Xilinx - XQ7K325T-1RF900M

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XQ7K325T-1RF900M by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XQ7K325T-1RF900M
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: MILITARY; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;
Datasheet XQ7K325T-1RF900M Datasheet
In Stock318
NAME DESCRIPTION
Minimum Supply Voltage: .97 V
Package Body Material: Plastic/Epoxy
Organization: 25475 CLBS
Maximum Combinatorial Delay of a CLB: 0.74 ns
Maximum Seated Height: 3.44 mm
No. of Inputs: 500
Surface Mount: Yes
No. of Outputs: 500
Position Of Terminal: Bottom
No. of Terminals: 900
Package Style (Meter): Grid Array
JESD-30 Code: S-PBGA-B900
Package Shape: Square
Maximum Operating Temperature: 125 °C (257 °F)
Package Code: BGA
Width: 31 mm
Grading Of Temperature: Military
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.03 V
Nominal Supply Voltage (V): 1
Technology Used: HKMG
No. of Logic Cells: 326080
No. of CLBs: 25475
JESD-609 Code: e0
Minimum Operating Temperature: -55 °C (-67 °F)
Finishing Of Terminal Used: Tin Lead
Length: 31 mm
Form Of Terminal: Ball
Pitch Of Terminal: 1 mm
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