Ball Field Programmable Gate Arrays (FPGA) 2,400+

Reset All

Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC3S200A-4FGG320I	Xilinx	FPGA	Industrial	Ball	320	BGA	Square	Plastic/Epoxy	4032	Yes	1.26 V	448	CMOS		248	200000	1.2		1.2,2.5/3.3 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.71 ns	448 CLBS, 200000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B320	3	2 mm	19 mm	No		e1	667 MHz	30 s	192	260 °C (500 °F)	19 mm
10AX066N1F40I1HG	Intel	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	660000	Yes		25168	TSMC		588					Grid Array	BGA1517,39X39,40			1 mm	100 °C (212 °F)		25168 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1517		3.35 mm	40 mm						588		40 mm
10M50DCF484I6G	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	50000	Yes	1.25 V	3125			500		1.2			Grid Array	BGA484,22X22,40		1.15 V	1 mm	100 °C (212 °F)		3125 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm			e1			500		23 mm
5CGTFD9E5F35C7N	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	301000	Yes	1.13 V	11356	CMOS		560		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		11356 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		2.4 mm	35 mm	No					560		35 mm
A54SX32A-FG256I	Microchip Technology	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	2880	Yes	2.75 V	2880	CMOS		203	48000	2.5		2.5,3.3/5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.25 V	1 mm	85 °C (185 °F)	1.2 ns	2880 CLBS, 48000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.97 mm	17 mm	No	32000 typical gates available	e0	238 MHz	20 s	203	225 °C (437 °F)	17 mm
A54SX32AFG256I	Microsemi	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	2880	Yes	2.75 V	2880	CMOS		203	48000	2.5		2.5,3.3/5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.25 V	1 mm	85 °C (185 °F)	1.2 ns	2880 CLBS, 48000 Gates	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.97 mm	17 mm	No	32000 typical gates available	e0	238 MHz	20 s	203	225 °C (437 °F)	17 mm
LCMXO2-4000HE-4MG132I	Lattice Semiconductor	FPGA		Ball	132	LFBGA	Square	Plastic/Epoxy	4320	Yes	1.26 V				104		1.2	Tray	1.2 V	Grid Array, Low Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No		e1		30 s	104	250 °C (482 °F)	8 mm
M2GL050-VFG400	Microchip Technology	FPGA	Other	Ball	400	LFBGA	Square	Plastic/Epoxy	56340	Yes	1.26 V				207		1.2	Tray	1.2 V	Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B400	3	1.51 mm	17 mm	No					207		17 mm
M2S010-VFG400	Microchip Technology	FPGA		Ball	400	LFBGA	Square	Plastic/Epoxy	12084	Yes	1.26 V				195		1.2			Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32		1.14 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B400	3	1.51 mm	17 mm					40 s	195	250 °C (482 °F)	17 mm
M2S060-FG484I	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	56520	Yes	1.26 V				267		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm					30 s	267	240 °C (464 °F)	23 mm
XA6SLX75-2FGG484Q	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	74637	Yes				AEC-Q100	280				1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays		1 mm					Tin Silver Copper	Bottom	S-PBGA-B484	3			No		e1	62.5 MHz	30 s	280	250 °C (482 °F)
XC3S1000-5FGG320C	Xilinx	FPGA	Other	Ball	320	BGA	Square	Plastic/Epoxy	17280	Yes	1.26 V	1920	CMOS		221	1000000	1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.53 ns	1920 CLBS, 1000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B320	3	2 mm	19 mm	No		e1	725 MHz	30 s	221	260 °C (500 °F)	19 mm
XC5VLX110-1FFG1153C	Xilinx	FPGA	Other	Ball	1153	BGA	Square	Plastic/Epoxy	110592	Yes	1.05 V	8640			800		1		1,2.5 V	Grid Array	BGA1153,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.9 ns	8640 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1153	4	3.4 mm	35 mm	No		e1		30 s	800	245 °C (473 °F)	35 mm
XC5VLX85-1FFG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	82944	Yes	1.05 V	6480			440		1		1,2.5 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.9 ns	6480 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3 mm	27 mm	No		e1		30 s	440	250 °C (482 °F)	27 mm
XC5VLX85T-1FFG1136I	Xilinx	FPGA	Industrial	Ball	1136	BGA	Square	Plastic/Epoxy	82944	Yes	1.05 V	6480			480		1		1,2.5 V	Grid Array	BGA1136,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	6480 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1136	4	3.25 mm	35 mm	No		e1		30 s	480	245 °C (473 °F)	35 mm
XC6SLX4-2CPG196I	Xilinx	FPGA	Industrial	Ball	196	TFBGA	Square	Plastic/Epoxy	3840	Yes	1.26 V	300	CMOS		100		1.2		1.2,2.5/3.3 V	Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	100 °C (212 °F)	0.26 ns	300 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B196	3	1.1 mm	8 mm	No		e8	667 MHz	30 s	100	260 °C (500 °F)	8 mm
