Ball Field Programmable Gate Arrays (FPGA) 2,400+

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Part	Manufacturer	Programmable IC Type	Grading Of Temperature	Form Of Terminal	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Logic Cells	Surface Mount	Maximum Supply Voltage	No. of CLBs	Technology Used	No. of Inputs	Nominal Supply Voltage (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Supply Voltage	Pitch Of Terminal	Maximum Operating Temperature	Maximum Combinatorial Delay of a CLB	Organization	Minimum Operating Temperature	Finishing Of Terminal Used	Position Of Terminal	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	No. of Outputs	Peak Reflow Temperature (C)	Length
XC7K410T-L2FFG900E	Xilinx	FPGA		Ball	900	BGA	Square	Plastic/Epoxy	406720	Yes	.93 V	31775	CMOS	500	.9	0.9,1.8,3.3 V	Grid Array	BGA900,30X30,40	Field Programmable Gate Arrays	.87 V	1 mm		0.91 ns	31775 CLBS		Tin Silver Copper	Bottom	S-PBGA-B900	4	3.35 mm	31 mm	No	Also Operates at 1 V supply	e1		30 s	500	245 °C (473 °F)	31 mm
XC7K70T-2FBG676I	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	65600	Yes	1.03 V	5125	CMOS	300	1	1,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.97 V	1 mm		0.61 ns	5125 CLBS		Tin Silver Copper	Bottom	S-PBGA-B676	4	2.54 mm	27 mm	No		e1	1286 MHz	30 s	300	250 °C (482 °F)	27 mm
XC7K70T-3FBG676E	Xilinx	FPGA		Ball	676	BGA	Square	Plastic/Epoxy	65600	Yes	1.03 V	5125	CMOS	300	1	1,1.8,3.3 V	Grid Array	BGA676,26X26,40	Field Programmable Gate Arrays	.97 V	1 mm		0.58 ns	5125 CLBS		Tin Silver Copper	Bottom	S-PBGA-B676	4	2.54 mm	27 mm	No		e1	1412 MHz	30 s	300	250 °C (482 °F)	27 mm
XC7S6-L1CSGA225I	Xilinx	FPGA	Industrial	Ball	225	LFBGA	Square	Plastic/Epoxy	6000	Yes	.98 V	469		100	0.95		Grid Array, Low Profile, Fine Pitch	BGA225,15X15,32		.92 V	.8 mm	100 °C (212 °F)	1.27 ns	469 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B225		1.4 mm	13 mm			e1	1098 MHz		100		13 mm
XC7V2000T-1FHG1761C	Xilinx	FPGA	Other	Ball	1761	BGA	Square	Plastic/Epoxy	1954560	Yes	1.03 V	152700	CMOS	850	1	0.9,1.8 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.97 V	1 mm	85 °C (185 °F)	0.74 ns	152700 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1761		3.75 mm	45 mm	No		e1	1818 MHz		850		45 mm
XC7V2000T-1FHG1761I	Xilinx	FPGA		Ball	1761	BGA	Square	Plastic/Epoxy	1954560	Yes	1.03 V	152700	CMOS	850	1	1,1.8 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.74 ns	152700 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1761		3.75 mm	45 mm	No		e1	1818 MHz		850		45 mm
XC7V2000T-G2FLG1925E	Xilinx	FPGA		Ball	1925	BGA	Square	Plastic/Epoxy	1954560	Yes	1.03 V	152700	CMOS	1200	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.61 ns	152700 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1925		3.75 mm	45 mm	No		e1	1818 MHz		1200		45 mm
XC7V2000T-L2FHG1761E	Xilinx	FPGA		Ball	1761	BGA	Square	Plastic/Epoxy	1954560	Yes	1.03 V	152700	CMOS	850	1	1,1.8 V	Grid Array	BGA1760,42X42,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.61 ns	152700 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1761		3.75 mm	45 mm	No		e1	1818 MHz		850		45 mm
XC7V2000T-L2FLG1925E	Xilinx	FPGA		Ball	1925	BGA	Square	Plastic/Epoxy	1954560	Yes	1.03 V	152700	CMOS	1200	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.61 ns	152700 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1925		3.75 mm	45 mm	No		e1	1818 MHz		1200		45 mm
XC7VX690T-1FF1930C	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	693120	Yes			CMOS	1000		0.9,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1924				No		e0	1818 MHz		1000
