Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Maximum Data Transfer Rate | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Maximum Seated Height | ROM Words | RAM Words | Width | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Data Encoding or Decoding Method | Communication Protocol | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | No. of Timers | RAM Bytes | Technology | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Drive Interface Standard | Low Power Mode | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.5 V |
4 |
IN-LINE |
4.5 V |
70 Cel |
.125 MBps |
0 Cel |
DUAL |
4.7 mm |
15.24 mm |
ALSO OPERATES AT 2.5V SUPPLY |
NO |
8 |
NRZ |
ASYNC, BIT |
8 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
52 mm |
CMOS |
5 V |
2 |
2.54 mm |
R-PDIP-T40 |
Not Qualified |
YES |
|||||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
COMMERCIAL |
J BEND |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
0 |
6 |
5 |
CHIP CARRIER |
LDCC52,.8SQ |
4.75 V |
70 Cel |
.5 MBps |
0 Cel |
QUAD |
4.57 mm |
0 |
19.1262 mm |
NO |
8 |
NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) |
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; X.75; BISYNC; EXT SYNC; ADCCP; DDCMP |
16 MHz |
19.1262 mm |
NMOS |
275 mA |
5 V |
0 |
2 |
Other Microprocessor ICs |
1.27 mm |
S-PQCC-J52 |
Not Qualified |
NO |
8 |
|||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
0 |
2 |
5 |
CHIP CARRIER |
LDCC28,.5SQ |
4.75 V |
70 Cel |
.125 MBps |
0 Cel |
QUAD |
4.57 mm |
0 |
11.5062 mm |
MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS |
NO |
8 |
NRZ |
ASYNC, BIT; SYNC, BYTE; BISYNC; EXT SYNC |
11.5062 mm |
NMOS |
150 mA |
5 V |
0 |
1 |
Serial IO/Communication Controllers |
1.27 mm |
S-PQCC-J28 |
Not Qualified |
NO |
0 |
|||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
2 |
FLATPACK, LOW PROFILE, FINE PITCH |
2.7 V |
70 Cel |
50 MBps |
0 Cel |
QUAD |
1.6 mm |
10 mm |
NO |
8 |
24.576 MHz |
10 mm |
CMOS |
3 V |
3 |
.5 mm |
S-PQFP-G64 |
Not Qualified |
YES |
|||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
GULL WING |
44 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
4 |
FLATPACK |
4.5 V |
70 Cel |
.125 MBps |
0 Cel |
PURE TIN |
QUAD |
2.1 mm |
10 mm |
ALSO OPERATES AT 2.5V SUPPLY |
NO |
8 |
NRZ |
ASYNC, BIT |
8 MHz |
10 mm |
CMOS |
5 V |
2 |
.8 mm |
S-PQFP-G44 |
3 |
Not Qualified |
YES |
|||||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, I2C BUS |
COMMERCIAL |
GULL WING |
14 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
2.5 V |
70 Cel |
0 Cel |
DUAL |
1.1 mm |
4.4 mm |
NO |
1 |
I2C |
5 mm |
CMOS |
3.3 V |
2 |
.65 mm |
R-PDSO-G14 |
Not Qualified |
NO |
||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
2 |
FLATPACK, LOW PROFILE, FINE PITCH |
2.7 V |
70 Cel |
50 MBps |
0 Cel |
SILVER |
QUAD |
1.6 mm |
10 mm |
NO |
8 |
24.576 MHz |
10 mm |
CMOS |
3 V |
2 |
.5 mm |
S-PQFP-G64 |
1 |
Not Qualified |
YES |
e4 |
|||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.25 V |
4 |
IN-LINE |
4.75 V |
70 Cel |
.125 MBps |
0 Cel |
DUAL |
4.7 mm |
15.24 mm |
NO |
8 |
NRZ |
ASYNC, BIT |
4 MHz |
40 |
245 |
52 mm |
CMOS |
5 V |
2 |
2.54 mm |
R-PDIP-T40 |
Not Qualified |
NO |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.25 V |
0 |
2 |
IN-LINE |
4.75 V |
70 Cel |
.125 MBps |
0 Cel |
DUAL |
5.08 mm |
0 |
15.24 mm |
MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS |
NO |
8 |
NRZ |
ASYNC, BIT; SYNC, BYTE; BISYNC |
36.51 mm |
