Ball Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	Screening Level	No. of Inputs	No. of Equivalent Gates	Nominal Supply Voltage (V)	Packing Method	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
EP4SGX530HH35C3NES	Intel	FPGA	Other	Ball	1152	BGA	Square	Plastic/Epoxy		Yes	.93 V	21248					.9			Grid Array			.87 V	1 mm	85 °C (185 °F)		21248 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B		3.8 mm	42.5 mm	No		e1	717 MHz				42.5 mm
ICE40UL640-CM36AITR1K	Lattice Semiconductor	FPGA	Industrial	Ball	36	BGA	Square	Plastic/Epoxy	640	Yes	1.26 V	80	CMOS		26		1.2			Grid Array			1.14 V	.4 mm	100 °C (212 °F)	9 ns	80 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B36			2.5 mm						26		2.5 mm
LAXP2-8E-5MN132E	Lattice Semiconductor	FPGA		Ball	132	LFBGA	Square	Plastic/Epoxy	8000	Yes	1.26 V			AEC-Q100	86	8000	1.2		1.2,1.2/3.3,3.3 V	Grid Array, Low Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	125 °C (257 °F)		8000 Gates	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No		e1	435 MHz	40 s	86	260 °C (500 °F)	8 mm
LCMXO1200C-3BN256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	1200	Yes	3.465 V	150			211		1.8		1.8/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	1.71 V	.8 mm	85 °C (185 °F)		150 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm	No		e1			211	260 °C (500 °F)	14 mm
LCMXO1200E-3FTN256C	Lattice Semiconductor	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	1200	Yes	1.26 V	150			211		1.2		1.2 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)		150 CLBS	0 °C (32 °F)	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	Bottom	S-PBGA-B256	3	1.7 mm	17 mm	No		e1		40 s	211	260 °C (500 °F)	17 mm
LCMXO2-4000HC-4FG484I	Lattice Semiconductor	FPGA		Ball	484	HBGA	Square	Plastic/Epoxy	4320	Yes	3.465 V				278		2.5	Tray	2.5/3.3 V	Grid Array, Heat Sink/Slug	BGA484,22X22,40	Field Programmable Gate Arrays	2.375 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No	Also Operates at 3.3 V nominal supply	e1		30 s	278	250 °C (482 °F)	23 mm
LCMXO2-4000HC-4FTG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	4320	Yes	3.465 V				206		2.5	Tray	2.5/3.3 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	2.375 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No	Also Operates at 3.3 V nominal supply	e1		30 s	206	260 °C (500 °F)	17 mm
LCMXO2-4000HC-5BG256I	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	4320	Yes	3.465 V				206		2.5	Tray	2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32	Field Programmable Gate Arrays	2.375 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm	No	Also Operates at 3.3 V nominal supply	e1		30 s	206	260 °C (500 °F)	14 mm
LCMXO2-4000HC-5MG132I	Lattice Semiconductor	FPGA		Ball	132	LFBGA	Square	Plastic/Epoxy	4320	Yes	3.465 V				104		2.5	Tray	2.5/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	2.375 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No	Also Operates at 3.3 V nominal supply	e1		30 s	104	250 °C (482 °F)	8 mm
LCMXO2-4000HE-6MG184C	Lattice Semiconductor	FPGA	Other	Ball	184	LFBGA	Square	Plastic/Epoxy	4320	Yes	1.26 V				150		1.2	Tray	1.2 V	Grid Array, Low Profile, Fine Pitch	BGA184,14X14,20	Field Programmable Gate Arrays	1.14 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B184	3	1.5 mm	8 mm	No		e1			150		8 mm
LCMXO2-4000ZE-1UWG81ITR1K	Lattice Semiconductor	FPGA		Ball	81	VFBGA	Rectangular	Plastic/Epoxy		Yes	3.6 V				63		1.2			Grid Array, Very Thin Profile, Fine Pitch	BGA81,9X9,16		1.14 V	.4 mm	85 °C (185 °F)			-40 °C (-40 °F)		Bottom	R-PBGA-B81		.567 mm	3.693 mm						63		3.797 mm