XC7VX690T-2FF1930I	Xilinx	FPGA		Ball	1924	BGA	Square	Plastic/Epoxy	693120	Yes			CMOS	1000		1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays		1 mm					Tin/Lead	Bottom	S-PBGA-B1924				No		e0	1818 MHz		1000
XC7VX690T-2FFG1926I	Xilinx	FPGA		Ball	1926	BGA	Square	Plastic/Epoxy	693120	Yes	1.03 V	54150	CMOS	720	1	1,1.8 V	Grid Array	BGA1924,44X44,40	Field Programmable Gate Arrays	.97 V	1 mm	100 °C (212 °F)	0.61 ns	54150 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B1926	4	3.65 mm	45 mm	No		e1	1818 MHz	30 s	720	245 °C (473 °F)	45 mm
XCKU035-1SFVA784I	Xilinx	FPGA	Industrial	Ball	784	FBGA	Square	Plastic/Epoxy	444343	Yes	.979 V	25391		520	0.95	0.95 V	Grid Array, Fine Pitch	BGA784,28X28,32	Field Programmable Gate Arrays	.922 V	.8 mm	100 °C (212 °F)		25391 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B784		3.52 mm	23 mm	No		e1			520		23 mm
XCKU060-2FFVA1517C	Xilinx	FPGA		Ball	1517	BGA	Square	Plastic/Epoxy	725550	Yes	.979 V	41460		624	0.95		Grid Array	BGA1517,39X39,40		.922 V	1 mm	85 °C (185 °F)		41460 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		3.51 mm	40 mm						624		40 mm
XCKU15P-1FFVE1517I	Xilinx	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy	1143450	Yes	.876 V	65340		668	0.85		Grid Array	BGA1517,39X39,40		.825 V	1 mm	100 °C (212 °F)		65340 CLBs	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1		30 s	668	245 °C (473 °F)	40 mm
XCKU15P-2FFVA1156E	Xilinx	FPGA	Other	Ball	1156	BGA	Square	Plastic/Epoxy	1143450	Yes	.876 V	65340		668	0.85		Grid Array	BGA1156,34X34,40		.825 V	1 mm	100 °C (212 °F)		65340 CLBs	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.71 mm	35 mm			e1			668		35 mm
XCKU15P-2FFVE1517E	Xilinx	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	1143450	Yes	.876 V	65340		668	0.85		Grid Array	BGA1517,39X39,40		.825 V	1 mm	100 °C (212 °F)		65340 CLBs	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	4	3.51 mm	40 mm			e1		30 s	668	245 °C (473 °F)	40 mm
XCKU15P-L1FFVA1156I	Xilinx	FPGA	Industrial	Ball	1156	BGA	Square	Plastic/Epoxy	1143450	Yes	.742 V	65340		668	.72		Grid Array	BGA1156,34X34,40		.698 V	1 mm	100 °C (212 °F)		65340 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B1156	4	3.51 mm	35 mm		It also Operates at 0.85 V	e1			668		35 mm
XCKU3P-2FFVD900I	Xilinx	FPGA	Industrial	Ball	900	BGA	Square	Plastic/Epoxy	355950	Yes	.876 V	20340		304	0.85		Grid Array	BGA900,30X30,40		.825 V	1 mm	100 °C (212 °F)		20340 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm			e1		30 s	304	245 °C (473 °F)	31 mm
XCKU3P-2SFVB784E	Xilinx	FPGA	Other	Ball	784	FBGA	Square	Plastic/Epoxy	355950	Yes	.876 V	20340		304	0.85		Grid Array, Fine Pitch	BGA784,28X28,32		.825 V	.8 mm	100 °C (212 °F)		20340 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B784	4	3.32 mm	23 mm			e1		30 s	304	250 °C (482 °F)	23 mm
XCKU9P-1FFVE900E	Xilinx	FPGA	Other	Ball	900	BGA	Square	Plastic/Epoxy	599550	Yes	.876 V	34260		304	0.85		Grid Array	BGA900,30X30,40		.825 V	1 mm	100 °C (212 °F)		34260 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B900	4	3.42 mm	31 mm			e1		30 s	304	245 °C (473 °F)	31 mm
XCVU9P-1FLGB2104I	Xilinx	FPGA	Industrial	Ball	2104	BGA	Square	Plastic/Epoxy	2586150	Yes	.876 V	147780		832	0.85		Grid Array	BGA2104,46X46,40		.825 V	1 mm	100 °C (212 °F)		147780 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B2104		4.32 mm	47.5 mm						832		47.5 mm