NMOS |
150 mA |
5 V |
0 |
1 |
2.54 mm |
R-PDIP-T28 |
Not Qualified |
NO |
0 |
||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.25 V |
4 |
IN-LINE |
4.75 V |
70 Cel |
.125 MBps |
0 Cel |
DUAL |
5.1 mm |
15.24 mm |
NO |
8 |
NRZ |
ASYNC, BIT |
4 MHz |
40 |
245 |
35.5 mm |
CMOS |
5 V |
2 |
2.54 mm |
R-PDIP-T28 |
Not Qualified |
NO |
||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
2 |
FLATPACK, LOW PROFILE, FINE PITCH |
2.7 V |
70 Cel |
50 MBps |
0 Cel |
TIN |
QUAD |
1.6 mm |
10 mm |
NO |
8 |
24.5785 MHz |
10 mm |
CMOS |
3 V |
2 |
.5 mm |
S-PQFP-G64 |
Not Qualified |
YES |
e3 |
||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
GULL WING |
44 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
4 |
FLATPACK |
4.5 V |
70 Cel |
.125 MBps |
0 Cel |
TIN |
QUAD |
2.1 mm |
10 mm |
ALSO OPERATES AT 2.5V SUPPLY |
NO |
8 |
NRZ |
ASYNC, BIT |
8 MHz |
10 mm |
CMOS |
5 V |
2 |
.8 mm |
S-PQFP-G44 |
YES |
e3 |
|||||||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.25 V |
0 |
3 |
IN-LINE |
4.75 V |
70 Cel |
.25 MBps |
0 Cel |
DUAL |
4.7 mm |
0 |
15.24 mm |
NO |
16 |
NRZ |
SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC; ADCCP; DDCMP |
2 MHz |
52 mm |
NMOS |
150 mA |
5 V |
0 |
1 |
2.54 mm |
R-PDIP-T40 |
Not Qualified |
NO |
0 |
||||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.25 V |
0 |
2 |
5 |
IN-LINE |
DIP28,.6 |
4.75 V |
70 Cel |
.125 MBps |
0 Cel |
DUAL |
5.08 mm |
0 |
15.24 mm |
MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS |
NO |
8 |
NRZ |
ASYNC, BIT; SYNC, BYTE; BISYNC; EXT SYNC |
36.51 mm |
NMOS |
150 mA |
5 V |
0 |
1 |
Serial IO/Communication Controllers |
2.54 mm |
R-PDIP-T28 |
Not Qualified |
NO |
0 |
|||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
COMMERCIAL |
THROUGH-HOLE |
48 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.25 V |
0 |
6 |
5 |
IN-LINE |
DIP48,.6 |
4.75 V |
70 Cel |
.5 MBps |
0 Cel |
DUAL |
4.9 mm |
0 |
15.24 mm |
NO |
8 |
NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) |
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; X.75; BISYNC; EXT SYNC; ADCCP; DDCMP |
16 MHz |
62.1 mm |
NMOS |
275 mA |
5 V |
0 |
2 |
Other Microprocessor ICs |
2.54 mm |
R-PDIP-T48 |
Not Qualified |
NO |
8 |
|||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
5.5 V |
4 |
IN-LINE |
4.5 V |
70 Cel |
.125 MBps |
0 Cel |
DUAL |
5.72 mm |
15.24 mm |
NO |
8 |
ASYNC, BIT; SYNC, BYTE |
52.39 mm |
CMOS |
5 V |
2 |
2.54 mm |
R-GDIP-T40 |
Not Qualified |
YES |
|||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
COMMERCIAL |
J BEND |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
0 |
6 |
CHIP CARRIER |
4.75 V |
70 Cel |
.3125 MBps |
0 Cel |
QUAD |
4.57 mm |
0 |
19.1262 mm |
NO |
8 |
NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) |
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; X.75; BISYNC; EXT SYNC; ADCCP; DDCMP |
16 MHz |
19.1262 mm |
NMOS |
275 mA |
5 V |
2 |
2 |
68000 |
1.27 mm |
S-PQCC-J52 |
Not Qualified |
NO |
0 |
|||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
COMMERCIAL |
GULL WING |
80 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.25 V |
4 |
FLATPACK |
4.75 V |
70 Cel |
1.25 MBps |
0 Cel |
TIN |
QUAD |
3.3 mm |
14 mm |
NO |
16 |
BIPH-LEVEL(MANCHESTER) |
20 mm |
CMOS |
5 V |
1 |
.8 mm |
R-PQFP-G80 |
Not Qualified |
NO |
e3 |
|||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
NO LEAD |
28 |
DIE |
UNSPECIFIED |
UNSPECIFIED |
YES |
5.5 V |
4 |
UNCASED CHIP |