LCMXO2280C-5MN132C	Lattice Semiconductor	FPGA	Other	Ball	132	LFBGA	Square	Plastic/Epoxy	2280	Yes	3.465 V	285			101		1.8		1.8/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)		285 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No		e1		40 s	101	260 °C (500 °F)	8 mm
LCMXO3D-9400HC-5BG400I	Lattice Semiconductor	FPGA	Industrial	Ball	400	LFBGA	Square	Plastic/Epoxy	9400	Yes	3.465 V	1175			335		2.5			Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32		2.375 V	.8 mm	100 °C (212 °F)	7 ns	1175 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B400		1.7 mm	17 mm		Also Operates at 3.3 V nominal supply				335		17 mm
LCMXO3D-9400ZC-2BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy	9400	Yes	3.465 V	1175			206		2.5			Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32		2.375 V	.8 mm	85 °C (185 °F)	7 ns	1175 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B256		1.7 mm	14 mm		Also Operates at 3.3 V nominal supply				206		14 mm
LCMXO3L-1300C-6BG256I	Lattice Semiconductor	FPGA		Ball	256	LFBGA	Square	Plastic/Epoxy	1300	Yes	3.465 V	160			206		2.5			Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	100 °C (212 °F)		160 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s	206	260 °C (500 °F)	14 mm
LCMXO3L-1300E-5UWG36ITR1K	Lattice Semiconductor	FPGA		Ball	36	VFBGA	Rectangular	Plastic/Epoxy	1300	Yes	1.26 V	160			28		1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.4 mm	100 °C (212 °F)		160 CLBS	-40 °C (-40 °F)		Bottom	R-PBGA-B36		.576 mm	2.487 mm						28		2.541 mm
LCMXO3L-640E-5MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy		Yes	1.26 V	80					1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		80 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm			e1				260 °C (500 °F)	6 mm
LCMXO3L-6900C-6BG256C	Lattice Semiconductor	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	3.465 V	858					2.5			Grid Array, Low Profile, Fine Pitch			2.375 V	.8 mm	85 °C (185 °F)		858 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.7 mm	14 mm		Also Operates at 3.3 V nominal supply	e1		30 s		260 °C (500 °F)	14 mm
LCMXO3LF-1300E-5MG256C	Lattice Semiconductor	FPGA	Other	Ball	256	VFBGA	Square	Plastic/Epoxy		Yes	1.26 V	160					1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	85 °C (185 °F)		160 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1 mm	9 mm			e1				260 °C (500 °F)	9 mm
LCMXO3LF-9400C-6BG484C	Lattice Semiconductor	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	3.465 V	1175					2.5			Grid Array			2.375 V	.8 mm	85 °C (185 °F)		1175 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B484			19 mm		Also Operates at 3.3 V nominal supply						19 mm
LCMXO3LF-9400E-5MG256I	Lattice Semiconductor	FPGA		Ball	256	VFBGA	Square	Plastic/Epoxy	9400	Yes	1.26 V	1175			206		1.2			Grid Array, Very Thin Profile, Fine Pitch			1.14 V	.5 mm	100 °C (212 °F)		1175 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1 mm	9 mm			e1			206	260 °C (500 °F)	9 mm
LCMXO640C-3MN132C	Lattice Semiconductor	FPGA	Other	Ball	132	LFBGA	Square	Plastic/Epoxy	640	Yes	3.465 V	80			101		1.8		1.8/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.71 V	.5 mm	85 °C (185 °F)		80 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No		e1		40 s	101	260 °C (500 °F)	8 mm
LCMXO640C-3MN132I	Lattice Semiconductor	FPGA	Industrial	Ball	132	LFBGA	Square	Plastic/Epoxy	640	Yes	3.465 V	80			101		1.8		1.8/3.3 V	Grid Array, Low Profile, Fine Pitch	BGA132,14X14,20	Field Programmable Gate Arrays	1.71 V	.5 mm	100 °C (212 °F)		80 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B132	3	1.35 mm	8 mm	No		e1		40 s	101	260 °C (500 °F)	8 mm
