Ball Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Total Dose (V)	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
M2S060TS-1VF400	Microchip Technology	FPGA		Ball	400	LFBGA	Square		Plastic/Epoxy	56520	Yes	1.26 V			207		1.2			Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32		1.14 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B400		1.51 mm	17 mm					30 s	207	240 °C (464 °F)	17 mm
M2S060TS-1VF400I	Microchip Technology	FPGA		Ball	400	LFBGA	Square		Plastic/Epoxy	56520	Yes	1.26 V			207		1.2			Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32		1.14 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B400		1.51 mm	17 mm					30 s	207	240 °C (464 °F)	17 mm
M7A3PE600-FG484	Microchip Technology	FPGA		Ball	484	BGA	Square		Plastic/Epoxy	13824	Yes	1.575 V		CMOS	270		1.5		1.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.425 V	1 mm	70 °C (158 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484				No					270
MPF300TS-FCG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square		Plastic/Epoxy	300000	Yes	1.03 V		CMOS	244		1			Grid Array	BGA484,22X22,40		.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484	4	2.87 mm	23 mm		It also Operates at 1.05 V nominal supply			30 s	244	260 °C (500 °F)	23 mm
XC6SLX150-3FGG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square		Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS	498		1.2		1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.21 ns	11519 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	862 MHz	30 s	498	250 °C (482 °F)	27 mm
XC7A100T-1FGG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square		Plastic/Epoxy	101440	Yes	1.05 V	7925	CMOS	300		1		1 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.27 ns	7925 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	1098 MHz	30 s	300	250 °C (482 °F)	27 mm
XC7K160T-3FBG484E	Xilinx	FPGA		Ball	484	BGA	Square		Plastic/Epoxy	162240	Yes	1.03 V	12675	CMOS	285		1		1,1.8,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.97 V	1 mm		0.58 ns	12675 CLBS		Tin Silver Copper	Bottom	S-PBGA-B484	4	2.54 mm	23 mm	No		e1	1412 MHz	30 s	285	250 °C (482 °F)	23 mm
XC7S15-1FTGB196Q	Xilinx	FPGA	Automotive	Ball	196	LFBGA	Square		Plastic/Epoxy	12800	Yes	1.05 V	1000		100		1			Grid Array, Low Profile, Fine Pitch	BGA196,14X14,40		.95 V	1 mm	125 °C (257 °F)	1.27 ns	1000 CLBS	-40 °C (-40 °F)	Matte Tin	Bottom	S-PBGA-B196		1.55 mm	15 mm			e3	1098 MHz		100		15 mm
XC7VX690T-3FFG1930E	Xilinx	FPGA		Ball	1930	BGA	Square		Plastic/Epoxy	693120	Yes	1.03 V	54150	CMOS	1000		1		1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.58 ns	54150 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1930		3.65 mm	45 mm	No		e1	1818 MHz		1000		45 mm
XCVU9P-1FLGA2577E	Xilinx	FPGA	Other	Ball	2577	BGA	Square		Plastic/Epoxy	2586150	Yes	.876 V	147780		832		0.85			Grid Array	BGA2577,51X51,40		.825 V	1 mm	100 °C (212 °F)		147780 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2577		4.24 mm	52.5 mm						832		52.5 mm
XCVU9P-2FLGA2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square		Plastic/Epoxy	2586150	Yes	.876 V	147780		832		0.85			Grid Array	BGA2104,46X46,40		.825 V	1 mm	100 °C (212 °F)		147780 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104		4.24 mm	47.5 mm			e1			832		47.5 mm
10AX016C4U19E3LG	Intel	FPGA	Other	Ball	484	FBGA	Square		Plastic/Epoxy	160000	Yes	.93 V	6151	TSMC	240		0.9		0.9 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	.87 V	.8 mm	100 °C (212 °F)		6151 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B484		3.25 mm	19 mm	No					240		19 mm
10AX115S1F45I1SG	Intel	FPGA	Industrial	Ball	1932	BGA	Square		Plastic/Epoxy	1150000	Yes	.93 V	42720	TSMC	624		0.9			Grid Array	BGA1932,44X44,40		.87 V	1 mm	100 °C (212 °F)		42720 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1932		3.5 mm	45 mm		Also Operates at 0.95 V nominal supply				624		45 mm
10CL010YU256A7G	Intel	FPGA	Automotive	Ball	256	LFBGA	Square		Plastic/Epoxy		Yes	1.25 V	645				1.2			Grid Array, Low Profile, Fine Pitch			1.15 V	.8 mm	125 °C (257 °F)		645 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.5 mm	14 mm								14 mm
10CX220YU484I6G	Intel	FPGA	Industrial	Ball	484	BGA	Square		Plastic/Epoxy	220000	Yes	.93 V	80330	TSMC	188		.9			Grid Array			.87 V		100 °C (212 °F)		80330 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484									188
1SG040HH3F35E2LG	Intel	FPGA		Ball	1152	BGA	Square		Plastic/Epoxy	378000	Yes	.88 V	47250		430		0.85			Grid Array	BGA1152,34X34,40		.82 V	1 mm	100 °C (212 °F)		47250 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.706 mm	35 mm						430		35 mm
