Ball Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC4VLX100-11FFG1148IS2	Xilinx	FPGA		Ball	1148	BGA	Square	Plastic/Epoxy	110592	Yes			CMOS	768				1.2,1.2/3.3,2.5 V	Grid Array	BGA1148,34X34,40	Field Programmable Gate Arrays		1 mm					Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Bottom	S-PBGA-B1148	4			No		e1	1205 MHz	30 s	768	245 °C (473 °F)
XC5VLX30T-1FF323C	Xilinx	FPGA	Other	Ball	323	BGA	Square	Plastic/Epoxy	30720	Yes	1.05 V	2400		172		1		1,2.5 V	Grid Array	BGA323,18X18,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.9 ns	2400 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B323	4	2.85 mm	19 mm	No		e0		30 s	172	225 °C (437 °F)	19 mm
XC5VLX330-1FFG1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	331776	Yes	1.05 V	25920		1200		1		1,2.5 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.95 V	1 mm	100 °C (212 °F)	0.9 ns	25920 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	3.5 mm	42.5 mm	No		e1		30 s	1200	225 °C (437 °F)	42.5 mm
XC6SLX100-2FGG676I	Xilinx	FPGA	Industrial	Ball	676	BGA	Square	Plastic/Epoxy	101261	Yes	1.26 V	7911	CMOS	480		1.2		1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.26 ns	7911 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	667 MHz	30 s	480	250 °C (482 °F)	27 mm
XC6SLX150-3FG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS	338		1.2		1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.21 ns	11519 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0	862 MHz	30 s	338	225 °C (437 °F)	23 mm
XC6SLX150-3FGG676C	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS	498		1.2		1.2,2.5/3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.21 ns	11519 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	3	2.44 mm	27 mm	No		e1	862 MHz	30 s	498	250 °C (482 °F)	27 mm
XC6SLX150-N3CSG484I	Xilinx	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS	338		1.2		1.2,1.2/3.3,2.5/3.3 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)	0.26 ns	11519 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	1.8 mm	19 mm	No		e1	806 MHz		338		19 mm
XC6SLX150T-2FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	147443	Yes	1.26 V	11519	CMOS	296		1.2		1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.26 ns	11519 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	667 MHz	30 s	296	250 °C (482 °F)	23 mm
XC6SLX25T-3FG484I	Xilinx	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	24051	Yes	1.26 V	1879	CMOS	250		1.2		1.2,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.21 ns	1879 CLBS	-40 °C (-40 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e0	862 MHz	30 s	250	225 °C (437 °F)	23 mm
XC6SLX25T-4CSG324C	Xilinx	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	24051	Yes			CMOS	190				1.2,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays		.8 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1		30 s	190	260 °C (500 °F)	15 mm
XC6SLX25T-4CSG324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	24051	Yes			CMOS	190				1.2,2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays		.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B324	3	1.5 mm	15 mm	No		e1		30 s	190	260 °C (500 °F)	15 mm
XC6SLX75-L1FGG484C	Xilinx	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	74637	Yes	1.05 V	5831	CMOS	280		1		1,2.5/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	0.46 ns	5831 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1		30 s	280	250 °C (482 °F)	23 mm
XC6SLX9-3FT256C	Xilinx	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	9152	Yes	1.26 V	715	CMOS	186		1.2		1.2,2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.21 ns	715 CLBS	0 °C (32 °F)	Tin Lead	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e0	862 MHz	30 s	186	225 °C (437 °F)	17 mm
XC6VLX130T-2FFG1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	128000	Yes	1.05 V		CMOS	600		1		1,1.2/2.5 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.95 V	1 mm	85 °C (185 °F)	4.29 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.5 mm	35 mm	No		e1	1286 MHz	30 s	600	245 °C (473 °F)	35 mm
XC7A50T-1CS324I	Xilinx	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	52160	Yes	1.05 V	4075	HKMG	210		1			Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		.95 V	.8 mm	100 °C (212 °F)	1.27 ns	4075 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B324		1.5 mm	15 mm						210		15 mm
XC7K355T-3FFG901E	Xilinx	FPGA		Ball	901	BGA	Square	Plastic/Epoxy	356160	Yes	1.03 V	27825	CMOS	300		1		1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	.97 V	1 mm		0.58 ns	27825 CLBS		Tin Silver Copper	Bottom	S-PBGA-B901	4	3.35 mm	31 mm	No		e1	1412 MHz	30 s	300	245 °C (473 °F)	31 mm