LFD2NX-17-9MG121C	Lattice Semiconductor	FPGA	Other	Ball	121	VFBGA	Square	Plastic/Epoxy	17000	Yes	1.05 V	4250	FDSOI		23		1			Grid Array, Very Thin Profile, Fine Pitch	BGA121,11X11,20		.95 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B121	3	1 mm	6 mm			e1		30 s	23	260 °C (500 °F)	6 mm
LFE2-20E-5FN256C	Lattice Semiconductor	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	20000	Yes	1.26 V	2625			193		1.2		1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.358 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	311 MHz	40 s	193	250 °C (482 °F)	17 mm
LFE3-35EA-6FN484C	Lattice Semiconductor	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	33000	Yes	1.26 V				295		1.2		1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.379 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	375 MHz		295	250 °C (482 °F)	23 mm
LFE3-35EA-6FTN256C	Lattice Semiconductor	FPGA	Other	Ball	256	LBGA	Square	Plastic/Epoxy	33000	Yes	1.26 V				133		1.2		1.2 V	Grid Array, Low Profile	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)	0.379 ns		0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1	375 MHz	30 s	133	260 °C (500 °F)	17 mm
LFE5UM-85F-8MG285I	Lattice Semiconductor	FPGA	Industrial	Ball	285	LFBGA	Square	Plastic/Epoxy		Yes	1.155 V	10500					1.1			Grid Array, Low Profile, Fine Pitch			1.045 V	.5 mm	100 °C (212 °F)		10500 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B285	3	1.3 mm	10 mm			e1		30 s		260 °C (500 °F)	10 mm
LFXP2-17E-5FTN256C8W	Lattice Semiconductor	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	17000	Yes	1.26 V		CMOS		201		1.2		1.2,1.2/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	85 °C (185 °F)			0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	311 MHz		201	260 °C (500 °F)	17 mm
LFXP2-40E-6FN484I	Lattice Semiconductor	FPGA		Ball	484	BGA	Square	Plastic/Epoxy	40000	Yes	1.26 V	5000	CMOS		363		1.2		1.2,1.2/3.3,3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.399 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.6 mm	23 mm	No		e1	435 MHz		363	250 °C (482 °F)	23 mm
LFXP2-5E-6FTN256I	Lattice Semiconductor	FPGA		Ball	256	BGA	Square	Plastic/Epoxy	5000	Yes	1.26 V	625	CMOS		172		1.2		1.2,1.2/3.3,3.3 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.14 V	1 mm	100 °C (212 °F)	0.399 ns		-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B256	3	2.1 mm	17 mm	No		e1	435 MHz		172	260 °C (500 °F)	17 mm
LIFCL-40-7BG400C	Lattice Semiconductor	FPGA	Other	Ball	400	LFBGA	Square	Plastic/Epoxy	39000	Yes	1.05 V	9750	FDSOI		74		1			Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32		.95 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B400	3	1.7 mm	17 mm					30 s	74	260 °C (500 °F)	17 mm
M1A3P1000-1FGG144M	Microchip Technology	FPGA	Military	Ball	144	LBGA	Square	Plastic/Epoxy	24576	Yes	1.575 V	24576	CMOS		97	1000000	1.5	Tray	1.5,1.5/3.3 V	Grid Array, Low Profile	BGA144,12X12,40	Field Programmable Gate Arrays	1.425 V	1 mm	125 °C (257 °F)		24576 CLBS, 1000000 Gates	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e1	350 MHz	30 s	97	260 °C (500 °F)	13 mm
M1A3P1000-2FG256I	Microchip Technology	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy		Yes	1.575 V	24576	CMOS			1000000	1.5	Tray		Grid Array			1.425 V	1 mm	100 °C (212 °F)		24576 CLBS, 1000000 Gates	-40 °C (-40 °F)		Bottom	S-PBGA-B256	3	1.8 mm	17 mm	No			350 MHz				17 mm
M1A3P250-FG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy		Yes	1.575 V	6144	CMOS			250000	1.5	Tray		Grid Array, Low Profile			1.425 V	1 mm	100 °C (212 °F)		6144 CLBS, 250000 Gates	-40 °C (-40 °F)	Tin Lead Silver	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e0					13 mm