1SG280LN2F43E2VG	Intel	FPGA		Ball	1760	BGA	Square		Plastic/Epoxy	2753000	Yes		344125		704					Grid Array	BGA1760,42X42,40			1 mm	100 °C (212 °F)		344125 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1760		3.881 mm	42.5 mm						704		42.5 mm
1SG280LN3F43I1VP	Intel	FPGA		Ball	1760	BGA	Square		Plastic/Epoxy	2753000	Yes		344125		704					Grid Array	BGA1760,42X42,40			1 mm	100 °C (212 °F)		344125 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1760		3.881 mm	42.5 mm						704		42.5 mm
5CGXBC7D6F27C7N	Intel	FPGA	Other	Ball	672	BGA	Square		Plastic/Epoxy	149500	Yes	1.13 V		CMOS	336		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2 mm	27 mm	No		e1			336		27 mm
5CGXFC4C6F27I7N	Intel	FPGA		Ball	672	BGA	Square		Plastic/Epoxy	50000	Yes	1.13 V		CMOS	368		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.07 V	1 mm					Tin/Silver/Copper	Bottom	S-PBGA-B672	3	2 mm	27 mm	No		e1		30 s	368	260 °C (500 °F)	27 mm
A3P125-FG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square		Plastic/Epoxy		Yes	1.575 V	3072	CMOS		125000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	100 °C (212 °F)		3072 CLBS, 125000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e0	350 MHz	20 s		235 °C (455 °F)	13 mm
EP3C25U256C8N	Intel	FPGA	Other	Ball	256	FBGA	Rectangular		Plastic/Epoxy	24624	Yes	1.25 V	24624	CMOS	156		1.2			Grid Array, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.15 V	.8 mm	85 °C (185 °F)		24624 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B256	3	2.2 mm	14 mm	No		e1	472.5 MHz		156		14 mm
EP4CE15F17I8LN	Intel	FPGA		Ball	256	LBGA	Square		Plastic/Epoxy	15408	Yes	1.03 V	963		165		1		1,1.2/3.3,2.5 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	.97 V	1 mm			963 CLBS		Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	362 MHz		165		17 mm
EP4CE55F23I8L	Intel	FPGA		Ball	484	BGA	Square		Plastic/Epoxy	55856	Yes	1.03 V	3491		327		1		1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.97 V	1 mm			3491 CLBS		Tin Lead	Bottom	S-PBGA-B484	3	2.4 mm	23 mm	No		e0	362 MHz		327		23 mm
ICE40LP384-CM49	Lattice Semiconductor	FPGA	Industrial	Ball	49	VFBGA	Square		Plastic/Epoxy	384	Yes	1.26 V	48	CMOS	37		1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)	9.36 ns	48 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B49	3	1 mm	3 mm			e1		30 s	37	260 °C (500 °F)	3 mm
ICE40LP4K-CM81TR	Lattice Semiconductor	FPGA	Industrial	Ball	81	VFBGA	Square		Plastic/Epoxy	3520	Yes	1.26 V	440	CMOS	63		1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)	9.36 ns	440 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B81	3	1 mm	4 mm			e1		30 s	63	260 °C (500 °F)	4 mm
LCMXO2-2000HC-4BG256IAK7	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square		Plastic/Epoxy	2112	Yes	3.6 V			206		2.5	Tray		Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32		2.375 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s	206	260 °C (500 °F)	14 mm
LCMXO3D-9400HC-6BG484I	Lattice Semiconductor	FPGA	Industrial	Ball	484	LFBGA	Square		Plastic/Epoxy	9400	Yes	3.465 V	1175		383		2.5			Grid Array, Low Profile, Fine Pitch	BGA484,22X22,32		2.375 V	.8 mm	100 °C (212 °F)	6.7 ns	1175 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		1.7 mm	19 mm		Also Operates at 3.3 V nominal supply				383		19 mm
LCMXO3L-6900C-6BG256I	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square		Plastic/Epoxy	6900	Yes	3.465 V	858		206		2.5			Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	100 °C (212 °F)		858 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s	206	260 °C (500 °F)	14 mm
LCMXO3LF-2100C-6BG256I	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square		Plastic/Epoxy	2100	Yes	3.465 V	264		206		2.5			Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	100 °C (212 °F)		264 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s	206	260 °C (500 °F)	14 mm
LFE2-12E-5FN484C	Lattice Semiconductor	FPGA	Other	Ball	484	BGA	Square		Plastic/Epoxy	12000	Yes	1.26 V	1500		297		1.2		1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.358 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	311 MHz		297	250 °C (482 °F)	23 mm
LFE2M35E-5FN672C	Lattice Semiconductor	FPGA	Other	Ball	672	BGA	Square		Plastic/Epoxy	35000	Yes	1.26 V	4250		410		1.2		1.2 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.358 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No		e1	311 MHz	30 s	410	250 °C (482 °F)	27 mm