4.5 V |
70 Cel |
.125 MBps |
0 Cel |
UPPER |
NO |
8 |
ASYNC, BIT |
4 MHz |
CMOS |
5 V |
2 |
X-XUUC-N28 |
Not Qualified |
YES |
||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.25 V |
4 |
IN-LINE |
4.75 V |
70 Cel |
.125 MBps |
0 Cel |
TIN |
DUAL |
4.7 mm |
15.24 mm |
NO |
8 |
NRZ |
ASYNC, BIT |
4 MHz |
52 mm |
CMOS |
5 V |
2 |
2.54 mm |
R-PDIP-T40 |
NO |
e3 |
||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
8 |
FLATPACK, LOW PROFILE, FINE PITCH |
3 V |
70 Cel |
50 MBps |
0 Cel |
QUAD |
1.6 mm |
20 mm |
NO |
16 |
49.157 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
20 mm |
CMOS |
3.3 V |
1 |
.5 mm |
S-PQFP-G144 |
Not Qualified |
YES |
||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
5.25 V |
0 |
2 |
IN-LINE |
4.75 V |
70 Cel |
.125 MBps |
0 Cel |
DUAL |
5.72 mm |
0 |
15.24 mm |
MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS |
NO |
8 |
NRZ |
ASYNC, BIT; SYNC, BYTE; BISYNC |
37.15 mm |
NMOS |
150 mA |
5 V |
0 |
1 |
2.54 mm |
R-GDIP-T28 |
Not Qualified |
NO |
0 |
||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
3 |
CHIP CARRIER |
4.5 V |
70 Cel |
.0046875 MBps |
0 Cel |
TIN |
QUAD |
4.57 mm |
11.505 mm |
NO |
8 |
NRZ |
ASYNC, BIT |
4 MHz |
11.505 mm |
CMOS |
5 V |
1 |
1.27 mm |
S-PQCC-J28 |
1 |
Not Qualified |
YES |
e3 |
|||||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
0 |
4 |
5 |
CHIP CARRIER |
LDCC44,.7SQ |
4.75 V |
70 Cel |
.125 MBps |
0 Cel |
QUAD |
4.57 mm |
0 |
16.5862 mm |
NO |
8 |
NRZ |
ASYNC, BIT |
4 MHz |
16.5862 mm |
NMOS |
150 mA |
5 V |
0 |
2 |
Serial IO/Communication Controllers |
1.27 mm |
S-PQCC-J44 |
Not Qualified |
NO |
15 |
|||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
0 |
2 |
5 |
CHIP CARRIER |
LDCC28,.5SQ |
4.75 V |
70 Cel |
.125 MBps |
0 Cel |
QUAD |
4.57 mm |
0 |
11.5062 mm |
MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS |
NO |
8 |
NRZ |
ASYNC, BIT; SYNC, BYTE; BISYNC; EXT SYNC |
11.5062 mm |
NMOS |
150 mA |
5 V |
0 |
1 |
Serial IO/Communication Controllers |
1.27 mm |
S-PQCC-J28 |
Not Qualified |
NO |
0 |
|||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
GULL WING |
80 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
2 |
FLATPACK, LOW PROFILE, FINE PITCH |
2.7 V |
70 Cel |
50 MBps |
0 Cel |
QUAD |
1.6 mm |
12 mm |
NO |
8 |
24.576 MHz |
12 mm |
CMOS |
3 V |
3 |
.5 mm |
S-PQFP-G80 |
Not Qualified |
YES |
|||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
3 |
SMALL OUTLINE |
4.5 V |
70 Cel |
.0046875 MBps |
0 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2.65 mm |
7.5 mm |
NO |
8 |
NRZ |
ASYNC, BIT |
4 MHz |
15.4 mm |
CMOS |
5 V |
1 |
1.27 mm |
R-PDSO-G24 |
YES |
e4 |
||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
GULL WING |
44 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
4 |
FLATPACK |
4.5 V |
70 Cel |
.125 MBps |
0 Cel |
TIN |
QUAD |
2.1 mm |
10 mm |
NO |
8 |
ASYNC, BIT |
4 MHz |
10 mm |
CMOS |
5 V |
2 |
.8 mm |
S-PQFP-G44 |
3 |
Not Qualified |
YES |
e3 |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.25 V |
0 |
2 |
IN-LINE |
4.75 V |
70 Cel |
.125 MBps |
0 Cel |
DUAL |
5.08 mm |
0 |
15.24 mm |
MODEM CONTROL I/OS USABLE AS GENERAL PURPOSE I/OS |
NO |
8 |
NRZ |
ASYNC, BIT; SYNC, BYTE; BISYNC |
36.51 mm |
NMOS |
150 mA |
5 V |
0 |
1 |
2.54 mm |
R-PDIP-T28 |
Not Qualified |
NO |
0 |
||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
2 |
FLATPACK, LOW PROFILE, FINE PITCH |
2.7 V |
70 Cel |
50 MBps |
0 Cel |
SILVER |
QUAD |
1.6 mm |