XC6SLX9-L1CSG225I	Xilinx	FPGA	Industrial	Ball	225	LFBGA	Square	Plastic/Epoxy	9152	Yes	1.05 V	715	CMOS		160		1		1,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32	Field Programmable Gate Arrays	.95 V	.8 mm	100 °C (212 °F)	0.46 ns	715 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B225	3	1.4 mm	13 mm	No		e1		30 s	160	260 °C (500 °F)	13 mm
XC7A75T-2FG484I	Xilinx	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	75520	Yes	1.05 V	5900			285		1			Grid Array			.95 V	1 mm	100 °C (212 °F)		5900 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3		23 mm		It also has core voltage 0.9 V	e0			285		23 mm
XCKU15P-2FFVE1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	1143450	Yes	.876 V	65340			668		0.85			Grid Array	BGA1517,39X39,40		.825 V	1 mm	100 °C (212 °F)		65340 CLBs	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1		30 s	668	245 °C (473 °F)	40 mm
XQ7A200T-2RB676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	215360	Yes	1.05 V	16825	HKMG		400		1		1 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	1.05 ns	16825 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B676	4	3.35 mm	27 mm	No		e0	1286 MHz		400		27 mm
10AX027H4F34E3SG	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	270000	Yes	.93 V	10162	TSMC		384		0.9		0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		10162 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.35 mm	35 mm	No					384		35 mm
10AX057H4F34E3SG	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	570000	Yes	.93 V	21708	TSMC		492		0.9		0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		21708 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1152	3	3.35 mm	35 mm	No		e1		30 s	492	245 °C (473 °F)	35 mm
10AX090N2F45E1SG	Intel	FPGA	Other	Ball	1932	BGA	Square	Plastic/Epoxy	900000	Yes	.93 V	33962	TSMC		768		0.9		0.9 V	Grid Array	BGA1932,44X44,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		33962 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1932		3.5 mm	45 mm	No	Also Operates at 0.95 V nominal supply				768		45 mm
10CL016YU256C6G	Intel	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.25 V	963					1.2			Grid Array, Low Profile, Fine Pitch			1.15 V	.8 mm	85 °C (185 °F)		963 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B256		1.5 mm	14 mm								14 mm
10CX220YF672E6G	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	220000	Yes	.93 V	80330	TSMC		236		.9			Grid Array			.87 V		100 °C (212 °F)		80330 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B672									236
10M16DAF484C7G	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	16000	Yes	1.25 V	1000			320		1.2		1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		1000 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No		e1			320		23 mm
5AGXMA5G4F35I5G	Intel	FPGA	Industrial	Ball	1152	HBGA	Square	Plastic/Epoxy	190000	Yes	1.13 V	7170	TSMC		544		1.1			Grid Array, Heat Sink/Slug	BGA1152,34X34,40		1.07 V	1 mm	100 °C (212 °F)		7170 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1152		2.7 mm	35 mm						544		35 mm
5CEFA7F27C7N	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	149500	Yes	1.13 V		CMOS		336		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B672		2 mm	27 mm	No					336		27 mm
5CGXFC4C6F23C7N	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	50000	Yes	1.13 V		CMOS		240		1.1		1.1,1.2/3.3,2.5 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No		e1			240		23 mm
5CGXFC4C6M13I7N	Intel	FPGA		Ball	383	TFBGA	Square	Plastic/Epoxy	50000	Yes	1.13 V		CMOS		175		1.1		1.1,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA383,25X25,20	Field Programmable Gate Arrays	1.07 V	.5 mm						Bottom	S-PBGA-B383		1.1 mm	13 mm	No					175		13 mm
EP4CE115F29C7N	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	114480	Yes	1.25 V	7155			531		1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA780,28X28,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		7155 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B780	3	2.4 mm	29 mm	No		e1	472.5 MHz		531		29 mm
EP4CGX110DF27I7N	Intel	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	109424	Yes	1.25 V	109424			393		1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.15 V	1 mm			109424 CLBS		Tin/Silver/Copper	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No		e1	472.5 MHz	30 s	393	260 °C (500 °F)	27 mm
LCMXO3LF-1300C-5BG256I	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	1300	Yes	3.465 V	160			206		2.5			Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	100 °C (212 °F)		160 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s	206	260 °C (500 °F)	14 mm