XCVU9P-3FLGC2104E	Xilinx	FPGA	Other	Ball	2104	BGA	Square	Plastic/Epoxy	2586150	Yes	.927 V	147780		832	0.9		Grid Array	BGA2104,46X46,40		.873 V	1 mm	100 °C (212 °F)		147780 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B2104		4.32 mm	47.5 mm						832		47.5 mm
XQ7K325T-1RF900M	Xilinx	FPGA	Military	Ball	900	BGA	Square	Plastic/Epoxy	326080	Yes	1.03 V	25475	HKMG	500	1		Grid Array			.97 V	1 mm	125 °C (257 °F)	0.74 ns	25475 CLBS	-55 °C (-67 °F)	Tin Lead	Bottom	S-PBGA-B900		3.44 mm	31 mm			e0			500		31 mm
10AX022C4U19E3SG	Intel	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy	220000	Yes	.93 V	8033	TSMC	240	0.9	0.9 V	Grid Array, Fine Pitch	BGA484,22X22,32	Field Programmable Gate Arrays	.87 V	.8 mm	100 °C (212 °F)		8033 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B484		3.25 mm	19 mm	No					240		19 mm
10AX032H2F35E1HG	Intel	FPGA		Ball	1152	BGA	Square	Plastic/Epoxy	320000	Yes		11990	TSMC	384			Grid Array	BGA1152,34X34,40			1 mm	100 °C (212 °F)		11990 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1152		3.35 mm	35 mm						384		35 mm
10AX115N1F40E1SG	Intel	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	1150000	Yes	.93 V	42720	TSMC	600	0.9	0.9 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	.87 V	1 mm	100 °C (212 °F)		42720 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B1517		3.35 mm	40 mm	No	Also Operates at 0.95 V nominal supply				600		40 mm
10AX115N4F40I3SGES	Intel	FPGA	Industrial	Ball	1517	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1517		3.5 mm	40 mm								40 mm
10AX115N4F45I3SGES	Intel	FPGA	Industrial	Ball	1932	BGA	Square	Plastic/Epoxy		Yes	.93 V				.9		Grid Array			.87 V	1 mm	100 °C (212 °F)			-40 °C (-40 °F)		Bottom	S-PBGA-B1932		3.65 mm	45 mm								45 mm
10CL010YM164C8G	Intel	FPGA	Other	Ball	164	TFBGA	Square	Plastic/Epoxy		Yes	1.25 V	645			1.2		Grid Array, Thin Profile, Fine Pitch			1.15 V	.5 mm	85 °C (185 °F)		645 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B164		1.2 mm	8 mm								8 mm
10CL016YU256I7G	Intel	FPGA	Industrial	Ball	256	LFBGA	Square	Plastic/Epoxy		Yes	1.25 V	963			1.2		Grid Array, Low Profile, Fine Pitch			1.15 V	.8 mm	100 °C (212 °F)		963 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B256		1.5 mm	14 mm								14 mm
10CL016ZU484I8G	Intel	FPGA	Industrial	Ball	484	FBGA	Square	Plastic/Epoxy	15408	Yes	1.03 V	963		340	1		Grid Array, Fine Pitch	BGA484,22X22,32		.97 V	.8 mm	100 °C (212 °F)		963 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.05 mm	19 mm		-40 to 125 °C range is available as extended industrial				340		19 mm
10CL040YF484C6G	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy		Yes	1.25 V	2475			1.2		Grid Array			1.15 V	1 mm	85 °C (185 °F)		2475 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B484		2.4 mm	23 mm								23 mm
10CL040YU484C6G	Intel	FPGA	Other	Ball	484	FBGA	Square	Plastic/Epoxy		Yes	1.25 V	2475			1.2		Grid Array, Fine Pitch			1.15 V	.8 mm	85 °C (185 °F)		2475 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2.05 mm	19 mm			e1		30 s		260 °C (500 °F)	19 mm
10CL040ZF484I8G	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	39600	Yes	1.03 V	2475		325	1		Grid Array	BGA484,22X22,40		.97 V	1 mm	100 °C (212 °F)		2475 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B484		2.4 mm	23 mm		-40 to 125 °C range is available as extended industrial				325		23 mm
10CX085YF672E5G	Intel	FPGA	Other	Ball	672	BGA	Square	Plastic/Epoxy	85000	Yes	.93 V	31000	TSMC	216	.9		Grid Array			.87 V		100 °C (212 °F)		31000 CLBS	0 °C (32 °F)		Bottom	S-PBGA-B672									216