10 mm |
NO |
8 |
24.576 MHz |
10 mm |
CMOS |
3 V |
2 |
.5 mm |
S-PQFP-G64 |
1 |
Not Qualified |
YES |
e4 |
|||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
2 |
FLATPACK, LOW PROFILE, FINE PITCH |
2.7 V |
70 Cel |
50 MBps |
0 Cel |
Tin (Sn) |
QUAD |
1.6 mm |
10 mm |
NO |
8 |
24.576 MHz |
260 |
10 mm |
CMOS |
3 V |
1 |
.5 mm |
S-PQFP-G64 |
1 |
Not Qualified |
YES |
e3 |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
2 |
FLATPACK, LOW PROFILE, FINE PITCH |
2.7 V |
70 Cel |
50 MBps |
0 Cel |
QUAD |
1.6 mm |
10 mm |
NO |
8 |
24.576 MHz |
10 mm |
CMOS |
3 V |
2 |
.5 mm |
S-PQFP-G64 |
Not Qualified |
YES |
|||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.5 V |
4 |
IN-LINE |
4.5 V |
70 Cel |
.125 MBps |
0 Cel |
TIN |
DUAL |
4.7 mm |
15.24 mm |
NO |
8 |
ASYNC, BIT |
4 MHz |
52 mm |
CMOS |
5 V |
2 |
2.54 mm |
R-PDIP-T40 |
Not Qualified |
YES |
e3 |
|||||||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
8 |
FLATPACK, LOW PROFILE, FINE PITCH |
3 V |
70 Cel |
50 MBps |
0 Cel |
QUAD |
1.6 mm |
20 mm |
NO |
8 |
ASYNC, BIT |
49.157 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
20 mm |
CMOS |
3.3 V |
1 |
.5 mm |
S-PQFP-G144 |
Not Qualified |
YES |
||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
J BEND |
84 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
0 |
8 |
CHIP CARRIER |
4.5 V |
70 Cel |
.06103515625 MBps |
0 Cel |
QUAD |
4.57 mm |
0 |
29.3116 mm |
NO |
8 |
NRZ |
ASYNC, BIT |
8 MHz |
29.3116 mm |
CMOS |
200 mA |
5 V |
0 |
8 |
1.27 mm |
S-PQCC-J84 |
Not Qualified |
YES |
3 |
||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
THROUGH-HOLE |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.5 V |
3 |
IN-LINE |
4.5 V |
70 Cel |
.0046875 MBps |
0 Cel |
TIN |
DUAL |
4.7 mm |
7.62 mm |
NO |
8 |
NRZ |
ASYNC, BIT |
4 MHz |
31.7 mm |
CMOS |
5 V |
1 |
2.54 mm |
R-PDIP-T24 |
Not Qualified |
YES |
e3 |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
9 |
FLATPACK, LOW PROFILE, FINE PITCH |
3 V |
70 Cel |
50 MBps |
0 Cel |
QUAD |
1.6 mm |
14 mm |
NO |
8 |
24.576 MHz |
14 mm |
CMOS |
3.3 V |
1 |
.5 mm |
S-PQFP-G100 |
Not Qualified |
NO |
|||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
5.25 V |
0 |
4 |
IN-LINE |
4.75 V |
70 Cel |
.125 MBps |
0 Cel |
DUAL |
5.72 mm |
0 |
15.24 mm |
NO |
8 |
NRZ |
ASYNC, BIT |
4 MHz |
52.39 mm |
NMOS |
150 mA |
5 V |
0 |
2 |
2.54 mm |
R-GDIP-T40 |
Not Qualified |
NO |
15 |
||||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL |
COMMERCIAL |
J BEND |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
0 |
6 |
CHIP CARRIER |
4.5 V |
70 Cel |
1.25 MBps |
0 Cel |
QUAD |
4.57 mm |
0 |
19.1262 mm |
NO |
8 |
NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) |
ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; X.75; BISYNC; EXT SYNC; ADCCP; DDCMP |
16 MHz |
19.1262 mm |
CMOS |
80 mA |
5 V |
0 |
2 |
68000 |
1.27 mm |
S-PQCC-J52 |
Not Qualified |
NO |
0 |
|||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, LAN |
COMMERCIAL |
GULL WING |
80 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
3.6 V |
9 |
3.3 |
FLATPACK |
QFP80,.7X.9,32 |
3 V |
70 Cel |
0 Cel |
QUAD |
3.2 mm |
14 mm |
NO |
8 |
49.157 MHz |
20 mm |
CMOS |
150 mA |
3.3 V |
1 |
Bus Controllers |
.8 mm |
R-PQFP-G80 |
1 |
Not Qualified |
NO |
|||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
GULL WING |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
3 |
SMALL OUTLINE |
4.5 V |
70 Cel |
.0046875 MBps |