LCMXO3LF-6900E-5MG256C	Lattice Semiconductor	FPGA	Other	Ball	256	VFBGA	Square	Plastic/Epoxy		Yes	1.26 V	858					1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		858 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1 mm	9 mm			e1				260 °C (500 °F)	9 mm
LFE2-70E-7FN672C	Lattice Semiconductor	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	70000	Yes	1.26 V	8500			500		1.2		1.2 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.304 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No		e1	420 MHz	30 s	500	250 °C (482 °F)	27 mm
LFE3-17EA-8MG328C	Lattice Semiconductor	FPGA	Other	Ball	328	LFBGA	Square	Plastic/Epoxy	17000	Yes	1.26 V				116		1.2		1.2 V	Grid Array, Low Profile, Fine Pitch	BGA328,19X19,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)	0.281 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B328	3	1.5 mm	10 mm	No		e1	500 MHz	30 s	116	260 °C (500 °F)	10 mm
LFE3-95EA-6FN672I	Lattice Semiconductor	FPGA		Ball	672	BGA	Square	Plastic/Epoxy	92000	Yes	1.26 V				380		1.2		1.2 V	Grid Array	BGA672,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.379 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B672	3	2.6 mm	27 mm	No		e1	375 MHz	30 s	380	250 °C (482 °F)	27 mm
LFXP2-5E-5FTN256I	Lattice Semiconductor	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	5000	Yes	1.26 V	625	CMOS		172		1.2		1.2,1.2/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.494 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	435 MHz		172	260 °C (500 °F)	17 mm
XA7A100T-1CSG324Q	Xilinx	FPGA	Automotive	Ball	324	LFBGA	Square	Plastic/Epoxy	101440	Yes	1.05 V	7925	HKMG	AEC-Q100	210		1		1 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	.95 V	.8 mm	125 °C (257 °F)	1.27 ns	7925 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1	1098 MHz	30 s	210	260 °C (500 °F)	15 mm
XC2S200-5FGG256I	Xilinx	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	5292	Yes	2.625 V	1176			284	200000	2.5		1.5/3.3,2.5 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.7 ns	1176 CLBS, 200000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2 mm	17 mm	No		e1	263 MHz	30 s	284	260 °C (500 °F)	17 mm
XC2S200-5FGG456I	Xilinx	FPGA	Industrial	Ball	456	BGA	Square	Plastic/Epoxy	5292	Yes	2.625 V	1176			284	200000	2.5		1.5/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)	0.7 ns	1176 CLBS, 200000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e1	263 MHz	30 s	284	250 °C (482 °F)	23 mm
XC3S1500-4FG456I	Xilinx	FPGA		Ball	456	BGA	Square	Plastic/Epoxy	29952	Yes	1.26 V	3328	CMOS		333	1500000	1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm		0.61 ns	3328 CLBS, 1500000 Gates		Tin Lead	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e0	630 MHz	30 s	333	225 °C (437 °F)	23 mm
XC3S1500-4FGG320C	Xilinx	FPGA	Other	Ball	320	BGA	Square	Plastic/Epoxy	29952	Yes	1.26 V	3328	CMOS		221	1500000	1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA320,18X18,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.61 ns	3328 CLBS, 1500000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B320	3	2 mm	19 mm	No		e1	630 MHz	30 s	221	260 °C (500 °F)	19 mm
XC3S2000-5FGG456C	Xilinx	FPGA	Other	Ball	456	BGA	Square	Plastic/Epoxy	46080	Yes	1.26 V	5120	CMOS		333	2000000	1.2		1.2,1.2/3.3,2.5 V	Grid Array	BGA456,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.53 ns	5120 CLBS, 2000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B456	3	2.6 mm	23 mm	No		e1	725 MHz	30 s	333	250 °C (482 °F)	23 mm
XC3S400A-5FTG256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	8064	Yes	1.26 V	896	CMOS		195	400000	1.2		1.2,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.62 ns	896 CLBS, 400000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	770 MHz	30 s	160	260 °C (500 °F)	17 mm
XC6SLX100-3FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS		326		1.2		1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.21 ns	7911 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	862 MHz	30 s	326	250 °C (482 °F)	23 mm
XC6SLX150-2CSG484I	Xilinx	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS		330		1.2		1.2,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.26 ns	11519 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1	667 MHz	30 s	330	260 °C (500 °F)	19 mm
XC6SLX150-2FG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS		338		1.2		1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	11519 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0	667 MHz	30 s	338	225 °C (437 °F)	23 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.