XC7K410T-1FFG900C	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	406720	Yes	1.03 V	31775	CMOS	500		1		1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.74 ns	31775 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.35 mm	31 mm	No		e1	1098 MHz	30 s	500	245 °C (473 °F)	31 mm
XC7K410T-2FB900I	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	406720	Yes			CMOS	500				1,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays		1 mm					Tin Lead	Bottom	S-PBGA-B900	4			No		e0	1818 MHz	30 s	500	225 °C (437 °F)
XC7K410T-3FFG676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	406720	Yes	1.03 V	31775	CMOS	400		1		1,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.97 V	1 mm		0.58 ns	31775 CLBS		Tin Silver Copper	Bottom	S-PBGA-B676	4	3.37 mm	27 mm	No		e1	1412 MHz	30 s	400	250 °C (482 °F)	27 mm
XC7V2000T-1FLG1925I	Xilinx	FPGA		Ball	1925	BGA	Square	Plastic/Epoxy	1954560	Yes	1.03 V	152700	CMOS	1200		1		1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.74 ns	152700 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1925		3.75 mm	45 mm	No		e1	1818 MHz		1200		45 mm
XC7V2000T-3FHG1761E	Xilinx	FPGA	Other	Ball	1761	BGA	Square	Plastic/Epoxy	1954560	Yes	1.03 V	152700		850		1			Grid Array	BGA1761,42X42,40		.97 V	1 mm	100 °C (212 °F)	0.58 ns	152700 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1761		3.75 mm	45 mm			e1			850		45 mm
XC7VX550T-2FFG1927C	Xilinx	FPGA	Other	Ball	1927	BGA	Square	Plastic/Epoxy	554240	Yes	1.03 V	43300	CMOS	600		1		1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.61 ns	43300 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1927	4	3.65 mm	45 mm	No		e1	1818 MHz		600	245 °C (473 °F)	45 mm
XCKU025-1FFVA1156C	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	318150	Yes	.979 V	18180		312		0.95			Grid Array	BGA1156,34X34,40		.922 V	1 mm	85 °C (185 °F)		18180 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.42 mm	35 mm			e1			312		35 mm
XCKU060-3FFVA1156E	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	725550	Yes	1.03 V	2760		624		1		1 V	Grid Array	BGA1156,34X34,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)		2760 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.51 mm	35 mm	No		e1			624		35 mm
XCKU115-2FLVB1760I	Xilinx	FPGA	Industrial	Ball	1760	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	5520		832		.95		0.95 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		5520 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1760	4	4.11 mm	42.5 mm	No		e1			832		42.5 mm
XCKU115-2FLVB2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	1451100	Yes	.979 V	5520		832		.95		0.95 V	Grid Array	BGA2104,46X46,40	Field Programmable Gate Arrays	.922 V	1 mm	100 °C (212 °F)		5520 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.11 mm	47.5 mm	No		e1		30 s	832	245 °C (473 °F)	47.5 mm
XCKU3P-3FFVB676E	Xilinx	FPGA	Other	Ball	676	BGA	Square	Plastic/Epoxy	355950	Yes	.927 V	20340		304		0.9			Grid Array	BGA676,26X26,40		.873 V	1 mm	100 °C (212 °F)		20340 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B676	4	3.52 mm	27 mm			e1		30 s	304	250 °C (482 °F)	27 mm
XCV1600E-7FG860C	Xilinx	FPGA	Other	Ball	860	BGA	Square	Plastic/Epoxy	34992	Yes	1.89 V	7776	CMOS	660	419904	1.8		1.2/3.6,1.8 V	Grid Array	BGA860,42X42,40	Field Programmable Gate Arrays	1.71 V	1 mm	85 °C (185 °F)	0.42 ns	7776 CLBS, 419904 Gates	0 °C (32 °F)	Tin/Lead (Sn63Pb37)	Bottom	S-PBGA-B860	3	2.2 mm	42.5 mm	No		e0	400 MHz	30 s	660	225 °C (437 °F)	42.5 mm
XCVU5P-2FLVA2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	1313763	Yes	.876 V	75072		832		0.85			Grid Array	BGA2104,46X46,40		.825 V	1 mm	100 °C (212 °F)		75072 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B2104	4	4.11 mm	47.5 mm			e1		30 s	832	245 °C (473 °F)	47.5 mm
10AX066H3F34E2SG	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy	660000	Yes	.93 V	25168	TSMC	492		0.9		0.9 V	Grid Array	BGA1152,34X34,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		25168 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1152	3	3.35 mm	35 mm	No	Also Operates at 0.95 V nominal supply	e1		30 s	492	245 °C (473 °F)	35 mm
10CL025YU256A7G	Intel	FPGA	Automotive	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.25 V	1539				1.2			Grid Array, Low Profile, Fine Pitch			1.15 V	.8 mm	125 °C (257 °F)		1539 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.5 mm	14 mm								14 mm