0 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
2.65 mm |
7.5 mm |
NO |
8 |
NRZ |
ASYNC, BIT |
4 MHz |
15.4 mm |
CMOS |
5 V |
1 |
1.27 mm |
R-PDSO-G24 |
Not Qualified |
YES |
e4 |
||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
5.5 V |
4 |
IN-LINE |
4.5 V |
70 Cel |
.125 MBps |
0 Cel |
TIN |
DUAL |
4.7 mm |
15.24 mm |
NO |
8 |
ASYNC, BIT |
4 MHz |
52 mm |
CMOS |
5 V |
2 |
2.54 mm |
R-PDIP-T40 |
Not Qualified |
YES |
e3 |
|||||||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
4 |
CHIP CARRIER |
4.75 V |
70 Cel |
.125 MBps |
0 Cel |
QUAD |
4.57 mm |
16.5862 mm |
NO |
8 |
NRZ |
ASYNC, BIT |
4 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
16.5862 mm |
CMOS |
5 V |
2 |
1.27 mm |
S-PQCC-J44 |
Not Qualified |
NO |
|||||||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.25 V |
4 |
CHIP CARRIER |
4.75 V |
70 Cel |
.125 MBps |
0 Cel |
TIN |
QUAD |
4.57 mm |
16.585 mm |
NO |
8 |
NRZ |
ASYNC, BIT |
4 MHz |
16.585 mm |
CMOS |
5 V |
2 |
S68000 |
1.27 mm |
S-PQCC-J44 |
NO |
e3 |
|||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
8 |
FLATPACK, LOW PROFILE, FINE PITCH |
3 V |
70 Cel |
50 MBps |
0 Cel |
QUAD |
1.6 mm |
20 mm |
NO |
16 |
49.157 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
20 mm |
CMOS |
3.3 V |
1 |
.5 mm |
S-PQFP-G144 |
Not Qualified |
YES |
||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
GULL WING |
44 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
4 |
FLATPACK |
4.5 V |
70 Cel |
.125 MBps |
0 Cel |
PURE TIN |
QUAD |
2.1 mm |
10 mm |
ALSO OPERATES AT 2.5V SUPPLY |
NO |
8 |
NRZ |
ASYNC, BIT |
8 MHz |
10 mm |
CMOS |
5 V |
2 |
.8 mm |
S-PQFP-G44 |
3 |
Not Qualified |
YES |
|||||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
5.5 V |
3 |
CHIP CARRIER |
4.5 V |
70 Cel |
.125 MBps |
0 Cel |
TIN |
QUAD |
4.57 mm |
16.585 mm |
NO |
8 |
NRZ |
ASYNC, BIT |
4 MHz |
16.585 mm |
CMOS |
5 V |
2 |
1.27 mm |
S-PQCC-J44 |
NO |
e3 |
||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
COMMERCIAL |
GULL WING |
64 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
2 |
FLATPACK, LOW PROFILE, FINE PITCH |
2.7 V |
70 Cel |
25 MBps |
0 Cel |
QUAD |
1.6 mm |
10 mm |
NO |
4 |
24.5785 MHz |
10 mm |
CMOS |
3.3 V |
3 |
.5 mm |
S-PQFP-G64 |
Not Qualified |
YES |
Serial communication controllers are electronic devices that manage the input/output operations between a computer or microcontroller and other devices through serial communication protocols such as UART, SPI, I2C, and USB. These controllers provide an interface that allows the computer or microcontroller to send and receive data over a serial connection and manage the communication operations.
Serial communication controllers can be integrated into the computer or microcontroller's chipset or added as an external module. They typically include a serial interface that connects to the device and a host interface that connects to the computer or microcontroller's bus system. The serial interface can be based on various standards such as UART, SPI, or I2C, while the host interface can be based on various standards such as PCI, PCIe, or USB.
Serial communication controllers offer various benefits such as increased data transfer rates, improved reliability, and increased compatibility with a wide range of devices. They also provide advanced features such as error checking, flow control, and clock synchronization that can improve the accuracy and reliability of the communication.