M1A3PE3000L-1FGG484M	Microchip Technology	FPGA	Military	Ball	484	BGA	Square	Plastic/Epoxy	75264	Yes	1.575 V	75264	CMOS		341	3000000	1.2	Tray	1.2/1.5,1.2/3.3 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)		75264 CLBS, 3000000 Gates	-55 °C (-67 °F)	Tin Silver Copper	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e1	250 MHz	30 s	341	250 °C (482 °F)	23 mm
M1AGL1000V5-FG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy	24576	Yes	1.575 V		CMOS		97	1000000	1.5			Grid Array, Low Profile	BGA144,12X12,40		1.425 V	1 mm	100 °C (212 °F)		1000000 Gates	-40 °C (-40 °F)	Tin Lead Silver	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e0			97		13 mm
M1AGL250V5-FG144I	Microchip Technology	FPGA	Industrial	Ball	144	LBGA	Square	Plastic/Epoxy	6144	Yes	1.575 V		CMOS		97	250000	1.5			Grid Array, Low Profile	BGA144,12X12,40		1.425 V	1 mm	100 °C (212 °F)		250000 Gates	-40 °C (-40 °F)	Tin Lead Silver	Bottom	S-PBGA-B144	3	1.55 mm	13 mm	No		e0			97		13 mm
M2GL005-VF256IX417	Microchip Technology	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.26 V				161		1.2			Grid Array, Low Profile, Fine Pitch	BGA256,16X16,32		1.14 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.56 mm	14 mm						161		14 mm
M2GL010T-1FG484M	Microchip Technology	FPGA	Military	Ball	484	BGA	Square	Plastic/Epoxy	12084	Yes	1.26 V				233		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0		20 s	233	240 °C (464 °F)	23 mm
M2GL010T-VFG400	Microchip Technology	FPGA	Other	Ball	400	LFBGA	Square	Plastic/Epoxy	12084	Yes	1.26 V				195		1.2	Tray	1.2 V	Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B400	3	1.51 mm	17 mm	No					195		17 mm
M2GL025-1VFG256	Microchip Technology	FPGA	Other	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2	Tray		Grid Array, Low Profile, Fine Pitch			1.14 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B256	3	1.56 mm	14 mm								14 mm
M2GL025T-1FG484M	Microchip Technology	FPGA	Military	Ball	484	BGA	Square	Plastic/Epoxy	27696	Yes	1.26 V				267		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No		e0			267		23 mm
M2GL025T-VFG400I	Microchip Technology	FPGA	Industrial	Ball	400	LFBGA	Square	Plastic/Epoxy	27696	Yes	1.26 V		CMOS		207		1.2	Tray	1.2 V	Grid Array, Low Profile, Fine Pitch	BGA400,20X20,32	Field Programmable Gate Arrays	1.14 V	.8 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B400	3	1.51 mm	17 mm	No					207		17 mm
M2GL025TS-1FG484M	Microchip Technology	FPGA	Military	Ball	484	BGA	Square	Plastic/Epoxy	27696	Yes	1.26 V		CMOS		267		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No					267		23 mm
M2GL025TS-1FGG484M	Microchip Technology	FPGA	Military	Ball	484	BGA	Square	Plastic/Epoxy	27696	Yes	1.26 V		CMOS		267		1.2	Tray	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.14 V	1 mm	125 °C (257 °F)			-55 °C (-67 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm	No				30 s	267	250 °C (482 °F)	23 mm
M2GL060-1FCS325I	Microchip Technology	FPGA	Industrial	Ball	325	BGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2	Tray		Grid Array			1.14 V	.5 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B325			11 mm					20 s		240 °C (464 °F)	11 mm
M2GL060-1FGG484I	Microchip Technology	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.26 V						1.2	Tray		Grid Array			1.14 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B484	3	2.44 mm	23 mm					30 s		250 °C (482 °F)	23 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.