACK |
QFP176,.87SQ,16 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
100 mA |
5 V |
Serial IO/Communication Controllers |
.4 mm |
S-PQFP-G176 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
COMMERCIAL |
BALL |
388 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
2.5,3.3 |
GRID ARRAY |
BGA388,26X26,50 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
CMOS |
Serial IO/Communication Controllers |
1.27 mm |
S-PBGA-B388 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
32 |
3.3,5 |
FLATPACK, FINE PITCH |
QFP208,1.2SQ,20 |
3 V |
70 Cel |
6.5 MBps |
0 Cel |
QUAD |
4.1 mm |
28 mm |
ALSO REQUIRES 5V SUPPLY |
YES |
32 |
NRZ; NRZI; FM; BIPH-LEVEL(MANCHESTER) |
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC |
33 MHz |
28 mm |
CMOS |
300 mA |
3.3 V |
4 |
Other Microprocessor ICs |
PCI |
.5 mm |
S-PQFP-G208 |
Not Qualified |
YES |
|||||||||||||||||||||||||||||||
Infineon Technologies |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5 |
IN-LINE |
DIP40,.6 |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
CMOS |
5 V |
Serial IO/Communication Controllers |
2.54 mm |
R-PDIP-T40 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||||||
Infineon Technologies |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
COMMERCIAL |
GULL WING |
128 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
32 |
3.3 |
FLATPACK |
QFP128,.64SQ,16 |
3 V |
70 Cel |
0 Cel |
QUAD |
1.6 mm |
14 mm |
NO |
32 |
44 MHz |
14 mm |
CMOS |
150 mA |
3.3 V |
1 |
Serial IO/Communication Controllers |
.4 mm |
S-PQFP-G128 |
Not Qualified |
YES |
||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
COMMERCIAL |
GULL WING |
128 |
LFQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
32 |
FLATPACK, LOW PROFILE, FINE PITCH |
3 V |
70 Cel |
12.5 MBps |
0 Cel |
MATTE TIN |
QUAD |
1.6 mm |
14 mm |
NO |
32 |
NRZ; NRZI; BIPH-LEVEL(MANCHESTER) |
25 MHz |
20 mm |
CMOS |
3.3 V |
1 |
PCI; CARDBUS |
.5 mm |
R-PQFP-G128 |
Not Qualified |
YES |
e3 |
||||||||||||||||||||||||||||||||||
Infineon Technologies |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
COMMERCIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
8 |
FLATPACK, LOW PROFILE, FINE PITCH |
3 V |
70 Cel |
1.5625 MBps |
0 Cel |
QUAD |
1.6 mm |
14 mm |
YES |
16 |
NRZ; NRZI; FM; BIPH-LEVEL(MANCHESTER) |
SYNC, HDLC |
33 MHz |
14 mm |
CMOS |
3.3 V |
2 |
.5 mm |
S-PQFP-G100 |
Not Qualified |
YES |
Serial communication controllers are electronic devices that manage the input/output operations between a computer or microcontroller and other devices through serial communication protocols such as UART, SPI, I2C, and USB. These controllers provide an interface that allows the computer or microcontroller to send and receive data over a serial connection and manage the communication operations.
Serial communication controllers can be integrated into the computer or microcontroller's chipset or added as an external module. They typically include a serial interface that connects to the device and a host interface that connects to the computer or microcontroller's bus system. The serial interface can be based on various standards such as UART, SPI, or I2C, while the host interface can be based on various standards such as PCI, PCIe, or USB.
Serial communication controllers offer various benefits such as increased data transfer rates, improved reliability, and increased compatibility with a wide range of devices. They also provide advanced features such as error checking, flow control, and clock synchronization that can improve the accuracy and reliability of the communication.