LFE3-70EA-7LFN672I	Lattice Semiconductor	FPGA		Ball	672	BGA	Square		Plastic/Epoxy	67000	Yes	1.26 V			380		1.2		1.2 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.335 ns		-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No		e1	420 MHz	30 s	380	250 °C (482 °F)	27 mm
LFXP2-17E-6FTN256C	Lattice Semiconductor	FPGA	Other	Ball	256	BGA	Square		Plastic/Epoxy	17000	Yes	1.26 V	2125	CMOS	201		1.2		1.2,1.2/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.399 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	435 MHz		201	260 °C (500 °F)	17 mm
LIF-MDF6000-6UMG64I	Lattice Semiconductor	FPGA	Industrial	Ball	64	VFBGA	Square		Plastic/Epoxy	5936	Yes	1.26 V	742		29		1.2			Grid Array, Very Thin Profile, Fine Pitch	BGA64,8X8,16		1.14 V	.4 mm	100 °C (212 °F)		742 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B64		1 mm	3.5 mm						29		3.5 mm
LIFCL-17-9MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square		Plastic/Epoxy	17000	Yes	1.05 V			48		1			Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20		.95 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B121	3	1 mm	6 mm					30 s	48	260 °C (500 °F)	6 mm
M2GL050-FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square		Plastic/Epoxy	56340	Yes	1.26 V		CMOS	267		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No				30 s	267	250 °C (482 °F)	23 mm
M2GL050T-FG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square		Plastic/Epoxy	56340	Yes	1.26 V		CMOS	267		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0		20 s	267	225 °C (437 °F)	23 mm
M2S005-1VFG400I	Microchip Technology	FPGA		Ball	400	LFBGA	Square		Plastic/Epoxy	6060	Yes	1.26 V			171		1.2			Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32		1.14 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	1.51 mm	17 mm					40 s	171	250 °C (482 °F)	17 mm
M2S060-FCSG325I	Microchip Technology	FPGA		Ball	325	TFBGA	Square		Plastic/Epoxy	56520	Yes	1.26 V			200		1.2			Grid Array, Thin Profile, Fine Pitch	BGA325,21X21,20		1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B325	3	1.01 mm	11 mm					40 s	200	250 °C (482 °F)	11 mm
MPF300T-1FCSG536I	Microchip Technology	FPGA		Ball	536	LFBGA	Square		Plastic/Epoxy	300000	Yes	1.03 V		CMOS	300		1			Grid Array, Low Profile, Fine Pitch	BGA536,30X30,20		.97 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B536		1.45 mm	16 mm		It also Operates at 1.05 V nominal supply				300		16 mm
MPF300T-1FCVG484E	Microchip Technology	FPGA		Ball	484	FBGA	Square		Plastic/Epoxy	300000	Yes	1.03 V		CMOS	284		1			Grid Array, Fine Pitch	BGA484,22X22,32		.97 V	.8 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B484		3.32 mm	19 mm		It also Operates at 1.05 V nominal supply				284		19 mm
MPF300T-FCG1152E	Microchip Technology	FPGA		Ball	1152	BGA	Square		Plastic/Epoxy	300000	Yes	1.03 V		CMOS	512		1			Grid Array	BGA1152,34X34,40		.97 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B1152		3.47 mm	35 mm		It also Operates at 1.05 V nominal supply				512		35 mm
MPF500T-FCG784E	Microchip Technology	FPGA		Ball	784	BGA	Square		Plastic/Epoxy	481000	Yes	1.03 V		CMOS	388		1			Grid Array	BGA784,28X28,40		.97 V	1 mm	100 °C (212 °F)			0 °C (32 °F)		Bottom	S-PBGA-B784		3.47 mm	29 mm		It also Operates at 1.05 V nominal supply				388		29 mm
MPF500TLS-FCG1152I	Microchip Technology	FPGA		Ball	1152	BGA	Square		Plastic/Epoxy	481000	Yes	1.03 V		CMOS	584		1			Grid Array	BGA1152,34X34,40		.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.47 mm	35 mm		It also Operates at 1.05 V nominal supply				584		35 mm
MPF500TLSFCG1152I	Microsemi	FPGA		Ball	1152	BGA	Square		Plastic/Epoxy	481000	Yes	1.03 V		CMOS	584		1			Grid Array	BGA1152,34X34,40		.97 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1152		3.47 mm	35 mm		It also Operates at 1.05 V nominal supply				584		35 mm
RT4G150-CB1657PROTO	Microchip Technology	FPGA	Military	Ball	1657	BGA	Square	100k Rad(Si)	Plastic/Epoxy	151824	Yes	1.26 V			720		1.2			Grid Array	BGA1657,41X41,40		1.14 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)		Bottom	S-PBGA-B1657		4.17 mm	42.5 mm						720		42.5 mm
XC7A100T-L1CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square		Plastic/Epoxy	101440	Yes	.98 V	7925		300		0.95			Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.92 V	.8 mm	100 °C (212 °F)	1.27 ns	7925 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B324	3	1.5 mm	15 mm			e1	1098 MHz	30 s	300	260 °C (500 °F)	15 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.