10CX085YF672I6G	Intel	FPGA	Industrial	Ball	672	BGA	Square	Plastic/Epoxy	85000	Yes	.93 V	31000	TSMC	216	.9		Grid Array			.87 V		100 °C (212 °F)		31000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B672									216
10M04DAF256C8G	Intel	FPGA	Other	Ball	256	BGA	Square	Plastic/Epoxy	4000	Yes	1.25 V	250		246	1.2	1.2 V	Grid Array	BGA256,16X16,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		250 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256	3	1.55 mm	17 mm	No		e1			246		17 mm
10M08DAF484I7G	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	8000	Yes	1.25 V	500		250	1.2	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	100 °C (212 °F)		500 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No		e1			250		23 mm
10M16DAF256I6G	Intel	FPGA	Industrial	Ball	256	BGA	Square	Plastic/Epoxy	16000	Yes	1.25 V	1000		320	1.2		Grid Array	BGA256,16X16,40		1.15 V	1 mm	100 °C (212 °F)		1000 CLBS	-40 °C (-40 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B256		1.55 mm	17 mm			e1			320		17 mm
10M16SCU324I7G	Intel	FPGA	Industrial	Ball	324	LFBGA	Square	Plastic/Epoxy	16000	Yes	3.15 V	1000		320	3		Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32		2.85 V	.8 mm	100 °C (212 °F)		1000 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B324		1.55 mm	15 mm		Also Operates at 3.3 V nominal supply				320		15 mm
10M25DAF484I6G	Intel	FPGA	Industrial	Ball	484	BGA	Square	Plastic/Epoxy	25000	Yes	1.25 V	1563		360	1.2		Grid Array	BGA484,22X22,40		1.15 V	1 mm	100 °C (212 °F)		1563 CLBS	-40 °C (-40 °F)	Tin Silver Copper	Bottom	S-PBGA-B484		2 mm	23 mm			e1			360		23 mm
10M25DCF484C7G	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	25000	Yes	1.25 V	1563		360	1.2	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		1563 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No		e1			360		23 mm
10M50DCF484C7G	Intel	FPGA	Other	Ball	484	BGA	Square	Plastic/Epoxy	50000	Yes	1.25 V	3125		500	1.2	1.2 V	Grid Array	BGA484,22X22,40	Field Programmable Gate Arrays	1.15 V	1 mm	85 °C (185 °F)		3125 CLBS	0 °C (32 °F)	Tin/Silver/Copper	Bottom	S-PBGA-B484	3	2 mm	23 mm	No		e1			500		23 mm
1SG280HN1F43I2LG	Intel	FPGA		Ball	1760	BGA	Square	Plastic/Epoxy	2753000	Yes	.88 V	344125		704	0.85		Grid Array	BGA1760,42X42,40		.82 V	1 mm	100 °C (212 °F)		344125 CLBS	-40 °C (-40 °F)		Bottom	S-PBGA-B1760		3.881 mm	42.5 mm						704		42.5 mm
5AGXFB7K4F40C4N	Intel	FPGA	Other	Ball	1517	BGA	Square	Plastic/Epoxy	504000	Yes	1.13 V	19024		704	1.1	1.1,1.2/3.3,2.5 V	Grid Array	BGA1517,39X39,40	Field Programmable Gate Arrays	1.07 V	1 mm	85 °C (185 °F)		19024 CLBS	0 °C (32 °F)	Tin Silver Copper	Bottom	S-PBGA-B1517	3	2.7 mm	40 mm	No		e1	670 MHz		704		40 mm
5CEBA2U15C6N	Intel	FPGA	Other	Ball	324	LFBGA	Square	Plastic/Epoxy	25000	Yes	1.13 V		CMOS	176	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Low Profile, Fine Pitch	BGA324,18X18,32	Field Programmable Gate Arrays	1.07 V	.8 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B324		1.5 mm	15 mm	No					176		15 mm
5CEFA2M13C8N	Intel	FPGA	Other	Ball	383	TFBGA	Square	Plastic/Epoxy	25000	Yes	1.13 V		CMOS	223	1.1	1.1,1.2/3.3,2.5 V	Grid Array, Thin Profile, Fine Pitch	BGA383,25X25,20	Field Programmable Gate Arrays	1.07 V	.5 mm	85 °C (185 °F)			0 °C (32 °F)		Bottom	S-PBGA-B383		1.1 mm	13 mm	No					223		13 mm

Field Programmable Gate Arrays (FPGA)

Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.

FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.

FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.