10M25DAF256C7G	Intel	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	25000	Yes	1.25 V	1563		360		1.2		1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		1563 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1			360		17 mm
10M25DCF256I6G	Intel	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	25000	Yes	1.25 V	1563		360		1.2			Grid Array	BGA256,16X16,40		1.15 V	1 mm	100 °C (212 °F)		1563 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm			e1			360		17 mm
5AGXFB3H6F35C6N	Intel	FPGA	Other	Ball	1152	HBGA	Square	Plastic/Epoxy	362000	Yes	1.13 V	13688		704		1.1		1.1,1.2/3.3,2.5 V	Grid Array, Heat Sink/Slug	BGA1152,34X34,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		13688 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1152	3	2.7 mm	35 mm	No		e1			704		35 mm
A3P1000-2FGG144	Microchip Technology	FPGA	Commercial	Ball	144	LBGA	Square	Plastic/Epoxy		Yes	1.575 V	24576	CMOS		1000000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	85 °C (185 °F)		24576 CLBS, 1000000 Gates	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	350 MHz	30 s		260 °C (500 °F)	13 mm
A3P1000-2FGG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy		Yes	1.575 V	24576	CMOS		1000000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	100 °C (212 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	350 MHz	30 s		260 °C (500 °F)	13 mm
AGL400V5-CSG196	Microchip Technology	FPGA	Other	Ball	196	TFBGA	Square	Plastic/Epoxy	9216	Yes	1.575 V		CMOS	143	400000	1.5			Grid Array, Thin Profile, Fine Pitch	BGA196,14X14,20		1.425 V	.5 mm	85 °C (185 °F)		400000 Gates	0 °C (32 °F)		Bottom	S-PBGA-B196	3	1.2 mm	8 mm	No				30 s	143	260 °C (500 °F)	8 mm
AGLN010V2-UCG36I	Microchip Technology	FPGA	Industrial	Ball	36	VFBGA	Square	Plastic/Epoxy		Yes	1.575 V	260	CMOS		10000	1.2	Tray		Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	85 °C (185 °F)		260 CLBS, 10000 Gates	-40 °C (-40 °F)		Bottom	S-PBGA-B36		.8 mm	3 mm	No							3 mm
EP3C16F256C6N	Intel	FPGA	Other	Ball	256	LBGA	Rectangular	Plastic/Epoxy	15408	Yes	1.25 V	15408	CMOS	168		1.2			Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		15408 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	R-PBGA-B256	3	1.55 mm	17 mm	No		e1	472.5 MHz		168		17 mm
EP3SL150F780C4G	Intel	FPGA	Other	Ball	780	BGA	Square	Plastic/Epoxy	142500	Yes	.94 V	5700		488		0.9			Grid Array	BGA780,28X28,40		.86 V	1 mm	85 °C (185 °F)		5700 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B780		3 mm	29 mm		It can also operate from 1.05 to 1.15 V supply				488		29 mm
LCMXO3L-2100E-5MG121I	Lattice Semiconductor	FPGA		Ball	121	VFBGA	Square	Plastic/Epoxy	2100	Yes	1.26 V	264		100		1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	100 °C (212 °F)		264 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm			e1			100	260 °C (500 °F)	6 mm
LCMXO3LF-1300E-5UWG36ITR	Lattice Semiconductor	FPGA		Ball	36	VFBGA	Rectangular	Plastic/Epoxy	1300	Yes	1.26 V	160		28		1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)		160 CLBS	-40 °C (-40 °F)		Bottom	R-PBGA-B36		.576 mm	2.487 mm						28		2.541 mm
LCMXO3LF-1300E-6MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy		Yes	1.26 V	160				1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		160 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm			e1				260 °C (500 °F)	6 mm
LCMXO3LF-2100E-5MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy		Yes	1.26 V	264				1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		264 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm			e1				260 °C (500 °F)	6 mm
LCMXO3LF-9400C-6BG484I	Lattice Semiconductor	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	9400	Yes	3.465 V	1175		384		2.5			Grid Array			2.375 V	.8 mm	100 °C (212 °F)		1175 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484			19 mm		Also Operates at 3.3 V nominal supply				384		19 mm
M1A3P1000-2FGG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy		Yes	1.575 V	24576	CMOS		1000000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	100 °C (212 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	350 MHz	30 s		260 °C (500 °F)	13 mm
M2S060-FGG484	Microchip Technology	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	56520	Yes	1.26 V			267		1.2			Grid Array	BGA484,22X22,40		1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm					40 s	267	250 °C (482 °F)	23 mm
M7A3P1000-2FGG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS	97	1000000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	85 °C (185 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	350 MHz	30 s	97	260 °C (500 °F)	13 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.